A method includes forming a multi-stacked electronic device having two or more electronic components, each of the electronic components includes a leadframe, the leadframes of each electronic component are physically joined together using a non-solder metal joining process to form a joint, and the joint is located outside a solder connection region.

A guiding device includes a first telescopic member, a second telescopic member, and an elastic member. The first telescopic member includes a main body with a sliding cavity. The second telescopic member includes a connecting portion and a guiding portion connected to the connecting portion. The guiding portion is slidably inserted into the sliding cavity. Opposite ends of the elastic member are respectively connected to the connecting portion and the main body. The elastic member pushes the main body in a direction away from the connecting portion. The disclosure also provides a mainboard connection structure having the above guiding device.

A method includes forming a multi-stacked electronic device having two or more electronic components, each of the electronic components includes a leadframe, the leadframes of each electronic component are physically joined together using a non-solder metal joining process to form a joint, and the joint is located outside a solder connection region.

A device and a method for manufacturing of a printed circuit board for installing in a battery-powered device, the method including mounting on a printed circuit board (PCB) a PCB surface mount component comprising a planar mount configured to be mounted on the PCB and a kinetic energy absorption element with a battery contact on a distal end of the energy absorption element, and trimming the PCB out of a panel comprising the PCB and a border around the PCB, the border connected integrally with the PCB, wherein the border comprises supports configured to support corresponding ear extensions in the absorption element in order to align the battery contact with a PCB plane.

Press-fit fasteners for securing components together are provided. In one aspect, an electronic system assembly includes a first component comprising a first hole, a second component comprising a second hole, and a press-fit fastener configured to be inserted into the first hole and the second hole in a single motion. The press-fit fastener is configured to at least contribute to securing the second component to the first component after insertion into the first and second holes. Related press-fit fasteners and methods of manufacture are disclosed.

The edge shields disclosed herein utilize a plated edge surface of a PCB to form one or more sides of an electronic shield to reduce the amount of top surface area of the PCB occupied by the electronic shield. More specifically, an edge shield lid is mechanically attached to the plated edge surface to remove a need for solder overprint at the edge of the PCB. The edge shield lid is soldered, welded, adhered, or mechanically attached to edge walls where there is no available edge surface for attachment.

A voltage regulator module includes: a substrate having power input and output terminals; a power stage package mounted to the substrate and having first and second pads at a side facing away from the substrate, the power stage package configured to receive an input voltage from the power input terminal and output a phase current at the first pad; an inductor having a vertical conductor embedded in a magnetic core, the vertical conductor having a first end attached to the first pad of the power stage package and an opposite second end; and a metallic clip attached to each of the second end of the vertical conductor, the power output terminal, and the second pad of the power stage package. The second pad of the power stage package does not carry any of the phase current.

A system and method for placing an inductor on a circuit board. This method includes providing a circuit board, a pedestal, and an inductor, the pedestal has a top surface and a bottom surface and the circuit board has one or more electrical conductors, the inductor having a first inductor terminal and a second inductor terminal. Adhesive is placed on the circuit board and the bottom surface of the pedestal is placed on the adhesive located on the circuit board to secure the pedestal to the circuit board. Next, adhesive is placed on the top surface of the pedestal and the inductor is placed on the adhesive located on the top surface of the pedestal to secure the inductor to the pedestal. The inductor is electrically connected to the circuit board.

A light sensor lead frame substrate may comprise a plurality of lead frame substrates formed on a metal substrate through a series of processing including chemical etching, plasma etching and stamping. The lead frame substrates are connected through a plurality of connecting sections, and each of the lead frame substrates is connected to the metal substrate through the connecting section. Each of the connecting sections has two pre-cut sections respectively formed at two ends of the connecting section. After molding, the lead frame substrates are configured to pass through a series of processing including electroplating, injection and desmear to enable each of the lead frame substrates to have a first insulating layer, a reflector cup and a second insulating layer, and with the pre-cut sections, the connecting sections are adapted to be easily washed down by a punch in the punching process.

The disclosure provides a power supply including a high heat-dissipation circuit board assembly system in which a rack is installed on a circuit board so as to be connected to a transformer. Heat produced when electronic components installed on the circuit board are actuated may be conducted and dissipated thereby. The efficiency and the heat conductivity effect of the power supply may be further enhanced by distributing the amount and the flowing direction of the current from the transformer.