An electronic component includes: a multilayer ceramic capacitor including a capacitor body and a pair of external electrodes, and an interposer including an interposer body having grooves and a pair of external terminals. Each of the external terminals includes a bonding portion, a mounting portion and a connection portion; and L=|AA|/2 in which A is a distance from one end portion of the interposer in a length direction to one end portion of the multilayer ceramic capacitor in the length direction, A is a distance from the other end portion of the interposer in the length direction to the other end portion of the multilayer ceramic capacitor in the length direction, and L is an offset between the multilayer ceramic capacitor and the interposer in the length direction, and L/L0.100 in which L is a length of the multilayer ceramic capacitor.

A composite electronic component includes a composite body in which a multilayer ceramic capacitor and a ceramic chip are coupled to each other, the multilayer ceramic capacitor including a first ceramic body in which a plurality of dielectric layers and internal electrodes disposed to face each other with respective dielectric layers interposed therebetween are stacked, and first and second external electrodes disposed on both end portions of the first ceramic body, and the ceramic chip being disposed on a lower portion of the multilayer ceramic capacitor and formed of a ceramic material having substantially no piezoelectric property, wherein a ratio (T/L) of thickness (T) of the ceramic chip to length (L) of the multilayer ceramic capacitor is selected to minimize vibration of the ceramic chip.

A display device including: a display module including a display panel for displaying an image and a circuit board connected to the display panel; a support plate disposed on a surface of the display module; and a conductive adhesive film disposed between the circuit board and the support plate, the conductive adhesive film including: a double-sided adhesive film fixed to a surface of the support plate and a surface of the circuit board; and a single-sided adhesive film fixed to one of the surface of the support plate and the surface of the circuit board.

An apparatus has a mother board with external connectors on a first side and flash memory connectors on a second side. Flash memory cards are connected to the flash memory connectors. Each flash memory card has flash memory and a flash memory controller. A thermal dissipation assembly is provided for each flash memory card. The thermal dissipation assembly includes a heat plate with a first end adjacent to the flash memory controller and a second end adjacent to the flash memory. A heat sink is attached to the flash memory cards at the second end. A polymer surrounds the external connectors and fully encloses remaining portions of the first side of the mother board, and fully encloses the flash memory cards, the thermal dissipation assembly and the heat sink.

A conductor path structure has a damping device for an oscillation-damped and/or vibration-damped (electronic, electromechanical, micromechanical) component. The conductor path structure has a first base body made of a carrier material including a connection area for receiving the component. The connection area is arranged separated from an area of the first base body surrounding it and is arranged oscillation-damped and/or vibration damped and co-acting with an intrinsic damping device of the conductor path structure. The conductor path structure includes a second base body arranged at a distance under the first base body, wherein above the second base body of the conductor path structure at least one adhesive layer of a damping material is provided. The intrinsic damping device is formed by said at least one adhesive layer arranged between the connection area of the first base body and the area of the second base body arranged below the connection area.

A display device includes a first panel including a pad side area at one side of the first panel, a first optically transparent adhesive member on one surface of the first panel, a printed circuit board including a first attachment portion attached to the one surface of the first panel at the pad side area, a window on the first optically transparent adhesive member, a second optically transparent adhesive member on the other surface of the first panel, and a second panel on the second optically transparent adhesive member opposite the first panel, wherein the pad side area has a connection area at which the printed circuit board is attached to the first panel, and at which an edge of the first optically transparent adhesive member extends beyond an edge of the second optically transparent adhesive member, and a non-connection area at which the printed circuit board is not attached.

A retainer device which connects to a printed circuit board (PCB) to provide added structural rigidity to a capacitor (or other electrical component) mounted to the PCB. The retainer device is able to provide increased durability of capacitor leads against vibrational fatigue. The retainer device is designed to add structural rigidity to single or multiple capacitors soldered to a PCB. The retainer device exerts a positive force against the capacitor, pressing the capacitor against the PCB. This in turn limits the fatigue deflection of the capacitor leads. The retainer device has at least one spring retention ring, where the spring retention ring is able to apply force to the capacitor, which aids in ensuring that the capacitor is flush to the surface of the PCB, which reduces the load on the leads of the capacitor.

An interposer may comprise a metal layer above a substrate. A dam or a plurality of dams may be formed above the metal layer. A dam surrounds an area of a size larger than a size of a die which may be connected to a contact pad above the metal layer within the area. A dam may comprise a conductive material, or a non-conductive material, or both. An underfill may be formed under the die, above the metal layer, and contained within the area surrounded by the dam, so that no underfill may overflow outside the area surrounded by the dam. Additional package may be placed above the die connected to the interposer to form a package-on-package structure.

Electronic modules having complex contact structures may be formed by encapsulating panels containing pluralities of electronic modules delineated by cut lines and having conductive interconnects buried within the panel along the cut lines. Holes defining contact regions along the electronic module sidewall may be cut into the panel along the cut lines to expose the buried interconnects. The panel may be metallized, e.g. by a series or processes including plating, on selected surfaces including in the holes to form the contacts and other metal structures followed by cutting the panel along the cut lines to singulate the individual electronic models. The contacts may be located in a conductive grove providing a castellated module.

An interposer may comprise a metal layer above a substrate. A dam or a plurality of dams may be formed above the metal layer. A dam surrounds an area of a size larger than a size of a die which may be connected to a contact pad above the metal layer within the area. A dam may comprise a conductive material, or a non-conductive material, or both. An underfill may be formed under the die, above the metal layer, and contained within the area surrounded by the dam, so that no underfill may overflow outside the area surrounded by the dam. Additional package may be placed above the die connected to the interposer to form a package-on-package structure.