The wireless headset includes a main control module. The main control module includes a rigid-flexible circuit board, a first substrate, a first support member, and a plurality of chips. The rigid-flexible circuit board includes a rigid board portion and a first flexible board portion and a second flexible board portion that are connected to the rigid board portion. The rigid board portion is located in the earbud portion. The first flexible board portion is located in the earbud portion and has one end connected to the rigid board portion. One end of the second flexible board portion is connected to the rigid board portion and the other end thereof extends to the ear handle portion. A plurality of layers of components are stacked on the rigid board portion of the wireless headset, so that component integration degree is high.

An image transmission system is disclosed. The image transmission system includes at least one image capturing device, at least one conversion device, at least one image processor, and at least one flexible printed circuit (FPC). The at least one FPC includes at least one conductive layer and at least one optical waveguide layer. The at least one image capturing device is configured to capture at least one data. The at least one conversion device is configured to perform a conversion between the at least one data and an optical signal. The at least one image processor is configured to obtain the at least one data according to the optical signal, and processes the data. The at least one optical waveguide layer is configured to transmit the optical signal.

A cable substrate includes an insulating layer, a slit portion penetrating through at least a portion of the insulating layer in a thickness direction of the insulating layer, and a dummy pattern disposed on the insulating layer. At least a portion of the dummy pattern is exposed to the slit portion.

A bonding structure includes a substrate, a first sensing electrode layer, a second sensing electrode layer, an optical film layer, and a protective layer. The substrate has opposite first and second surfaces. A sensing area and a bonding area are defined on the substrate. The first sensing electrode layer is disposed on the first surface. The second sensing electrode layer is disposed on the second surface. The optical film layer covers the first sensing electrode layer and has a first bonding opening located in the bonding area. The protective layer covers the second sensing electrode layer and has a second bonding opening located in the bonding area. The first and second bonding openings respectively expose a part of the first sensing electrode layer and a part of the second sensing electrode layer and are misaligned in a direction perpendicular to the first or second surface.

An antenna package according to an embodiment includes an antenna unit and a circuit board bonded to the antenna unit. The circuit board includes a core layer comprising a plurality of portions having different widths from each other in a planar view, the core layer having a first surface and a second surface opposing each other, and a circuit wiring disposed on the first surface of the core layer and electrically connected to the antenna unit.

A method of fabricating an electromagnet includes obtaining a first flexible PCB that includes one or more first conductive coiled traces and obtaining a second flexible PCB that includes one or more second conductive coiled traces. The first flexible PCB is bent into a shape having at least one curve or corner. With the first flexible PCB having been bent into the shape, the second flexible PCB is then bent into the shape: the second flexible PCB is positioned adjacent to the first flexible PCB to conform with the first flexible PCB. The second flexible PCB may substantially surround the first flexible PCB. An electrostatic deflector may be disposed concentrically with the first and second flexible PCBs.

A flexible printed circuit board includes: a proximal end portion; a left strip portion and a right strip portion that extend in the rear direction from the proximal end portion; and conductive paths, a portion of which is provided spanning from the proximal end portion to the left strip portion, and another portion of which is provided spanning from the proximal end portion to the right strip portion. In portions of the conductive path in the left strip portion and the right strip portion, strip side connecting portions that are electrically connected to electrode terminals of electricity storage devices are provided. In the left strip portion, a deformation portion that deforms to increase the distance between the left strip portion and the right strip portion is provided.

In an electronic device, a circuit board connects different systems or structures such that heat of a system with a relatively large amount of heat can be transferred to a position or a heat dissipation structure with a relatively small amount of heat, thereby mitigating local high temperatures in the electronic device and distributing heat more evenly throughout the electronic device.

Provided are flexible hybrid interconnect circuits and methods of forming thereof. A flexible hybrid interconnect circuit comprises multiple conductive layers, stacked and spaced apart along the thickness of the circuit. Each conductive layer comprises one or more conductive elements, one of which is operable as a high frequency (HF) signal line. Other conductive elements, in the same and other conductive layers, form an electromagnetic shield around the HF signal line. Some conductive elements in the same circuit are used for electrical power transmission. All conductive elements are supported by one or more inner dielectric layers and enclosed by outer dielectric layers. The overall stack is thin and flexible and may be conformally attached to a non-planar surface. Each conductive layer may be formed by patterning the same metallic sheet. Multiple pattern sheets are laminated together with inner and outer dielectric layers to form a flexible hybrid interconnect circuit.

A flexible circuit board assembly and a flexible display device include a first flexible circuit board, a T-shaped flexible circuit board, and a second flexible circuit board. The first flexible circuit board and the second flexible circuit board are located on a top of the T-shaped flexible circuit board and are coplanar with the T-shaped flexible circuit board. Two ends of a top of the T-shaped flexible circuit board are connected respectively to the first flexible circuit board and the second flexible circuit board perpendicularly.