Patent classifications
H05K2201/2009
WIRING MODULE AND POWER STORAGE MODULE
A wiring module is configured to attach to a power storage element group of an arranged plurality of power storage elements, each one of the power storage elements including an electrode terminal, including a bus bar that connects to the electrode terminal; a circuit board on which a conductive path is formed; and a relay member that connects the bus bar and the circuit board, wherein the relay member includes a bus bar connection portion that connects to the bus bar and a board connection portion that connects to the conductive path of the circuit board, the relay member includes a connection portion with a plate-like shape that joins the bus bar connection portion and the board connection portion and extends in a direction intersecting an arrangement direction of the plurality of power storage elements, and the connection portion includes a first deformation portion capable of deforming in the arrangement direction.
PORTABLE ELECTRONIC DEVICE AND IMAGE-CAPTURING MODULE THEREOF
A portable electronic device and an image-capturing module thereof are provided. The image-capturing module includes a circuit substrate, an image sensing chip, a rigidity reinforcing structure, and a lens assembly. The circuit substrate has a plurality of conductive substrate contacts. The image sensing chip is disposed on the circuit substrate and electrically connected to the circuit substrate. The image sensing chip includes an image sensing region, and a plurality of conductive chip contacts respectively and electrically connected to the conductive substrate contacts. The rigidity reinforcing structure is disposed on the circuit substrate. The lens assembly includes a lens holder and a lens structure disposed on the lens holder, and the lens structure corresponds to the image sensing region. A perpendicular projection of each of the conductive substrate contacts and a perpendicular projection of each of the conductive chip contacts can be shown on the rigidity reinforcing structure.
Display device
A display device includes a display substrate, a touch module and a ring structure. The display substrate includes a first portion for display, a second portion located at a non-display side of the first portion of the display substrate, and a first bent portion for connecting the first portion and the second portion, and a first driver is provided at a side of the second portion away from the first portion. The touch module includes a touch layer and a touch flexible circuit board connected with the touch layer, the touch flexible circuit board includes a flat portion located at a side of the second portion away from the first portion and a second bent portion for connecting the touch layer and the flat portion. The ring structure is located between the flat portion of the touch flexible circuit board and the second portion of the display substrate.
Display panel and display device
Disclosed are a display panel and a display device. The display panel includes a display area, a wiring area, and a bending area connecting the display area and the wiring area; the bending area includes a first boundary on a side closer to the display area; in the first direction, an extension length of the first boundary is less than an extension length of the wiring area; in the second direction, a vertical projection of the first boundary in the wiring area is located within the coverage of the wiring area; in the second direction, the display area includes sub-pixel rows, and the last sub-pixel row is located on a side of the display area closer to the wiring area; in the first direction, a first sub-pixel in the last sub-pixel row is located on a side of the wiring area boundary closer to the center of the display panel.
Electronic device with heat-radiant structure
An electronic device including a heat-radiant structure of a camera is provided. The electronic device includes a housing including a front plate, a back plate, an image sensor to receive light through a first region of the back plate, and a laser emitter to emit light through a second region of the back plate, a laser driver, a housing structure surrounding at least a part of a side face of the image sensor and driver, a first metal structure, a first heat transfer member including a first portion, a second portion, and a third portion extended from the second portion to a space between the driver and the front plate, a second heat transfer member extended from the third portion of the first heat transfer member, and a first thermal interface material (TIM) disposed between the second heat transfer member and the front plate.
Stretchable circuit board
A stretchable circuit board includes a stretchable base material; a stretchable conductive pattern formed on at least one main surface of the stretchable base material and having stretchability; and a reinforcing base having higher rigidity than the stretchable base material, wherein the reinforcing base reinforces the stretchable base material by being directly or indirectly laminated on the stretchable base material so as to surround at least a part of a formation region of the stretchable conductive pattern in the stretchable base material in a plan view.
Stress relief encapsulation for flexible hybrid electronics
Methods, devices, and systems for producing a flexible electronic device that reduces stress and forces on electronic components are provided. In particular, one or more transition layers with intermediate flexibility, or flexural modulus, are positioned between rigid components and flexible outer layers. This gradually reduces the flexural modulus of the flexible electronics device rather than have an interface between a rigid material and a flexible material. Various materials and methods of forming the layers are described. In addition, an encapsulate layer can be cured to varying flexural moduli to gradually reduce the flexural moduli from the rigid component to the flexible outer layers or bulk structure of the flexible electronic device.
ELECTRONIC DEVICE
According to one embodiment, an electronic device includes a flexible film-like insulating base and a sensor disposed on the insulating base, and the insulating base includes a detection area in which the sensor is disposed and a peripheral area on an outer side of the detection area, and the peripheral area includes a reinforcement member provided thereon to extend along an outer circumference of the insulating base.
DISPLAY ASSEMBLY AND DISPLAY DEVICE
A display assembly includes: a display panel including a driving circuit and a first pad; and a flexible circuit board including a flexible base plate, a first wiring layer and a first reinforcement plate. The first wiring layer is on the flexible base plate and includes a main routing portion and a second pad, and the first reinforcement plate is on a side of the first wiring layer distal to the flexible base plate; an orthogonal projection of the main routing portion on the flexible base plate is within an orthogonal projection of the first reinforcement plate on the flexible base plate; the second pad is connected to the main routing portion, and is electrically connected to the first pad; the first reinforcement plate is outside the display panel and has a first edge proximal to the display panel The first edge includes convex and concave portions alternately arranged.
RFID tag
An RFID tag is provided that includes an RFIC module with a base substrate and an RFIC chip, and an antenna element. A principal surface of the base substrate is provided with a first chip connection terminal connected to a first input/output terminal of the RFIC chip, a second chip connection terminal connected to a second input/output terminal, a first module-side terminal connected by direct current or capacitively coupled to a first antenna-side terminal of the antenna element, a second module-side terminal connected by direct current or capacitively coupled to a second antenna-side terminal, a first wiring pattern connecting the first chip connection terminal and the first module-side terminal, a second wiring pattern connecting the second chip connection terminal and the second module-side terminal, and a third wiring pattern connecting the first module-side terminal and the second module-side terminal.