Patent classifications
H05K2201/09145
CERAMIC ELECTRONIC COMPONENT
A ceramic electronic component that includes an electronic component body having a superficial base ceramic layer, a surface electrode on a surface of the electronic component body, and a covering ceramic layer covering a peripheral section of the surface electrode. The peripheral section of the surface electrode that is covered by the covering ceramic layer has an opening or a thin portion.
Packaging substrate and method of fabricating the same
The packaging substrate according to the present invention is a packaging substrate including: a core substrate; an insulating layer formed on one surface or each of both surfaces of the core substrate; and one or more wiring layers formed on the insulating layer and/or embedded in the insulating layer. The packaging substrate has a thin layer portion where the insulating layer is partially thinned at an outer peripheral portion of the insulating layer.
Substrate and multiple substrate, and method for producing thereof
A substrate includes a ceramic layer, a metal layer fixed in a planar manner on a surface side of the ceramic layer and a cutout arranged in an edge region of the metal layer. The cutout in the edge region codes information. A multiple substrate having a plurality of these substrates is also provided, as is a method for producing the substrate.
Cable-organizing circuit board and an electronic device incorporating the same
A cable-organizing circuit board includes a board body and a protruding hanger arm. The board body has a circuit-layout section and a non-circuit-layout section that are connected to each other. The protruding hanger arm is disposed at the non-circuit-layout section of the board body, and is adapted to be permit a segment of the transmission cable to pass thereunder. The segment of the transmission cable is disposed beneath a bottom surface of the protruding hanger arm, and remaining segments of the transmission cable are disposed above a top surface of the board body opposite to the bottom surface of the protruding hanger arm when the segment of the transmission cable passes under the protruding hanger arm.
CIRCUIT BOARD WITH ANCHOR CLEAT FOR A CONNECTOR
A connector assembly includes a flexible cable that includes a casing, a plurality of electrical wires each having a first portion encapsulated by the casing and a second portion extending beyond the casing, and a fiber having a first portion encapsulated by the casing and a second portion extending beyond the casing. The connector assembly further includes a housing having a first end to receive the flexible cable and a second end with a connector to connect with another connector, and a circuit board disposed in the housing. The circuit board includes first terminals to connect with the plurality of electrical wires, second terminals to connect with the connector, a plurality of traces coupling respective first terminals with respective second terminals, and a cleat. The second portion of the fiber extends beyond the casing to the cleat and winds around the cleat.
Pocket connector
The pocket connector of the invention has been manufactured of a substrate, which is preferably flexible in at least one direction, of which three parts have been prepared, which are bent or assembled from three parts and joined together superimposed so that at least two opposite sides of the pocket connector have coupling apertures. Two flat cables or a connector for a flexible circuit board is connectable to these coupling apertures.
Test Fixture with Sintered Connections Between Mother Board and Daughter Board
A test fixture includes a mother board that has test signal lines configured to couple to a test station. The mother board includes a recessed region with contact pads coupled to the test signal lines. A daughter board is engaged with the recessed region such that a top surface of the daughter board is approximately coplanar with a top surface of the mother board. The daughter board includes test signal lines coupled to contact pads on the daughter board. The contact pads on the daughter board align with the contact pads on the mother board and are permanently coupled by sintered bonds.
SUBSTRATE CONNECTION STRUCTURE
A substrate connection structure that enables a reduction in thickness is provided. An electrical connector (11) of a connector unit (2) has a housing (22) fixed to an LED substrate (10), contacts (21), and reinforcement tabs (23). The housing (22) includes a bottom wall main body (36) arranged in periphery of a notch portion (18) of the LED substrate (10), and support portions (37) arranged at end portions of the bottom wall main body (36) in a width direction (X1) and supported by a second surface (16) of the LED substrate (10). The reinforcement tabs (23) each include a first fixing portion (45) fixed to the bottom wall main body (36), an extension portion (46) extending from the first fixing portion (45) so as to move away from the first fixing portion (45) along the width direction (X1), and a second fixing portion (47) formed at a leading end of the extension portion (46), arranged side-by-side with the corresponding support portion (37) in a length direction (Y1), and fixed to the second surface (16) of a mounting portion (19).
Edge Connector, Circuit Board, and Connector Component
An edge connector includes a first row of golden fingers and a second row of golden fingers. The first row of golden fingers is adjacent to a plugging end of the edge connector, and the second row of golden fingers is adjacent to the first row of golden fingers. In a plugging direction of the edge connector, each golden finger in the first row of golden fingers has a first end proximate to the plugging end and a second end opposite to the first end. A first end of a grounded golden finger in the first row of golden fingers is protruded from other golden fingers, and second ends of two or more than two golden fingers in the first row of golden fingers are not aligned with each other.
CIRCUIT SUBSTRATE AND ELECTRONIC DEVICE
A circuit substrate includes a base material, a first electrode, and a second electrode. The base material has an upper side and a lower side opposite to each other in a length direction. The first electrode extends and is configured on the base material along the length direction. The second electrode is configured beside the first electrode and includes a first portion and a second portion connected to each other. The first portion is configured on the base material along the length direction. The second portion is configured on the base material along a width direction and is located between the upper side and the first electrode. A cross-sectional width of the first portion becomes larger from the lower side to the upper side.