A method of manufacturing an electronic device includes preparing a chip component with a terminal electrode. A terminal plate is prepared. A connection member is placed between an end surface of the terminal electrode and an inner surface of the terminal plate. The terminal plate and the terminal electrode are joined using the connection member by bringing a press head into contact with an outer surface of the terminal plate and pressing and heating the terminal plate against the terminal electrode.

An electrical terminal includes a terminal body, at least one interference lug, and at least one circuit connection part. The terminal body includes a front end and a back end in a longitudinal direction. The interference lug is arranged in parallel to the longitudinal direction and extends outwardly in a horizontal direction perpendicular to the longitudinal direction. The at least one circuit connection part is connected to the terminal body. An electrical connector is also provided, and the electrical connector includes a base and the electrical terminal. The base includes at least one installation trough, and a guiding groove is arranged in the at least one installation trough, the at least one interference lug is adapted to slide into the guiding groove, so as to guide and position the electrical terminal.

An electronic apparatus having noise suppression mechanism is provided that includes a circuit board, a wireless communication circuit, a digital signal generation circuit, a metal shield and a grounding metal pillar. The wireless communication circuit is disposed on a chip disposing area of the circuit board and performs wireless communication within a wireless signal frequency range. The digital signal generation circuit is disposed on the chip disposing area and generates a digital signal transmitted through a transmission path within the chip disposing area. The metal shield is coupled to the circuit board to cover the chip disposing area. The grounding metal pillar is disposed on the chip disposing area of the circuit board. The grounding metal pillar extends for contacting the metal shield and increases a resonant frequency of the metal shield.

An electrical connector includes an insulation body, a seat, and a positioning plug. The seat is disposed on an outer peripheral surface of the insulation body. The seat includes a tunnel defined through the seat to form an inlet and an outlet. The outlet and a front surface of the insulation body face the same side. The seat further includes a slit and one or more first bumps disposed on an inner wall of the slit. The positioning plug includes a sliding block and rib. The sliding block movably disposed in the tunnel via the inlet with the rib movably disposed in the slit. The positioning plug further includes a second bump disposed on a lateral side of the rib facing the first bump. When the sliding block moves to an installation position, the first bump stops the second bump to fix the sliding block at the installation position.

Precisely aligned assemblies can be complex, time consuming, labor intensive, and expensive and a need exists for better alternatives. Systems and methods described herein yield high precision printed circuit board assemblies (PCBAs) that contain pre-built alignment features to address this need. The work of precisely locating components on the PCBA to a final position in the overall assembly is already built in to the board. Locating features are used to precisely position one or more components, such as optical components, electro optical components, or mechanical components in assemblies. The locating features may be used to constrain the positions of those components, such as by kinematic coupling, solder wetting dynamics, semiconductor cleaving, dicing, photolithographic techniques for etching, constant contact force, and advanced adhesive technology to result in optical level positioning that significantly improves or eliminates assembly alignment challenges.

The present disclosure relates to an attaching apparatus (2) and an attaching method. The attaching apparatus (2) includes: an auxiliary attaching structure having a protective film layer (20) and a support part (21), and the protective film layer (20) includes first areas (20a) and second areas (20b), each first area (20a) is configured to correspond to an installation area (10a), first sides of the first areas (20a) can be attached to body parts (13a) of rigid structural members on the installation areas (10a) corresponding to the first areas (20a) and receiving through holes (20c) or receiving recesses (20d) are formed at positions on the first areas (20a) corresponding to installation protrusions (13b), the second areas (20b) are configured to correspond to bending areas (10b); and a laminating jig (22) that can be located on a second side of the protective film layer (20).

The present disclosure relates to a contaminant shield system. The contaminant shield system may surround an electronic device, such as a local oscillator (e.g., a crystal oscillator), to prevent contamination of the electronic device via coupling material (e.g., under-fill material) creep or wicking. The contaminant shield system includes multiple walls and at least one wall includes a pick-and-place feature that facilitates positioning of the contaminant shield system during assembly of a circuit board that includes the contaminant shield system.

The optical module includes a housing, a lid that closes an opening of the housing, an optical component arranged inside the housing, and a printed circuit board arranged on a front surface of the lid outside the housing so as to be used as a board on which a control circuit that controls the optical component is mounted. The optical module further includes a side electrode that is provided on a side surface of the housing and configured to be electrically connected to an electrode of the optical component; and a flexible substrate that provides electrical connection between the side electrode and an electrode of the control circuit. The optical module can be miniaturized by integrating the optical component and the control circuit.

Described herein are printed circuit boards (PCBs), PCB assemblies, and methods of manufacture thereof, which allow free placement of electrical components. The PCBs may have electrical pads that may couple to components through via-based connections and without the use of solder. The electrical components may be physically attached to the PCBs through tight fitting, lamination, and/or the use of adhesives. The distance between adjacent vias may be reduced, as accidental short-circuit risks due to solder bridging and similar effects are mitigated when the soldering process is bypassed. The PCB design and component placement may be flexible as to allow the use of electrical components with custom shape and/or customized terminal placement.

The present disclosure relates to a vertical connection type contact terminal of a wire to board connector, which enables a wire to be connected in a vertical direction, and the present disclosure has a terminal formed in a horseshoe shape () by bending both ends of a back plate of a sheet shape toward a front surface and having one side opened, includes: one pair of support plates which bend from both ends of the back plate and define a wire insertion space therebetween, and have mounting portions formed on lower ends thereof to be mounted on a substrate; and one pair of connection plates which bend from upper ends of the one pair of support plates toward the wire insertion space inside, and connect and lock a wire, and is mounted on the substrate in an upright position to allow the wire to be connected in a vertical direction.