A fabrication process for soft-matter printed circuit boards is disclosed in which traces of liquid-phase GaIn eutectic (eGaIn) are patterned with UV laser micromachining (UVLM). The terminals of the elastomer-sealed LM circuit connect to the surface mounted chips through vertically-aligned columns of eGaIn-coated ferromagnetic microspheres that are embedded within an interfacial elastomer layer.

An electronic module includes a substrate, electronic components mounted on the substrate, a magnetic body provided on the substrate so as to cover the electronic components, and a metal shield provided on the magnetic body. An electronic circuit is defined using the electronic components. The electronic circuit includes a signal circuit. The metal shield includes ground connection portions connected to a ground electrode of the substrate, and a circuit connection portion connected to the signal circuit at a position different from the ground connection portions.

Provided herein is a magnetic sheet. The magnetic sheet according to one embodiment of the present invention includes a magnetic layer formed of crushed pieces of a magnetic body to improve flexibility of the magnetic sheet, and a thin film coating layer formed on at least one surface of the magnetic layer to maintain the magnetic layer in a sheet shape and buffer an external force applied to the crushed pieces of the magnetic body. According to the present invention, since the magnetic sheet is improved in mechanical strength properties, such as a tensile property, a bending property, and the like, to have significantly superior flexibility, degradation of physical properties, such as magnetic permeability and the like, caused by physical damage such as unintended cracks in the magnetic body provided in the magnetic sheet can be prevented even in the process of storing, transferring, and attaching the magnetic sheet to a target object and during usage of an electronic device provided with the target object to which the magnetic sheet is attached, and the magnetic sheet can be attached to a target surface of the target object with a superior adhering force even when a stepped portion is present at the surface, and at the same time, the magnetic sheet can block the influence of a magnetic field on parts of a portable terminal device or a human body of a user using the portable terminal device, significantly increase transmission and reception efficiencies and distances of a data and/or wireless power signal, and maintain the above-described performance for a long period of time, such that the magnetic sheet can be widely used in various portable devices such as mobile devices, smart appliances, devices for the Internet of Things, and the like.

A circuit device formed from a functional substrate. The circuit device comprises a functional substrate component and printed electronic elements formed on the functional substrate component. The printed electronic elements formed on the functional substrate component interact with the substrate component to perform a function and to modify the functional substrate component. The circuit device typically needs a passive base material that takes no functional part in the device operation except mechanical support.

A connector and a connector assembly capable of being attached to a freely bendable object such as clothes when used are provided. The connector to be fit to a counterpart connector includes a housing; a conductive contact provided in the housing; and a plurality of holding members comprising a magnetic material provided in the housing. The holding member is configured to be attracted to a magnetic material of the counterpart connector when the connector is fit to the counterpart connector to maintain a fit state. The housing is bendable, and has a plurality of fixing holes formed therein. The holding members are disposed in parallel apart from each other in a longitudinal direction (X direction) in the surface of the housing.

A fabrication process for soft-matter printed circuit boards is disclosed in which traces of liquid-phase GaIn eutectic (eGaIn) are patterned with UV laser micromachining (UVLM). The terminals of the elastomer-sealed LM circuit connect to the surface mounted chips through vertically-aligned columns of eGaIn-coated ferromagnetic microspheres that are embedded within an interfacial elastomer layer.

A printed circuit assembly includes a printed circuit board, a processor, an oscillator and a noise reduction device. The printed circuit board has a ground connecting portion. The processor is disposed on the printed circuit board. The oscillator is disposed on the printed circuit board. The noise reduction device includes a wave absorber, a blocking sheet and an electrically conductive member. The wave absorber includes a processor covering part and an oscillator covering part. The oscillator covering part protrudes from one side of the processor covering part. The processor covering part and the oscillator covering part respectively cover the processor and the oscillator. The blocking sheet is stacked on the oscillator covering part to cover the oscillator. One end of the electrically conductive member is connected to the blocking sheet, and another end of the printed circuit board is connected to the ground connecting portion.

The present invention provides a glass isolation device and a method for manufacturing the glass isolation device, and a current sensor. The current sensor comprises: a conductor, comprising a current input terminal, a current output terminal, a first leg portion connected to the current input terminal, a second leg portion connected to the current output terminal, and a connection portion connected between the first leg portion and the second leg portion; a magnetoresistive sensing device; and an isolation device disposed between the magnetoresistive sensing device and the conductor and comprising an insulating substrate and a conductive thin film formed on the insulating substrate. The conductive thin film is grounded through a wire, and currents on the first leg portion and the second leg portion are in opposite directions. The glass isolation device of the present invention has low raw material and manufacturing costs, and can effectively achieve electrical isolation between a current side and a signal side.

Systems and methods for improved interconnections for electronic components using ACAs are provided. The methods involve using magnets specific for each component to be connected and optimized in terms of size and strength and position relative to the substrate and component. Also provided are ovens adapted for use with the methods and systems and kits providing the parts of the system for use with existing ovens.

A circuit device formed from a functional substrate. The circuit device comprises a functional substrate component and printed electronic elements formed on the functional substrate component. The printed electronic elements formed on the functional substrate component interact with the substrate component to perform a function and to modify the functional substrate component. The circuit device typically needs a passive base material that takes no functional part in the device operation except mechanical support.