An interposer substrate includes a metal member; and a connection substrate disposed on at least portion of one side surface of the metal member. The connection substrate includes circuit patterns exposed from each of one surface of the connection substrate and the other surface of the connection substrate opposing the one surface, and one of a plurality of side surfaces of the connection substrate connecting one side and the other side of the connection substrate is attached to at least a portion of the one side surface of the metal member.

Disclosed is a display apparatus including a configuration for adjusting step difference of printed circuit boards (PCBs) on which a micro light emitting diode (Micro LED) is mounted. The display apparatus may comprises: a printed circuit board (PCB) on which a plurality of light emitting diodes (LEDs) emitting light in a first direction are mounted; a frame configured to support the PCB in a second direction opposite to the first direction; a chassis coupled to the frame in the second direction; and an adjusting unit configured to finely adjust the PCB in the first direction or the second direction, wherein the adjusting unit includes: a height-adjustable screw configured to be inserted in the first direction; a first cam linearly moving in the first direction or the second direction by rotation of the height-adjustable screw; a second cam interlocking with the first cam so as to linearly move in a third direction that is perpendicular to the first direction and the second direction, or in a direction opposite.

A connector includes a flat-plate housing made of insulating resin and including a first positioning hole and a second positioning hole, a plurality of contacts held on the housing, and a first hold-down and a second hold-down made of metal and disposed to correspond to a first positioning hole and a second positioning hole, respectively. The housing includes a CPU board opposed surface to be opposed to a CPU board. The first hold-down includes a reinforcing plate part to cover the CPU board opposed surface around the corresponding first positioning hole. The second hold-down includes a reinforcing plate part to cover the CPU board opposed surface around the corresponding second positioning hole.

An insulator interface serves as both an insulator and the forming tool for a busbar. The busbar insulator interface includes a hollow riser having at least one channel extending between first and second openings at opposite ends of the riser, a busbar forming section located at one of the first and second openings of the riser and a terminal locating section extending from the busbar forming section, wherein the busbar forming section is configured for folding a busbar onto the terminal locating section. A busbar assembly includes a combination of a single piece busbar and an insulator interface. The busbar has one end pre-formed and other end straight to allow the busbar to pass through the insulator interface. The busbar insulator interface is designed to act as the forming tool with the proper bend radius for the busbar.

An example electronic device includes a printed circuit board on which one or more circuit components are disposed, and an interposer surrounding at least some circuit components of the one or more circuit components and including an inner surface adjacent to the at least some circuit components and an outer surface facing away from the inner surface and having a plurality of through holes. The interposer is disposed on the printed circuit board such that one or more through holes of the plurality of through holes are electrically connected with a ground of the printed circuit board. The outer surface of the interposer includes a first conductive region electrically connected with at least one first through hole of the one or more through holes, and a non-conductive region, the inner surface of the interposer includes a second conductive region electrically connected with at least one second through hole of the one or more through holes, and the second conductive region includes a region facing the non-conductive region.

An electronic device and associated methods are disclosed. In one example, the electronic device includes a first rigid substrate, a second rigid substrate, a flexible substrate comprising a first portion attached to the first rigid substrate, a second portion attached to the second rigid substrate, a middle portion connecting the first portion to the second portion, wherein the middle portion is bent, and metallic traces therethrough, and a component forming a direct interface with the middle portion of the flexible substrate, the component electrically coupled to the metallic traces. In selected examples, the device further includes a casing.

An electronic assembly (100) includes a mechanical carrier (102), a plurality of integrated circuits (104A, 104B) disposed on the mechanical carrier, a fan out package (108) disposed on the plurality of integrated circuits, a plurality of singulated substrates (112A, 112B) disposed on the fan out package, a plurality of electronic components (114A, 114B) disposed on the plurality of singulated substrates, and at least one stiffness ring (116A, 116B, 116C) disposed on the plurality of singulated substrates. A method for constructing an electronic assembly includes identifying a group of known good singulated substrates, joining the group of known good singulated substrates into a substrate panel, attaching at least one bridge to the substrate panel that electrically couples at least two of the known good singulated substrates, and mounting a plurality of electronic components onto the substrate panel, each electronic component of the plurality of electronic components corresponding to a respective known good singulated substrate.

An insulator interface serves as both an insulator and the forming tool for a busbar. The busbar insulator interface includes a hollow riser having at least one channel extending between first and second openings at opposite ends of the riser, a busbar forming section located at one of the first and second openings of the riser and a terminal locating section extending from the busbar forming section, wherein the busbar forming section is configured for folding a busbar onto the terminal locating section. A busbar assembly includes a combination of a single piece busbar and an insulator interface. The busbar has one end pre-formed and other end straight to allow the busbar to pass through the insulator interface. The busbar insulator interface is designed to act as the forming tool with the proper bend radius for the busbar.

What is described is a mounting aid for mounting electrical components, in particular electrolytic capacitors or chokes, on a printed circuit board, said mounting aid comprising a body, which has compartments for receiving the electrical components, wherein the compartments have a base with openings for the insertion of connection wires of the electrical components, and metal parts fastened to the body, which metal parts each form at least one contact pin on the underside of the body and each from a busbar for connection to electrical components in a plurality of compartments of the body.

A module includes a first wiring board, a first integrated circuit component mounted on the first wiring board, a second wiring board overlapping with the first wiring board, a second integrated circuit component mounted on the second wiring board, and a connection member disposed between the first wiring board and the second wiring board and configured to electrically connect the first wiring board and the second wiring board, wherein the second integrated circuit component overlaps with the first wiring board and supplies power to the first integrated circuit component via the connection member.