A printed wiring board includes a main substrate and a rising substrate. A support portion of the rising substrate is inserted into a slit in the main substrate. In a direction in which a plurality of first electrodes are aligned, a width of each of the plurality of first electrodes is larger than a width of each of a plurality of second electrodes, and the width of each of the plurality of second electrodes is arranged to fit within the width of each of the plurality of first electrodes.

A bi-directional optical sub assembly connecting structure which is disclosed includes a first connecting plate, a second connecting plate, a connector, a first circuit, and a second circuit. The first connecting plate includes a plurality of first contacts for electrically connecting to a first transmitting end. The second connecting plate connects with the first connecting plate and includes a plurality of second contacts for electrically connecting to a second transmitting end. The connector connects with the first connecting plate for electrically connecting to a printed circuit board. The first circuit is located on the first connecting plate and electrically connected to the plurality of first contacts and the connector. The second circuit is located on the first connecting plate and the second connecting plate and electrically connected to the plurality of second contacts and the connector.

A field device for process automation in industrial or private environments, comprising an electronic circuit for controlling the field device, wherein the electronic circuit includes a first, a second and a third circuit board. The first circuit board is connected to and attached to the second circuit board and/or to the third circuit board by way of an electrical connector, wherein the second circuit board is located above the third circuit board.

A three-dimensional printed wiring board includes a main substrate and a standing substrate. First electrodes on the main substrate and second electrodes on the standing substrate are joined with solder. The main substrate includes a first main surface having a slit. The standing substrate includes a second main surface and includes a support portion inserted in the slit. Each of the slit and the support portion is divided into a plurality of parts with respect to the extending direction. A restraint point at which the slit and the standing substrate are in contact with each other is located on any of end portions of a pair of slits adjacent to each other among a row of a plurality of slits arranged in the extending direction.

A circuit card assembly for a communication system includes a PCB having a slot receiving a second PCB of a second circuit card assembly in a board loading direction. An electrical connector is mounted to the PCB having a receptacle housing and a mating housing movable within the receptacle housing in a connector loading direction along a connector loading axis parallel to the board loading direction. The mating housing is movable in the receptacle housing in a connector mating direction along a connector mating axis perpendicular to the connector loading axis. Contacts of the electrical connector are mated with contacts of the second electrical connector in a contact mating direction parallel to the connector mating axis.

A communication system includes first and second circuit card assemblies mated such that first and second PCBs move relative to each other along a board mating axis parallel to a slot in the first PCB with the first PCB oriented perpendicular to the second PCB and with first and second mating ends of first and second electrical connectors oriented parallel to the board mating axis. The first and second circuit card assemblies are mated such that the first electrical connector and the second electrical connector move relative to each other along a connector mating axis perpendicular to the board mating axis. First mating interfaces of first contacts are mated to second mating interfaces of second contacts in a contact mating direction non-parallel to the board mating axis and non-parallel to the connector mating axis.

An electric connector comprises a contact, a base assembly, a pair of first circuit board sections, and a plurality of electric components. The base assembly has a connector face on a first side and an interior side opposite to the connector face. The contact is disposed on the connector face. The pair of first circuit board sections are disposed on the interior side and extend away from the base assembly. The pair of first circuit board sections face each other. At least one electric component is disposed on each of the first circuit board sections.

A control module attached to a lighting fixture and having a front cover portion may comprise one or more sensors, such as a daylight and/or occupancy sensor, for sensing information through the front cover portion. The control module may have a main printed circuit board (PCB) that extends from a front side to a rear side of the control module, and a sensor PCB perpendicular to the main PCB to enable at least one sensor attached to the sensor PCB to face the front side of the control module. The main PCB may comprise a wireless communication circuit and an antenna for communicating radio frequency (RF) signals, wherein at least a portion of the antenna is located within a plastic lip of the front cover portion of the control module. The control module may further have a conductive enclosure to reduce radio-frequency interference noise from coupling into the antenna.

A rectification module includes a transformer, a connecting unit and a rectification unit. The transformer includes a first lateral region, a second lateral region and at least one secondary winding assembly. The second lateral region is located beside the first lateral region. The secondary winding assembly includes plural outlet ends. The plural outlet ends are arranged near the first lateral region. The connecting unit is located at the first lateral region, and includes plural conducting plates. Each of the conducting plates includes at least one opening and at least one connecting structure. The conducting plates are partially or completely stacked on each other. The outlet ends are accommodated within the corresponding openings. The conducting plates are fixed on the first lateral region. The connecting structures face the second lateral region. The rectification unit includes a circuit board and plural rectifier components.

Methods and apparatus relating to integrating System in Package (SiP) with Input/Output (IO) board for platform miniaturization are described. In an embodiment, a SiP board includes a plurality of logic components. An IO board is coupled to the SiP board via a grid array. The plurality of logic components is provided on both sides of the SiP board and one or more of the plurality of logic components are to positioned in an opening in the IO board. Other embodiments are also disclosed and claimed.