A display device includes a display substrate having a fan-out area, and a plurality of driving integrated circuits are arranged to reduce a signal delay variation. A printed circuit board (PCB) is connected to the fan-out area, and a driving integrated circuit (IC) is disposed on the PCB in a second direction. A first circuit board wiring is disposed on the PCB and connected to the driving IC. A second circuit board wiring is disposed in the second direction and connected to the driving IC. A first fan-out wiring is disposed on the fan-out area and connected to the first circuit board wiring, and a second fan-out wiring is disposed in the second direction from the fan-out area and connected to the second circuit board wiring. A sum of the length of the wiring of the first circuit board and the second circuit board may be substantially the same.

A modified socket mechanism comprises a printed circuit board and a connector component located on a first face of the printed circuit board. The modified socket mechanism may comprise a first region of electrical contacts located on the first face. The first region of electrical contacts may be designed to interface with a processor module. The modified socket mechanism may also comprise a second region of electrical contacts located on a second face of the printed circuit board. The second region of electrical contacts may be designed to interface with a motherboard. The modified socket mechanism may also comprise a first electrical connection between the connector component and the first region of electrical contacts through the printed circuit board. Finally, the modified socket mechanism may also comprise a second electrical connection between the first region of electrical contacts and the second region of electrical contacts through the printed circuit board.

A LIDAR sensor assembly includes a main board, a board-to-board connector assembly, and a sensor component board. The main board has an edge. The board-to-board connector assembly is located on the main board and includes a housing. The housing includes a feature that aligns an angular orientation of the housing relative to the main board by engagement of the feature of the housing with the edge of the main board. The board-to-board connector also includes connector pins that are connected to the main board and are disposed within the housing. The sensor component board is connected to the main board by the connector pins of the board-to-board connector assembly to allow pivoting of the sensor component board relative to the main board over a limited angular range.

A wiring board includes an insulating substrate, at least one external electrode disposed on a first surface of the insulating substrate, and wiring that is disposed in the insulating substrate and that is electrically connected to the at least one external electrode. The wiring includes a portion where an extension direction of the wiring is inclined relative to the first surface of the insulating substrate.

A printed wiring-board island relieves added complexity to a printed circuit board. The printed wiring-board island creates an island form factor in the printed circuit board. Coupling of a semiconductive device package to the printed wiring-board island includes a ball-rid array. The ball-grid array can at least partially penetrate the printed wiring-board island.

An interposer includes an interposer body; first and second lower patterns spaced apart from each other on a lower surface of the interposer body; and first and second upper patterns spaced apart from each other on an upper surface of the interposer body. The first and second upper patterns include first and second shape-securing layers spaced apart from each other on the upper surface of the interposer body, and first and second acoustic noise reduction layers disposed on the first and second shape-securing layers, respectively. An electronic component includes a capacitor and the interposer.

A flexible multilayer construction (1000) for mounting a plurality of light emitting semiconductor devices (LESDs 100, 110, 120) includes a flexible dielectric substrate (200) comprising top (210) and bottom (220) major surfaces, and pluralities of corresponding electrically conductive top (300, 310, 320, 330) and bottom (500, 510, 520, 530) pads disposed on the top and bottom major surfaces, respectively. An electrically conductive via (400, 410, 420, 430) connects each pair of corresponding top and bottom pads, a side of each top pad partially overlapping a side of the corresponding bottom pad and a side of the substrate, such that in a plan view, each top pad fully overlaps the corresponding bottom pad.

To provide a wiring substrate, an electronic device, and an electronic module the size of which can be easily reduced and the strength of which can be maintained. A wiring substrate includes an insulation substrate and an electrical wiring structure. The insulation substrate includes a recess section in one surface. A frame portion of the insulation substrate that forms a side surface which connects an opened surface and a bottom surface of the recess section to each other includes a first conductive portion having a plate shape in the frame portion.

A multilayer substrate includes a base including insulating layers stacked on one another, a first principal surface, and a second principal surface, a heat transfer member extending through a first insulating layer nearest to the first principal surface, a second coefficient of thermal conductivity of a material of the heat transfer member is higher than a first coefficient of thermal conductivity of a material of the insulating layers, a first metal film adhered to the first principal surface, the first metal film overlapping the heat transfer member when viewed from the layer stacking direction, and a first joining member disposed between the heat transfer member and the first metal film and being made of a material with a coefficient of thermal conductivity which is higher than the first coefficient of thermal conductivity of the material of the insulating layers.

According to one embodiment, a liquid crystal display device includes a liquid crystal panel and a backlight device. The backlight device includes a case with a bottom plate and a side plate, a light guide on the bottom plate, and a light source device. The light source device includes a wiring substrate and a light-emitting element on the wiring substrate. The wiring substrate includes a mounting portion on which the light-emitting element is mounted, a connection wiring portion on a back surface side of the bottom plate, and a joint portion which joints the mounting portion and the connection wiring portion together. The joint portion extends from an inside to an outside of the case through a gap between the side plate of the case and the liquid crystal panel.