H05K2201/09145

DISPLAY APPARATUS
20220007552 · 2022-01-06 ·

A display apparatus including a heat sink plane disposed on a bottom surface of a display panel and configured in such a way that a coupling groove with a circuit board accommodated therein is formed in the guide panel, which is coupled to the bottom surface of the heat sink plane, to attach and detach the circuit board into and from the coupling groove through a guide holder disposed on a guide panel.

Substrate unit and substrate assembly, and camera module using same
11172582 · 2021-11-09 · ·

The present invention relates to a substrate unit and a substrate assembly, and a camera module using the same. The present invention may comprise: a first substrate part having rigidity; a second substrate part stacked on one surface of the first substrate part and having flexibility; a third substrate part extending outwardly from the second substrate part and having flexibility; and a reinforcing part which is disposed at a portion where the edge portions of the first substrate part and the third substrate part meet, the reinforcing part having a recessed portion which is formed by recessing the first substrate part inwardly so as to inhibit interference between the first substrate part and the third substrate part. The present invention is capable of resolving the interference between a rigid PCB and a flexible PCB and the tearing thereof by providing a reinforcing part in a connection portion of the rigid PCB and the flexible PCB.

Printed circuit board assembly

A printed circuit board assembly includes a first printed circuit board, a second printed circuit board, and a space holding member. The second printed circuit board includes a first rigid substrate region, spaced apart from and opposed to the first printed circuit board, and a flexible substrate region, extended from one side of the first rigid substrate region to be connected to the first printed circuit board. The space holding member includes a first member, disposed between the first printed circuit board and the second printed circuit board to maintain a space therebetween, and a second member configured to fix the first printed circuit board or the second printed circuit board on the first member.

EDGE CONNECTOR, CIRCUIT BOARD, AND CONNECTOR COMPONENT
20230299515 · 2023-09-21 · ·

An edge connector includes a first row of golden fingers and a second row of golden fingers. The first row of golden fingers is adjacent to a plugging end of the edge connector, and the second row of golden fingers is adjacent to the first row of golden fingers. In a plugging direction of the edge connector, each golden finger in the first row of golden fingers has a first end proximate to the plugging end and a second end opposite to the first end. A first end of a grounded golden finger in the first row of golden fingers is protruded from other golden fingers, and second ends of two or more than two golden fingers in the first row of golden fingers are not aligned with each other.

RFID tag
11748591 · 2023-09-05 · ·

An RFID tag includes an RFID IC, flexible substrates including first wiring conductors and rigid substrates including second wiring conductors. Substrate surfaces of the flexible substrates include first regions connected to the rigid substrates and second regions that include opposite surfaces and are not connected to the rigid substrates. First conductor portions and second conductor portions included in the first wiring conductors are electrically connected to each other via the second wiring conductors. The RFID IC is connected to the first wiring conductors, the second wiring conductors, or both the first wiring conductors and the second wiring conductors.

Solid-state drive with printed circuit boards coupled by a flexible interconnect

A solid-state drive (SSD) includes a first rigid printed circuit board comprising a surface that defines a first plane. A second rigid printed circuit board of the SSD comprises a surface that defines a second plane that is substantially parallel to the first plane. A flexible interconnect couples the first rigid printed circuit board and the second rigid printed circuit board. The flexible interconnect partially encloses a volume. A capacitor is disposed within the volume.

Ceramic electronic component
11647581 · 2023-05-09 · ·

A ceramic electronic component that includes an electronic component body having a superficial base ceramic layer; a surface electrode on a surface of the electronic component body, a peripheral section of the surface electrode having an opening therein; and a covering ceramic layer covering the peripheral section of the surface electrode and the opening therein.

Transporting light within circuit board profile

Embodiments described herein relate to a system for positioning indicator lights of a network device. The system may include a circuit board, which may include a circuit board edge positioned behind a front panel of the network device, two surfaces; and a side of the circuit board edge positioned between the two surfaces. The system may also include a hole through the circuit board near the circuit board edge, a cutout extending from a portion of the hole to the side of the circuit board edge, a LED coupled to the surface of the circuit board and adapted to emit light into the hole, and a lightpipe disposed in the hole to receive light emitted from the LED into a first end of the lightpipe. The lightpipe may direct the light from a second end of the lightpipe toward an opening in the front panel of the network device.

SEMICONDUCTOR SUBSTRATE
20220276527 · 2022-09-01 ·

A display device includes a base film including a first region and a plurality of second regions having the first region therebetween; an inorganic insulating film on the base film, the inorganic insulating film being in contact with the plurality of second regions of the base film; a plurality of first pixels overlapping the first region; and a plurality of second pixels overlapping the plurality of second regions with the inorganic insulating film being between the plurality of second pixels and the plurality of second regions. The inorganic insulating film is divided by the first region and is discontinuous between the plurality of second regions.

Wiring circuit board, producing method thereof, and wiring circuit board assembly sheet

A method for producing a wiring circuit board includes a first step of preparing a wiring circuit board assembly sheet including a support sheet, a plurality of wiring circuit boards supported by the support sheet, and a joint connecting the support sheet to the plurality of wiring circuit boards, having flat-shaped one surface and the other surface facing one surface at spaced intervals thereto in a thickness direction, and having a thin portion in which the other surface is recessed toward one surface and a second step of forming a burr portion protruding toward the other side in the thickness direction and cutting the thin portion.