A chip on film package includes: a flexible base film having a first surface and a second surface opposite to each other, and having a chip mounting region on the first surface; a plurality of wirings extending in a first direction toward the chip mounting region; a semiconductor chip mounted in the chip mounting region on the first surface of the base film and electrically connected to the wirings; a pair of first heat dissipation members on the first surface of the base film and spaced apart from the semiconductor chip, and extending in a second direction perpendicular to the first direction; and a second heat dissipation member on the first surface of the base film and covering the semiconductor chip and the pair of first heat dissipation members.

A display device includes a first substrate, a second substrate disposed on the first substrate, an image display layer disposed between the first substrate and the second substrate, a gate driver disposed at a first side surface of the first substrate, a data driver disposed at a second side surface of the first substrate, and conductive layers respectively disposed in recesses recessed from the first side surface of the first substrate. The gate driver is electrically connected to the conductive layers.

A flexible printed circuit board and a display device including the same are provided. An embodiment of a display device includes a display panel; a first circuit board attached to a first side of the display panel in a first direction; and a second circuit board attached to a second side of the first circuit board in the first direction, wherein the first circuit board includes a first bump area overlapping the display panel and a second bump area overlapping the second circuit board, the first bump area includes a plurality of first divided board portions arranged along a second direction crossing the first direction, and the first divided board portions of the plurality of first divided board portions partially overlap each other.

One embodiment provides an electronic circuit device, including: a first electronic circuit board; a second electronic circuit board separated from the first electronic circuit board; at least one capacitor including two electrodes, wherein one of the two electrodes is mounted to the first electronic circuit board and wherein the other of the two electrodes is mounted to the second electronic circuit board; and at least one connector electrically coupled to at least one of the first electronic circuit board and the second electronic circuit board. Other aspects are described and claimed.

A circuit board module includes a circuit board, a metal core printed circuit board, and a heating element. The circuit board includes a substrate, and a surface of the substrate has an assembling region. The metal core printed circuit board is on the assembling region and includes a first circuit layer and a second circuit layer. The first circuit layer and the second circuit layer are electrically connected to each other. The second circuit layer is electrically connected to the circuit board. The thermal conductivity of the metal core printed circuit board is greater than the thermal conductivity of the substrate. The heating element is on the metal core printed circuit board and is electrically connected to the first circuit layer. An electronic device having the circuit board module is also provided.

A twistable electronic device module including a twistable substrate, an electrode pattern layer, an insulating layer, a circuit layer, a plurality of circuit boards and a plurality of electronic devices is provided. The electrode pattern layer is disposed on the twistable substrate. The insulating layer is disposed on the electrode pattern layer. The edge of the insulating layer has an opening located at the edge of the twistable substrate and exposing a part of the electrode pattern layer. The circuit layer is disposed on the insulating layer and on the sidewall of the opening, and is connected with the electrode pattern layer. The plurality of circuit boards are disposed on the circuit layer, and each is electrically connected to the circuit layer. The plurality of electronic devices are disposed on the plurality of circuit boards, and each is electrically connected to a corresponding one of the plurality of circuit boards.

A Printed Circuit Board (PCB), a method for manufacturing a PCB, and a terminal are provided. The PCB includes: a PCB daughter board which is a Radio Frequency (RF) PCB; and a PCB mother board with a hollow slot, wherein the PCB daughter board is embedded in the hollow slot.

A backlight driving board includes a main circuit board, and a photosensitive device, a backlight controller and a first port that are disposed on the main circuit board. The photosensitive device is configured to sense brightness and color temperature of a light source, and output brightness data and color temperature data. The backlight controller is coupled to the photosensitive device, and configured to receive the brightness data and adjust light-emitting brightness of the light source according to the brightness data. The first port is coupled to the photosensitive device, and configured to be coupled to a system board, receive the color temperature data, and transmit the color temperature data to the system board, such that the system board adjusts color temperature of a picture displayed by a display panel according to the color temperature data.

In an embodiment a sensor element includes a carrier having an electrically insulating material, a top side and a bottom side, an NTC thermistor arranged on the top side of the carrier and at least two first electrodes configured for electrically contacting the sensor element, wherein the first electrodes are arranged on the top side of the carrier, wherein the sensor element is configured to measure a temperature, and wherein the sensor element is configured for direct integration in an electrically insulating manner.

The present disclosure provides a combined fabrication and calibration process for sensor modules and temperature sensor modules in particular. The present disclosure also provides the completed calibrated sensor module and an electronic device containing the calibrated sensor module.