The circuit board assembly includes a first circuit board having a first plurality of electronic components attached to a major surface of the first circuit board. The first plurality of electronic components is electrically interconnected to a first plurality of conductive pads defined on the major surface of the first circuit board. A second circuit board has a second plurality of electronic components attached to a first major surface of the second circuit board. The second plurality of electronic components is electrically interconnected to a second plurality of conductive pads defined on a second major surface of the second circuit board. The first and second circuit board are attached by coupling the first and second plurality of conductive pads. A portion of the first plurality of electronic components on the first circuit board are disposed within a cavity defined by the second major surface of the second circuit board.

An electronic device (1) suitable for use on board a spacecraft, including a motherboard (2) electrically connected to daughterboards (3a, 3b, 3c), the motherboard and the daughterboards each include a support plate (4a, 4b, 4c, 5) in order to form a printed circuit board, each support plate extending in a respective main plane, wherein each daughterboard includes a first electrical connector (6a, 6b, 6c, 6d) fixed to its support plate and the motherboard includes a corresponding number of second connectors (7a, 7b, 7c, 7d) fixed to the support plate of the motherboard, each first electrical connector engages with one of the second connectors, the first electrical connector of each daughterboard is arranged on a portion of the support plate forming a tab (8a, 8b, 8c, 8d) configured for deflection relative to the main plane of the printed circuit board.

A circuit board assembly (1), comprising a first circuit board (10) and a second circuit board (20) which are electrically connected with each other, and a monolithic substrate (30) configured for supporting a power component and comprising a first contact surface (31) that is fixedly connected to and forms a thermal contact with the second circuit board (20), the circuit board assembly being characterized in that, the substrate (30) further comprises a second contact surface (32) that is fixedly connected to the first circuit board (10) and forms a thermal contact with the first circuit board (10) so that the substrate functions as an extension of the first circuit board to support the second circuit board. A radio unit comprising a circuit board assembly (1) is also disclosed.

This disclosure includes multiple assemblies, sub-assemblies, etc., as well as one or more methods of fabricating same. For example, a first assembly includes a first circuit board. The first circuit board further includes first connector elements disposed on a first edge of the first circuit board and second connector elements disposed on a second edge of the first circuit board. The first edge may be disposed substantially opposite the second edge on the first circuit board. The apparatus may further include first circuitry affixed to the first circuit board. The first edge of the first circuit board aligns with a first axial end of the first circuitry and the second edge of the first circuit board aligns with a second axial end of the first circuitry. The first assembly is used to fabricate a second assembly.

This disclosure discloses an expansion card module, including an expansion card, a circuit board, a storage unit, and a heat sink. The circuit board is disposed next to the expansion card and includes a first connector and a second connector. The storage unit is pluggably disposed on the first connector of the circuit board. The heat sink is located next to and thermally coupled to the expansion card and storage unit. The storage unit of the expansion card module in this disclosure transmits signals through the circuit board. Since there is no need to transmit signals through the expansion card, the storage unit and the motherboard may have better compatibility. In addition, the storage unit and the expansion card dissipate heat together through the heat sink, thus having a good heat dissipation effect.

An electronic circuit board includes a plurality of through hole units each having a combination including a pair of signal through holes for differential signals, ground through holes disposed on a straight line connecting the pair of signal through holes, guard through holes, and an anti-pad disposed to surround the pair of signal through holes. The plurality of through hole units are disposed side by side in an X-axis direction and a Y-axis direction while arrangement positions in the X-axis direction are alternately shifted in the Y-axis direction. The guard through holes are disposed on an equidistant straight line positioned at an equal distance from the pair of signal through holes so as to sandwich the pair of signal through holes.