The present disclosure relates to a shielded double-sided module, which includes a module substrate with a ground plane, at least one top electronic component attached to a top surface of the module substrate and encapsulated by a first mold compound, a number of first module contacts attached to a bottom surface of the module substrate, a second mold compound, and a shielding structure. The second mold compound resides over the bottom surface of the module substrate, and each first module contact is exposed through the second mold compound. The shielding structure completely covers a top surface and a side surface of the module, and is electrically coupled to the ground plane within the module substrate.

Various circuit board systems and methods of use and manufacture thereof are disclosed. A circuit board system can have a first circuit board including a substrate and a first component susceptible to electromagnetic interference carried by the substrate. The system can also include a second circuit board including a second substrate, and a shield engaged to the substrate of the first component, the shield at least partially covering the first component and being configured to protect the first component from electromagnetic interference, wherein the shield couples the substrate of the first circuit board to the substrate of the second circuit board.

An electronic component includes a wiring substrate, surface mount devices mounted on a front surface of the wiring substrate, and a shield plate fixed on a side adjacent to top surfaces of the surface mount devices. The shield plate includes a magnetic ceramic sintered sheet and a first metal film. The magnetic ceramic sintered sheet includes a first main surface and a second main surface. The first metal film is disposed on the first main surface of the magnetic ceramic sintered sheet.

An electric connector terminal configuration structure includes an insulating body, a terminal set disposed inside a base of the insulating body and including conductive terminals arranged in upper and lower rows, and a circuit board connected to terminal set and including a first contact set and a second ground set. The first contact set is electrically connected to the terminal set, to transmit differential pair signals, ground signals and non-differential pair signals. The second contact set is electrically connected to the first contact set and has the same signal transmission configuration as the first contact set, and in the second contact set, an interval of contacts for transmitting differential pair signals is lower than the interval of a contact for transmitting a ground signal and an adjacent contact for transmitting the differential pair signal, to solve the high frequency impedance matching problem, thereby matching the HDMI 2.1 specification.

A radio frequency circuit includes at least one dielectric substrate, a trench formed in the dielectric substrate, and an electrically continuous conductive material in the trench. The radio frequency circuit further may include a first dielectric substrate, a second dielectric substrate, with the trench being formed in the first and second dielectric substrates. A method of fabricating an electromagnetic circuit includes providing at least one dielectric substrate, machining a trench in the at least one dielectric substrate, and filling the trench with an electrically conductive material to form an electrically continuous conductor.

Various circuit board systems and methods of use and manufacture thereof are disclosed. A circuit board system can have a first circuit board including a substrate and a first component susceptible to electromagnetic interference carried by the substrate. The system can also include a second circuit board including a second substrate, and a shield engaged to the substrate of the first component, the shield at least partially covering the first component and being configured to protect the first component from electromagnetic interference, wherein the shield couples the substrate of the first circuit board to the substrate of the second circuit board.

An electronic apparatus having noise suppression mechanism is provided that includes a circuit board, a wireless communication circuit, a digital signal generation circuit, a metal shield and a grounding metal pillar. The wireless communication circuit is disposed on a chip disposing area of the circuit board and performs wireless communication within a wireless signal frequency range. The digital signal generation circuit is disposed on the chip disposing area and generates a digital signal transmitted through a transmission path within the chip disposing area. The metal shield is coupled to the circuit board to cover the chip disposing area. The grounding metal pillar is disposed on the chip disposing area of the circuit board. The grounding metal pillar extends for contacting the metal shield and increases a resonant frequency of the metal shield.

An electromagnetic interference (EMI) shielding can be couplable to a circuit board. The EMI shielding can include a fence couplable to the circuit board, a lid couplable to the fence, and a shield arm extending from the lid and being configured to couple to the fence. The shield arm can be hingedly or rotatably coupled to the lid. The shield arm can be magnetically couplable to the lid. The shield arm and/or the fence can include a magnet to provide a magnetic attraction between the shield arm and the fence.

Various circuit board systems and methods of use and manufacture thereof are disclosed. A circuit board system can have a first circuit board including a substrate and a first component susceptible to electromagnetic interference carried by the substrate. The system can also include a second circuit board including a second substrate, and a shield engaged to the substrate of the first component, the shield at least partially covering the first component and being configured to protect the first component from electromagnetic interference, wherein the shield couples the substrate of the first circuit board to the substrate of the second circuit board.

A magnetic stand for a tablet device is disclosed. The magnetic stand is configured to rigidly hold a portion of the tablet device in place and to shield the magnetic field from adversely affecting nearby devices susceptible to strong magnetic fields. The shielding portion of the magnetic stand allows for significant increases in magnetic field strength when compared to similarly configured, unshielded products.