A substrate, a chip, a circuit package and a process of fabricating a substrate are presented. The substrate is provided between an integrated circuit and a printed circuit board, and comprises a core insulating and a buildup insulating layer. The first plated through hole is operable to provide ground through from the printed circuit board to the integrated circuit. The second plated through hole is operable to provide electrical communication carrying signals or power between the integrated circuit and the printed circuit board through the buildup insulating layers. The first plated through hole is formed in tubular shape defined an outer wall and an inner wall, and the second plated through hole is formed in the inner wall and is insulated with the first plated through hole.

An integrated heat exchanger has a heat exchanger within a circuit board. The circuit board can be a PCB having one or more electronic components coupled to its top-side surface. The conductive layers of the PCB include a first sub-set of electrically conductive interconnects and as second sub-set of electrically conductive interconnects. The first sub-set of conductive layers are electrically connected to each other and to the one or more electronic components. The second sub-set of conductive layers are electrically isolated from the first sub-set of conductive layers by intervening non-conductive layers such as prepreg. In this manner, the heat exchanger is electrically isolated from the one or more electronic components. The second sub-set of conductive layers include a dedicated top-side conductive layer to which a baseplate can be attached. The baseplate is also attached to the one or more electronic components via an electrically non-conductive gap filler.

A connection structure includes: a circuit body including a flexible printed circuit having a wiring pattern; and a conductive body including a connection portion. The connection portion has a flat-plate shape and is connected to a mounting surface of the circuit body. The wiring pattern has a number of connection target portions each extending in a preset direction to cross the connection portion and is longer than a width of the connection portion in the preset direction. The connection portion and the connection target portions are electrically connected using a conductive adhesive to connect the wiring pattern and the conductive body.

An apparatus comprising a package comprising a first side to interface with at least one chip; and a second side to interface with a circuit board, the second side opposite to the first side, wherein the second side comprises a non-stepped portion comprising a first plurality of conductive contacts; and a stepped portion that protrudes from the non-stepped portion, the stepped portion comprising a second plurality of conductive contacts.

A method to form a plurality of inductors in a single process by stacking multiple magnetic sheets, wherein each sheet is made to form a particular part in quantities, which can be a base part, a pillar part, a hollow part, or a cover part, for forming a magnetic body of an inductor.

Disclosed herein is an electronic component that includes a first conductive layer including a lower electrode and a first inductor pattern, a dielectric film that covers the lower electrode, an upper electrode laminated on the lower electrode through the dielectric film, an insulating layer that covers the first conductive layer, dielectric film, and upper electrode, and a second conductive layer formed on the insulating layer and including a second inductor pattern. The first and second inductor patterns are connected in parallel through via conductors penetrating the insulating layer.

Peeling in an electronic module is sensed. An electronic module according to the present invention includes a specified conductor, an insulating layer, a wiring layer, and a capacitance-to-voltage converter. The wiring layer includes a sense electrode. The capacitance-to-voltage converter is connected to the sense electrode. The sense electrode is opposed to a portion of the specified conductor via the insulating layer, and forms a capacitance with the portion. The capacitance-to-voltage converter is configured to output a voltage according to the capacitance.

An electronic device includes: an electronic component; and a mounting member on which the electronic component is mounted. A center of gravity of the electronic component is at a position separated from the mounting member. The electronic device further includes: a rigid member having a frame shape, which is fixed to the mounting member and surrounds the electronic component in a direction perpendicular to a direction from the center of gravity of the electronic component to the mounting member; and a connecting member which connects the electronic component to the rigid member on a side opposite to the mounting member with respect to the electronic component.

A printed wiring board includes a substrate, a contact member arranged in contact with the substrate, and a wear resistant member fixed at least in an area on the substrate that comes in contact with the contact member, the wear resistant member having a wear resistance higher than that of the substrate.

A connection structure includes: a circuit body including a flexible printed circuit having a wiring pattern; and a conductive body including a connection portion. The connection portion has a flat-plate shape and is connected to a mounting surface of the circuit body. The wiring pattern has a number of connection target portions each extending in a preset direction to cross the connection portion and is longer than a width of the connection portion in the preset direction. The connection portion and the connection target portions are electrically connected using a conductive adhesive to connect the wiring pattern and the conductive body.