Standardized photon building blocks are used to make both discrete light emitters as well as array products. Each photon building block has one or more LED chips mounted on a substrate. No electrical conductors pass between the top and bottom surfaces of the substrate. The photon building blocks are supported by an interconnect structure that is attached to a heat sink. Landing pads on the top surface of the substrate of each photon building block are attached to contact pads disposed on the underside of a lip of the interconnect structure. In a solder reflow process, the photon building blocks self-align within the interconnect structure. Conductors on the interconnect structure are electrically coupled to the LED dice in the photon building blocks through the contact pads and landing pads. The bottom surface of the interconnect structure is coplanar with the bottom surfaces of the substrates of the photon building blocks.

A fan connector comprises a connector body, a plurality of chip terminals, a plurality of wiring terminals, and a chip circuit board. The connector body comprises an electrical connection slot, a chip slot, and a wiring slot. The plurality of chip terminals and the plurality of wiring terminals are disposed on a sidewall of the electrical connection slot. The plurality of chip terminals corresponds to the plurality of wiring terminals, respectively. The chip circuit board comprises a chip, a circuit board, and a plurality of conductive pads. The chip circuit board is inserted into the chip slot. The plurality of conductive pads is in contact with the corresponding chip terminals. One end of the connector body is connected to a fan, in which a wire passes through the wiring slot and connects to the plurality of wiring terminals. An external plug is possible to insert into the electrical connection slot.

A printed circuit board (PCB) is enhanced with an edge stiffener structure. The edge stiffener structure may be fastened to the PCB in a variety of ways, including using solder, adhesive, or removably attaching with snaps. Removably attached edge stiffening structures may be reused. Edge stiffener structures can overlap on one or both surfaces of a PCB. Some edge stiffener structures include extensions that fit into C-clamps and D-clamps.

Disclosed herein is an electronic component that includes a substrate and a plurality of conductive layers and a plurality of insulating layers which are alternately laminated on the substrate. The side surface of at least one of the plurality of insulating layers has a recessed part set back from a side surface of the substrate and a projecting part projecting from the recessed part.

The invention provides a printed circuit board (10) including a first electrically conductive track (210), wherein the printed circuit board (10) comprises a set (15) of two printed circuit board areas (100) both comprising a part of the first electrically conductive track (210), wherein printed circuit board (10) further comprises a perforation line (300) between the two printed circuit board areas (100) for customizing the printed circuit board (10) into two physically separated printed circuit board area comprising parts (1100), wherein the perforation line (300) is configured as a non-straight line, wherein the perforation line (300) comprises relative to one of the printed circuit board areas (100), and in a plane of the printed circuit board (10), a first projecting part (311) and a first recessed part (312), wherein the first recessed part (312) is recessed relative to the first projecting part (311), wherein the first electrically conductive track (210) is intercepted by the perforation line (300) at the first recessed part (312).

An electronic assembly includes a plurality of circuit boards each comprising engagement grooves spaced around an outer wall. The assembly includes a plurality of spacers with alignment elements. The alignment elements comprise a first tab and a first tab receiver extending in a first axial direction. The alignment elements further comprising a second tab extending in a second axial direction opposite the first and a second tab receiver extending in the second axial direction. A first spacer is disposed between a first circuit board and a second circuit board. The first tab of the first spacer is disposed within a first engagement groove of the first circuit board. The second circuit board is disposed between the first spacer and a second spacer. A second tab of the first spacer is received in a second engagement groove of the second circuit board and a first tab receiver of the second spacer.

A display apparatus including a heat sink plane disposed on a bottom surface of a display panel and configured in such a way that a coupling groove with a circuit board accommodated therein is formed in the guide panel, which is coupled to the bottom surface of a heat sink plane, to attach and detach the circuit board into and from the coupling groove through a guide holder disposed on a guide panel.

A wiring substrate for supplying a radio frequency signal to an antenna module having a first antenna element and a second antenna element includes a dielectric substrate having a laminated structure, a first power supply wiring that is formed in the dielectric substrate and supplies a radio frequency signal to the first antenna element, a second power supply wiring that is formed in the dielectric substrate and supplies a radio frequency signal to the second antenna element, and a ground conductor that is formed in a layer different from any one of a layer in which the first power supply wiring is formed and a layer in which the second power supply wiring is formed, and in which a hole portion is formed in a portion between the first power supply wiring and the second power supply wiring of the dielectric substrate toward the ground conductor.

A ceramic electronic component of the present disclosure includes a component body including a ceramic layer, at least one terminal electrode provided on one main surface of the component body, and an insulating covering layer provided across the ceramic layer and the terminal electrode to cover part, instead of an entire circumference, of a peripheral edge portion of the terminal electrode, wherein when viewed in plan view from one main surface of the component body, the covering layer intersects with the terminal electrode at a non-perpendicular angle at an intersection of the covering layer and the terminal electrode not covered with the covering layer.

An electronic assembly includes a plurality of circuit boards each comprising engagement grooves spaced around an outer wall. The assembly includes a plurality of spacers with alignment elements. The alignment elements comprise a first tab and a first tab receiver extending in a first axial direction. The alignment elements further comprising a second tab extending in a second axial direction opposite the first and a second tab receiver extending in the second axial direction. A first spacer is disposed between a first circuit board and a second circuit board. The first tab of the first spacer is disposed within a first engagement groove of the first circuit board. The second circuit board is disposed between the first spacer and a second spacer. A second tab of the first spacer is received in a second engagement groove of the second circuit board and a first tab receiver of the second spacer.