Patent classifications
H05K2201/083
Component Carrier Structures Connected by Cooperating Magnet Structures
An electric device which includes a first component carrier structure with a first magnet structure and a first connection structure, and a second component carrier structure with a second magnet structure and a second connection structure. The first magnet structure and the second magnet structure are configured such that upon attaching the first component carrier structure and the second component carrier structure to one another the first connection structure is connected to the second connection structure, holding the first component carrier structure and the second component carrier structure together by an attracting magnetic force between the first magnet structure and the second magnet structure.
ORIENTATION-AGNOSTIC METHOD TO INTERFACE TO XEROX PRINTED MEMORY LABEL
An electronic system for identifying an article can include a printed memory having a plurality of contact pads electrically coupled to a plurality of landing pads positioned on a first side of a printed circuit board (PCB) substrate. The plurality of landing pads can be electrically coupled to a plurality of endless, concentric contact lines positioned on a second side of the PCB substrate through a plurality of vias that extend through a thickness of the PCB substrate and a plurality of traces that electrically couple the plurality of vias with the plurality of landing pads. To perform a memory operation on the printed memory, contact probes of a reader are physically and electrically contacted with the plurality of concentric contact lines. In some implementations, the memory operation can be performed on the printed memory irrespective of a rotational orientation of the printed memory relative to the reader.
ACCUMULATOR BATTERY PACK, COMPRISING DEVICES FOR PASSIVE MAGNETIC BETWEEN ACCUMULATORS AND BUSBARS, AND, WHERE APPROPRIATE, PASSIVE SHUNT OF ONE OR MORE ACCUMULATORS IN CASE OF FAILURE OF THESE ONES
A battery pack wherein each battery is mechanically and electrically connected by a magnetic device to a busbar. In case of failure of any accumulator, it is disconnected completely passively because its failure generates an inactivation of the magnetic device. The disconnection causes the gravity drop of the accumulator and the possibly completely passive implementation of an accumulator shunt.
Solder paste misprint cleaning
A processor receives solder paste information, where the solder paste information describes a solder paste used in assembly of a printed circuit board. A processor determines a minimum magnetic force required for removing the solder paste from the printed circuit board based on the solder paste information. A processor receives electromagnet information, where the electromagnet information describes an electromagnet used in cleaning of a misprint of the solder paste on the printed circuit board. A processor determines a minimum amount of power to provide the electromagnet to induce the minimum magnetic force in the electromagnet, where the determination of the amount of power is based on the electromagnet information and the minimum magnetic force. A processor adjusts an amount of power applied to the electromagnet to at least the determined minimum amount of power to clean the misprint of the solder paste from the printed circuit board.
CONNECTOR AND CONNECTOR ASSEMBLY
A connector and a connector assembly capable of being attached to a freely bendable object such as clothes when used are provided. The connector to be fit to a counterpart connector includes a housing; a conductive contact provided in the housing; and a plurality of holding members comprising a magnetic material provided in the housing. The holding member is configured to be attracted to a magnetic material of the counterpart connector when the connector is fit to the counterpart connector to maintain a fit state. The housing is bendable, and has a plurality of fixing holes formed therein. The holding members are disposed in parallel apart from each other in a longitudinal direction (X direction) in the surface of the housing.
Multi-layer conductors for noise reduction in power electronics
A multi-layered conductor comprising one or more conductor layers of an electrically conductive material and one or more shielding layers of a soft magnetic material. The shielding layer can be coated onto the conductor layer and has a lower conductivity and a higher magnetic permeability than the electrically conductive material of conductor layers. The shielding layer can, at least when alternating current (AC) flows through the multi-layered conductor at relatively high frequencies, provide a separate power path for at least a portion of the high frequency AC current, as well as absorb at least a portion of the high frequency noises associated with that separated high frequency AC current. Additionally, the shielding layer can be separated from the conductor layer at an output end of the multi-layered conductor so that output ends of the shielding layer and conductor layer can be electrically connected to different electrical devices or components.
MATERIAL DEPOSITION IN A MAGNETIC FIELD
The present invention provides for depositing a desired pattern (31) of magnetic material (30) on a non-magnetic substrate (20). Control of the deposition pattern (31) is achieved by use of a magnetised template (10) shaped to correspond to the desired deposition pattern. In use, the template (10) is placed behind the substrate (20). Subsequently, the front surface of the substrate (20) is exposed to a solution containing the magnetic material (30) to be deposited. The magnetic material (30) is attracted to the magnetised template (10) and consequently is deposited in a pattern (31) covering areas corresponding to the shape of the template (10).
USING MAGNETIC FIELDS TO INCREASE THE BONDING AREA OF AN ADHESIVE JOINT
This application relates to an assembly technique for joining parts using a magnetic adhesive. A liquid adhesive including magnetic particles is provided, the liquid adhesive having sufficient properties that allow the adhesive to flow under the influence of a magnetic field prior to curing. A method for joining parts includes the steps of applying an adhesive to a substrate at a location corresponding to the joint, placing a magnetic element proximate the joint to generate a magnetic field that interacts with the magnetic particles in the adhesive to cause the adhesive to flow in a direction corresponding to the magnetic field, and curing the magnetic adhesive under the influence of the magnetic field. An assembly fixture for joining parts includes a magnetic element and, optionally, an inductive heating element. The assembly technique can be used to form a housing of an electronic device from two or more components.
Wireless module, RFID system, and wireless power supply device
A wireless module includes a substrate that includes a first portion, a second portion, and a first flexible portion connecting the first portion and the second portion to each other. The first portion includes a circuit element that is mounted on the first main surface and a circuit including at least the circuit element. The second portion includes a first coil connected to the circuit. The first portion and the second portion face each other. A magnetic sheet is disposed on a second main surface of the second portion, and a battery is disposed between the second main surface of the first portion and the magnetic layer.
MULTI-LAYER CONDUCTORS FOR NOISE REDUCTION IN POWER ELECTRONICS
A multi-layered conductor comprising one or more conductor layers of an electrically conductive material and one or more shielding layers of a soft magnetic material. The shielding layer can be coated onto the conductor layer and has a lower conductivity and a higher magnetic permeability than the electrically conductive material of conductor layers. The shielding layer can, at least when alternating current (AC) flows through the multi-layered conductor at relatively high frequencies, provide a separate power path for at least a portion of the high frequency AC current, as well as absorb at least a portion of the high frequency noises associated with that separated high frequency AC current. Additionally, the shielding layer can be separated from the conductor layer at an output end of the multi-layered conductor so that output ends of the shielding layer and conductor layer can be electrically connected to different electrical devices or components.