The optical module includes a housing, a lid that closes an opening of the housing, an optical component arranged inside the housing, and a printed circuit board arranged on a front surface of the lid outside the housing so as to be used as a board on which a control circuit that controls the optical component is mounted. The optical module further includes a side electrode that is provided on a side surface of the housing and configured to be electrically connected to an electrode of the optical component; and a flexible substrate that provides electrical connection between the side electrode and an electrode of the control circuit. The optical module can be miniaturized by integrating the optical component and the control circuit.

A vibration isolator and method of assembly utilize “flex circuits” to provide both vibration/shock isolation and integrated electrically isolated conductive paths to support lightweight devices (<100 grams) such as crystal oscillators, IC chips, MEMs devices and the like. Each flex circuit includes a least one polymer layer and at least one of the flex circuits includes at least one patterned conductive layer. The isolator may be integrally formed from a stack of polymer layers and patterned conductive layers to provide the plurality of flex circuits, platform and connectors. Most typically, flex circuits are Type 4 in which the multiple polymer layers have a loose leaf or bonded configuration. Flex circuits are easy to produce in large quantities at low cost with standardized and repeatable performance characteristics.

An electrical connector includes an insulation body, a seat, and a positioning plug. The seat is disposed on an outer peripheral surface of the insulation body. The seat includes a tunnel defined through the seat to form an inlet and an outlet. The outlet and a front surface of the insulation body face the same side. The seat further includes a slit and one or more first bumps disposed on an inner wall of the slit. The positioning plug includes a sliding block and rib. The sliding block movably disposed in the tunnel via the inlet with the rib movably disposed in the slit. The positioning plug further includes a second bump disposed on a lateral side of the rib facing the first bump. When the sliding block moves to an installation position, the first bump stops the second bump to fix the sliding block at the installation position.

An electrical terminal includes a terminal body, at least one interference lug, and at least one circuit connection part. The terminal body includes a front end and a back end in a longitudinal direction. The interference lug is arranged in parallel to the longitudinal direction and extends outwardly in a horizontal direction perpendicular to the longitudinal direction. The at least one circuit connection part is connected to the terminal body. An electrical connector is also provided, and the electrical connector includes a base and the electrical terminal. The base includes at least one installation trough, and a guiding groove is arranged in the at least one installation trough, the at least one interference lug is adapted to slide into the guiding groove, so as to guide and position the electrical terminal.

The present application has an object of restricting a temperature rise caused by heat generated by an electronic part or a connection member mounted on a substrate, and includes a first heat conducting member that thermally couples the bus bar extended to a housing side and the housing, a second heat conducting member that thermally couples a capacitor and the housing, and a third heat conducting member that thermally couples a semiconductor element and the housing, wherein each of the bus bar, the substrate, the capacitor, and the semiconductor element is cooled.

A method of manufacturing an electronic device includes preparing a chip component with a terminal electrode. A terminal plate is prepared. A connection member is placed between an end surface of the terminal electrode and an inner surface of the terminal plate. The terminal plate and the terminal electrode are joined using the connection member by bringing a press head into contact with an outer surface of the terminal plate and pressing and heating the terminal plate against the terminal electrode.

A method of manufacturing an electronic device includes preparing a chip component with a terminal electrode. A terminal plate is prepared. A connection member is placed between an end surface of the terminal electrode and an inner surface of the terminal plate. The terminal plate and the terminal electrode are joined using the connection member by bringing a press head into contact with an outer surface of the terminal plate and pressing and heating the terminal plate against the terminal electrode.

A power interface may include a housing, a connection body, and a second stopping plate. A first stopping plate may be arranged in the housing. The connection body may be arranged in the housing. An engaging flange may be arranged on the connection body. A second stopping plate may be attached on an inner face of the housing along a circumference direction of the housing. The second stopping plate may be spaced apart from the first stopping plate. The engaging flange may be sandwiched between the first stopping plate and the second stopping plate. A mobile terminal and a method for manufacturing a power interface are also provided.

A power conversion device comprises: a power conversion circuit that converts a supplied electric power; a current detection circuit that detects a current; a control circuit that controls an operation of the power conversion circuit; and a multilayer substrate that is provided with the power conversion circuit, the current detection circuit, and the control circuit. The multilayer substrate includes a printed wiring, and the printed wiring includes a transmission pattern that transmits a detection signal detected by the current detection circuit to the control circuit. An on-off fluctuation unit of the power conversion circuit fluctuates. The whole of the transmission pattern is disposed at a position different from the on-off fluctuation unit in a direction perpendicular to a plate surface of the multilayer substrate.

A power interface may include a housing, a connection body, and a second stopping plate. A first stopping plate may be arranged in the housing. The connection body may be arranged in the housing. An engaging flange may be arranged on the connection body. A second stopping plate may be attached on an inner face of the housing along a circumference direction of the housing. The second stopping plate may be spaced apart from the first stopping plate. The engaging flange may be sandwiched between the first stopping plate and the second stopping plate. A mobile terminal and a method for manufacturing a power interface are also provided.