A method for manufacturing a combined wiring board includes preparing multiple wiring boards, preparing a metal frame having opening portions which accommodate the boards, respectively, positioning the boards in the opening portions of the frame, respectively, and forming multiple crimped portions in the frame by plastic deformation such that the sidewalls of the boards bond to sidewalls of the opening portions in the frame. The preparing of the boards includes forming the sidewalls of the boards such that when the boards are positioned in the opening portions of the frame, the sidewalls of the boards form wide-space portions and narrow-space portions with respect to the sidewalls of the opening portions in the frame, and the forming of the crimped portions includes generating the deformation such that the sidewalls of the opening portions in the frame abut the narrow-space portions of the boards before the wide-space portions of the boards.

A camera module and an array camera module based on an integral packing process are disclosed. The camera module or each of the camera module units of the array camera module includes a circuit board, an integral base, a photosensitive element operatively connected to the circuit board, a lens, a light filter holder installed at the integral base and a light filter installed at the light filter holder. The light filter is not required to be directly installed to the integral base, so that the light filter is protected and the requiring area of the light filter is reduced.

In one example embodiment, an optoelectronic assembly includes a multilayer ceramic substrate that includes multiple ceramic layers and a via disposed through at least one of the ceramic layers. The via may be formed from a conductive material that is configured to communicate a signal through the via. The multilayer ceramic substrate may be configured to dissipate heat emitted by an electronic component coupled to the multilayer ceramic substrate.

An electronic device and associated methods are disclosed. In one example, the electronic device includes a first rigid substrate, a second rigid substrate, a flexible substrate comprising a first portion attached to the first rigid substrate, a second portion attached to the second rigid substrate, a middle portion connecting the first portion to the second portion, wherein the middle portion is bent, and metallic traces therethrough, and a component forming a direct interface with the middle portion of the flexible substrate, the component electrically coupled to the metallic traces. In selected examples, the device further includes a casing.

An electronic apparatus includes a frame, at least one circuit board, at least one hardware device, and at least one first connector. The frame includes a first frame body and a second frame body. The first frame body includes a first wire therein. The circuit board includes a first edge and a second, and at least a portion of the circuit board is flexible. The first edge is connected to the first frame body. The second edge is connected to the second frame body. The circuit board is electrically connected to the first wire. The hardware device is disposed on the circuit board. The first frame body includes a first inner surface, and the first connector is disposed on the first inner surface and electrically connected to the first wire, and the first edge of the circuit board is plugged in the first connector.

The electronic module has a three-dimensional frame, a printed circuit board and a plurality of electronic devices. The printed circuit board is fixed to the three-dimensional frame and has a plurality of support portions which extend transversely to each other in space. The electronic devices are fixed to the printed circuit board and are operatively coupled to each other. The electronic devices are arranged on at least one support portion of the printed circuit board.

A novel electronic device is provided. Alternatively, an electronic device of a novel embodiment is provided. Alternatively, a sturdy electronic device is provided. The electronic device includes a housing and a display portion having flexibility. The housing includes a first board, a second board, and a sealing portion. The first board has a light-transmitting property. The first board and the second board face each other. The sealing portion is between the first board and the second board. The first board has a first curved surface which forms the inside of the housing. The display portion includes a region in contact with the first curved surface.

According to various aspects, exemplary embodiments are disclosed of board level shields with virtual grounding capability. In an exemplary embodiment, a board level shield includes one or more resonators configured to be operable for virtually connecting the board level shield to a ground plane or a shielding surface. Also disclosed are exemplary embodiments of methods relating to making board level shields having virtual grounding capability. Additionally, exemplary embodiments are disclosed of methods relating to providing shielding for one or more components on a substrate by using a board level shield having virtual grounding capability. Further exemplary embodiments are disclosed of methods relating to making system in package (SiP) or system on chip (SoC) shielded modules and methods relating to providing shielding for one or more components of SiP or SoC module.

A magnetic device for an electronic circuit includes a printed circuit board. A first and second magnetic component assembly can be electrically connected to the printed circuit. The second magnetic component assembly can be stacked on the first magnetic component assembly. The first magnetic component assembly can be positioned between the second magnetic component assembly and the printed circuit board. Each magnetic component assembly can include a bobbin, a winding disposed on the bobbin, and a core extending through the bobbin. A second bobbin on the second magnetic component can be positioned on either a first core or a first bobbin of the first magnetic component assembly. The stacked magnetic component configuration can help reduce the board space required to electrically connect both the first and second magnetic component assemblies to the printed circuit board, which can help increase the power density of the magnetic device.

The disclosure provides a display device including a first substrate, a display region disposed above the first substrate; a second substrate; a sealant disposed between the first substrate and the second substrate and outside the display region; and, a plurality of spacers disposed within the sealant. In particular, the first substrate and the second substrate are bonded together via the sealant. Further, the first substrate has a side wall including a first cutting crack surface and a first median crack surface, wherein a roughness of the first cutting crack surface is different from that of the first median crack surface.