A method for producing a wiring circuit board includes a first step of preparing a wiring circuit board assembly sheet including a support sheet, a plurality of wiring circuit boards supported by the support sheet, and a joint connecting the support sheet to the plurality of wiring circuit boards, having flat-shaped one surface and the other surface facing one surface at spaced intervals thereto in a thickness direction, and having a thin portion in which the other surface is recessed toward one surface and a second step of forming a burr portion protruding toward the other side in the thickness direction and cutting the thin portion.

A pressure sensor includes a conductive substrate, a ring-shaped spacer, an inner spacer and a sensing circuit substrate. The conductive substrate includes a conductive-substrate body and a conductive layer. The conductive layer is disposed on the conductive-substrate body. The ring-shaped spacer and the inner spacer are disposed on the conductive-substrate body. The sensing-circuit substrate, disposed on the ring-shaped spacer and the inner spacer, includes a circuit-substrate body, a first sensing circuit and a second sensing circuit. The first sensing circuit and the second sensing circuit are disposed on opposing sides of the circuit-substrate body, and a plurality of first finger circuits of the first sensing circuit and a plurality of second finger circuits of the second sensing circuit are interlaced. The first sensing circuit and the second sensing circuit are densely arranged at the center of the conductive layer and less densely arranged on both sides of the conductive layer.

A radio frequency transmission arrangement comprises a ground plate having an aperture comprising a slot with an elongate cross-section and substantially parallel sides, and a first and second transmission line. The thickness of the ground plate is greater than a width of the slot. The aperture is partially filled with a solid dielectric material and partially filled with air. The first transmission line comprises a first elongate conductor on a first side of the ground plate and has an end terminated with a first termination stub. The second transmission line comprises a second elongate conductor on the opposite side of the ground plate and has an end terminated with a second termination stub. The first transmission line is arranged to cross the slot at a point adjacent to the first termination stub, and the second transmission line is arranged to cross the slot at a point adjacent to the second termination stub.

A connector for connecting a coaxial cable to a printed circuit board includes a support portion that receives an end of the coaxial cable within a hollow structure thereof so that an exposed outer conductor of the coaxial cable is connected to an interior surface of a side wall of the hollow structure and so that the coaxial cable extends within the support portion perpendicular to the printed circuit board. The connector further includes an engagement portion that is connected to the support portion and configured to fix the connector to a first side of the printed circuit board, where the engagement portion is mounted above a via hole in the printed circuit board.

Method for providing an electrical connection, comprising connecting a first cable to a first conducting structure on a printed circuit board, connecting a second cable to a second conducting structure on the printed circuit board, comparing a propagation delay of a first signal path comprising the first cable and the first conducting structure on the printed circuit board, and a propagation delay of a second signal path comprising the second cable and the second conducting structure on the printed circuit board; and removing conductive material of the first conducting structure and/or of the second conducting structure, in order to modify an electrical length of the first conducting structure and/or of the second conducting structure, to obtain a first conducting path and a second conducting path, in dependence on a result of the comparison, in order to reduce a difference of the propagation delays between the first signal path and the second signal path.

A connector for connecting a coaxial cable to a printed circuit board includes a support portion that receives an end of the coaxial cable within a hollow structure thereof so that an exposed outer conductor of the coaxial cable is connected to an interior surface of a side wall of the hollow structure and so that the coaxial cable extends within the support portion perpendicular to the printed circuit board. The connector further includes an engagement portion that is connected to the support portion and configured to fix the connector to a first side of the printed circuit board, where the engagement portion is mounted above a via hole in the printed circuit board.

A pressure sensor includes a conductive substrate, a ring-shaped spacer, an inner spacer and a sensing circuit substrate. The conductive substrate includes a conductive-substrate body and a conductive layer. The conductive layer is disposed on the conductive-substrate body. The ring-shaped spacer and the inner spacer are disposed on the conductive-substrate body. The sensing-circuit substrate, disposed on the ring-shaped spacer and the inner spacer, includes a circuit-substrate body, a first sensing circuit and a second sensing circuit. The first sensing circuit and the second sensing circuit are disposed on opposing sides of the circuit-substrate body, and a priority of first finger circuits of the first sensing circuit and a priority of second finger circuits of the second sensing circuit are interlaced. The first sensing circuit and the second sensing circuit are densely arranged at the center of the conductive layer and less densely arranged on both sides of the conductive layer.

In a printed wiring board, when a plurality of wiring base bodies are collectively stacked, a constituent material of a first layer of an insulating resin film has a low melting point, so that the first layer is easily melted. Therefore, thermal welding on an upper surface of the wiring base body is reliably performed, and the wiring base bodies are bonded to each other with high reliability.

The coil substrate may include a substrate; a first conductor layer comprising a plurality of first and second segments periodically disposed on top and bottom of the substrate; a second conductor layer comprising a plurality of first and second segments periodically overlapping the first conductor layer on the top and bottom of the substrate; a first connection line connecting between the first and second segments of the first conductor layer; and a second connection line connecting the first and second segments of the second conductor layer. The first connection line includes a first region exposed on at least one of the first and second surfaces that are opposite to each other of the substrate and second and third regions disposed through the substrate from both sides of the first region.

A molding with an integrated electrode pattern, including a resin molded body having a first surface and a second surface opposing each other; a first film that is formed on the first surface and that includes an electrode pattern and a first lead-out wire electrically connected to the electrode pattern, the first film not being covered by the resin molded body; and a second film that stands on the first surface, and that includes a second lead-out wire electrically connected to the first lead-out wire, the second film having a rectangular shape, and the resin molded body includes a pair of support wall portions formed integrally with the first surface so as to stand on the first surface and clamp both ends of a base part of the second film.