Patent classifications
H05K2201/052
Bonding structure and electronic device
A bonding structure includes a substrate, a first sensing electrode layer, a second sensing electrode layer, an optical film layer, and a protective layer. The substrate has opposite first and second surfaces. A sensing area and a bonding area are defined on the substrate. The first sensing electrode layer is disposed on the first surface. The second sensing electrode layer is disposed on the second surface. The optical film layer covers the first sensing electrode layer and has a first bonding opening located in the bonding area. The protective layer covers the second sensing electrode layer and has a second bonding opening located in the bonding area. The first and second bonding openings respectively expose a part of the first sensing electrode layer and a part of the second sensing electrode layer and are misaligned in a direction perpendicular to the first or second surface.
Busbar module
A busbar module includes: a circuit body having a flexible circuit board; busbars; and a holder. The circuit body has: conductor layers and protective layers to form a multiple-layered structure of wiring patterns; a band-shaped main strip to be located to extend in a stacking direction of cells; and a band-shaped branch strip branched from the main strip. The branch strip has: a bent portion extending in the stacking direction and having a bent shape around an axis crossing the stacking direction; and a connection portion disposed closer to an end of the branch strip than the bent portion and connected to the corresponding busbar. The bent portion has a thin-layer portion having a shape formed by removing, from the flexible circuit board, a part of the protective layers corresponding to a part of the conductor layers without being used as the wiring pattern in the branch strip.
Flexible hybrid interconnect circuits
Provided are flexible hybrid interconnect circuits and methods of forming thereof. A flexible hybrid interconnect circuit comprises multiple conductive layers, stacked and spaced apart along the thickness of the circuit. Each conductive layer comprises one or more conductive elements, one of which is operable as a high frequency (HF) signal line. Other conductive elements, in the same and other conductive layers, form an electromagnetic shield around the HF signal line. Some conductive elements in the same circuit are used for electrical power transmission. All conductive elements are supported by one or more inner dielectric layers and enclosed by outer dielectric layers. The overall stack is thin and flexible and may be conformally attached to a non-planar surface. Each conductive layer may be formed by patterning the same metallic sheet. Multiple pattern sheets are laminated together with inner and outer dielectric layers to form a flexible hybrid interconnect circuit.
Display device
One embodiment of the present invention provides a highly reliable display device. In particular, a display device to which a signal or a power supply potential can be supplied stably is provided. Further, a bendable display device to which a signal or a power supply potential can be supplied stably is provided. The display device includes, over a flexible substrate, a display portion, a plurality of connection terminals to which a signal from an outside can be input, and a plurality of wirings. One of the plurality of wirings electrically connects one of the plurality of connection terminals to the display portion. The one of the plurality of wirings includes a first portion including a plurality of separate lines and a second portion in which the plurality of lines converge.
ELECTRONIC DEVICE INCLUDING MULTIPLE PRINTED CIRCUIT BOARDS
An electronic device is provided. The electronic device includes a first printed circuit board having a first surface and a second surface, a second printed circuit board having a first surface and a second surface disposed to be spaced apart from the first printed circuit board, a battery disposed between the first printed circuit board and the second printed circuit board, a first connection member to electrically connect the first printed circuit board and the second printed circuit board, and a second connection member to electrically connect the first printed circuit board and the second printed circuit board, wherein the first connection member and the second connection member may be arranged to at least partially overlap at a portion passing by the battery.
METHOD FOR MANUFACTURING AN AUTOMOTIVE MIRROR
A method for manufacturing an automotive mirror, in particular a side mirror, includes forming a printed circuit board as flexible printed circuit board with n+1 branches, nεN, providing n modules each including at least one electronic element housed within a plastic casting and connected to conducting paths on at least one of the surfaces of the plastic casting, and at least one standard gripping point, guiding structure, snap connection element and/or sealing member provided by the plastic casting, connecting up to n of said branches to one module each and connecting one branch to cables or a cable harness to be connected to a power supply and/or a control unit outside the mirror, providing mirror parts free of electronic elements, and assembling the mirror parts and the modules.
Speaker box
The present invention provides a speaker box having an upper cover, a lower cover mated with the upper cover to form an accommodation space and a speaker unit accommodated in the accommodation space. The speaker box also includes an elastic piece electrically connected to the speaker unit and a flexible circuit board electrically connected to the elastic piece. One end of the elastic piece is connected to the speaker unit and the other end is bent and extended to the extension part. The flexible circuit board is connected to the elastic piece on the extension part and extends out of the accommodation space. The speaker box provided by the present invention can smoothly draw out the flexible circuit board to the position of the feed point, thereby effectively ensuring the communication between the flexible circuit board and the external circuit.
GIMBAL AND METHOD FOR WINDING FLEXIBLE CABLE ON GIMBAL
A gimbal and a method for winding a flexible cable on a gimbal are provided. The gimbal includes a first motor and a second motor connected with each other. The flexible cable includes a connection unit and a connection end connected with each other, and the connection end is extended from the connection unit. The gimbal winding method includes winding the connection unit on the first motor while allowing the connection end to be electrically connected with the second motor.
Method of manufacturing flexible printed interconnect board
According to one aspect of the present invention, a method of manufacturing a flexible printed interconnect board, including an insulating base film; a conductive pattern that is layered on one surface side of the base film; and a plurality of connection terminals that are fixed to a terminal connection area on one edge side of the conductive pattern, includes: fixing the plurality of connection terminals in parallel to a component fixing jig; and mounting the plurality of fixed connection terminals together with the component fixing jig.
APPARATUS WITH INTEGRATED ANTENNA ASSEMBLY
An antenna structure is described that includes a flexible substrate and at least two antenna elements being formed from conductive traces on a layer of the flexible substrate. The antenna structure also includes a plurality of conductive traces formed on the layer of the flexible substrate with a first subset being electrically coupled as a lead in to a first one of the antenna elements and a second subset of the plurality of conductive traces being electrically coupled as a lead in to a second one of the antenna elements, wherein the first subset and the second subset are separately coupled electrically to one connector after insertion of an edge of the flexible substrate into the connector. An apparatus is described that includes a case, an electronic assembly, including a printed circuit board and a support bracket, contained within the case. The apparatus further includes the antenna assembly as described herein.