Passive device assembly for accurate ground plane control is disclosed. A passive device assembly includes a device substrate conductively coupled to a ground plane separation control substrate. A passive device disposed on a lower surface of the device substrate is separated from an embedded ground plane mounted on a lower surface of the ground plane separation control substrate by a separation distance. The separation distance is accurately controlled to minimize undesirable interference that may occur to the passive device. The separation distance is provided inside the passive device assembly. Conductive mounting pads are disposed on the lower surface of the ground plane separation control substrate to support accurate alignment of the passive device assembly on a circuit board. By providing sufficient separation distance inside the passive device assembly, the passive device assembly can be precisely mounted onto any circuit board regardless of specific design and layout of the circuit board.

A method and circuit board arrangement for an intrinsically safe portable device includes two or more circuit boards having a frame structure that forms a contiguous boundary around a space between the circuit boards. In the space there are circuit components mounted on both circuit boards, and a connector that connect the two circuit boards. An encapsulant material fills the space bounded by the frame structure between the circuit boards to exclude airborne material from coming into contact with the encapsulated circuit components.

Passive device assembly for accurate ground plane control is disclosed. A passive device assembly includes a device substrate conductively coupled to a ground plane separation control substrate. A passive device disposed on a lower surface of the device substrate is separated from an embedded ground plane mounted on a lower surface of the ground plane separation control substrate by a separation distance. The separation distance is accurately controlled to minimize undesirable interference that may occur to the passive device. The separation distance is provided inside the passive device assembly. Conductive mounting pads are disposed on the lower surface of the ground plane separation control substrate to support accurate alignment of the passive device assembly on a circuit board. By providing sufficient separation distance inside the passive device assembly, the passive device assembly can be precisely mounted onto any circuit board regardless of specific design and layout of the circuit board.

A circuit board structure includes a first circuit board, a second circuit board and a plurality of first connection portions. The first circuit board has a first opening, and the second circuit board is disposed inside the first opening of the first circuit board. The first circuit board and the second circuit board are electrically independent from each other. The first connection portions are connected to the first circuit board and the second circuit board.

A printable electronic component includes a component substrate and a circuit disposed in or on the component substrate. One or more electrically conductive connection posts protrude from the component substrate. One or more electrically conductive component contact pads are exposed on or over the component substrate on a side of the component substrate opposite the one or more connection posts. The one or more component contact pads and the one or more electrically conductive connection posts are both electrically connected to the circuit. The components can be printed onto a destination substrate and electrically connected to contact pads on the destination substrate through the connection posts. The components can also be printed onto other components and electrically connected through the connection posts and component contact pads to form a three-dimensional electronic structure.

An integrated power module packaging structure includes a housing, a first circuit board, a second circuit board, a first pin, a second pin and a third pin. The housing has a cavity. The second circuit board is located above the first circuit board, and both them are received in the cavity. A switching module is disposed on the first circuit board. A high side current/voltage detecting device and a driving device are disposed on the second circuit board. The first pin, the second pin and the third pin are disposed between the first circuit board and the second circuit board. The first pin connects the high side current/voltage detecting device and the switching module in series. The second pin connects the switching module. The driving device controls the switching module through the third pin.

The circuit board assembly includes a first circuit board having a first plurality of electronic components attached to a major surface of the first circuit board. The first plurality of electronic components is electrically interconnected to a first plurality of conductive pads defined on the major surface of the first circuit board. A second circuit board has a second plurality of electronic components attached to a first major surface of the second circuit board. The second plurality of electronic components is electrically interconnected to a second plurality of conductive pads defined on a second major surface of the second circuit board. The first and second circuit board are attached by coupling the first and second plurality of conductive pads. A portion of the first plurality of electronic components on the first circuit board are disposed within a cavity defined by the second major surface of the second circuit board.

A printed circuit board having two completed printed circuit board elements which consists of a plurality of interconnected plies or layers, wherein at least one printed circuit board element has a cutout or depression containing the component to be integrated on one of the printed circuit board elements or in the cutout of the at least one printed circuit board element, and the printed circuit board elements are connected with the component being accommodated in the cutout, as a result of which it is possible to obtain secure and reliable accommodation of the component in the printed circuit board. Furthermore, a printed circuit board of this type also contains an electronic component integrated therein.

An integrated power module packaging structure includes a housing, a first circuit board, a second circuit board, a first pin, a second pin and a third pin. The housing has a cavity. The second circuit board is located above the first circuit board, and both them are received in the cavity. A switching module is disposed on the first circuit board. A high side current/voltage detecting device and a driving device are disposed on the second circuit board. The first pin, the second pin and the third pin are disposed between the first circuit board and the second circuit board. The first pin connects the high side current/voltage detecting device and the switching module in series. The second pin connects the switching module. The driving device controls the switching module through the third pin.

An electrical connection device includes a mother board and a daughter board. The mother board includes a first board body with at least one cavity and a first electrical contact printed on the first board body. The daughter board includes a second board body and a second electrical contact printed on the second board body. At least one of the daughter board and the mother board includes at least one contour feature integrally formed with at least one of the first board body and the second board body. When the second board body is inserted into the at least one cavity of the first board body, the second electrical contact is electrically connected to the first electrical contact, and the daughter board is positioned in the mother board through the at least one contour feature.