A method of manufacture and an integrated functional multilayer structure, includes a substrate film formed or formable so as to exhibit a selected shape; and a number of functional, preferably including optical, mechanical, optoelectrical, electrical and/or specifically, electronic, elements, such as conductors, insulators, components and/or integrated circuits, provided upon the substrate film in the proximity of the shape; wherein the substrate film has further been provided with a structural tuning element, optionally including an elongated, circumferential or other selected shape, said structural tuning element being configured to locally control induced deformation, optionally including stretching, bending, compression and/or shearing, of the substrate film within said proximity of the shape.

A PCB assembly includes a panel including at least one guide protrusion, at least one mounting portion, and at least one dislocation prevention protrusion, and a PCB including at least one guide hole formed to correspond to the at least one guide protrusion, at least one grounding portion formed to correspond to the at least one mounting portion, and at least one dislocation prevention hole formed to correspond to the at least one dislocation prevention protrusion, wherein the PCB is guided to slide by the at least one guide protrusion and the at least one guide hole, is brought into close contact with the panel by the at least one mounting portion and the at least one grounding portion, and fixed to the panel as the at least one dislocation prevention hole is supported by the at least one dislocation prevention protrusion.

A connection structure includes: a support column member extending in one direction from one end to an opposite end, with the one end attached to an installation object and the opposite end having formed therein a screw hole, the support column member being configured to be non-insertable into the through hole; a surrounding member provided on a first surface of the printed board and configured to surround the opening of the through hole and to allow the opposite end of the support column member to be inserted into the surrounding member; and a fastener configured to fix the support column member to the printed board by being screw-engaged into the screw hole of the support column member inserted into the surrounding member, from a second surface side opposite to the first surface of the printed board.

A connection structure includes: a support column member extending in one direction from one end to an opposite end, with the one end attached to an installation object and the opposite end having formed therein a screw hole, the support column member being configured to be non-insertable into the through hole; a surrounding member provided on a first surface of the printed board and configured to surround the opening of the through hole and to allow the opposite end of the support column member to be inserted into the surrounding member; and a fastener configured to fix the support column member to the printed board by being screw-engaged into the screw hole of the support column member inserted into the surrounding member, from a second surface side opposite to the first surface of the printed board.

Embodiments describe an electronic device fastener including a base link bar, and a pair of corner retaining features coupled to the base link bar. Each corner retaining feature includes a base being formed of a planar structure and having a base top surface, a support rail extending from a portion of the base top surface and having a support rail top surface, a fastening feature defined by surfaces of the base and support rail and comprising vacant space extending through the base and at least a portion of the support rail, a guide wall extending from a portion of the support rail top surface, a retaining protrusion extending from the guide wall toward a center line of the electronic device fastener, and a stopper positioned beside the base link bar and at back ends of the base, the support rail, the guide wall, and the base link bar.

An item may include fabric having insulating and conductive yarns or other strands of material. The conductive strands may form signal paths. Electrical components can be mounted to the fabric. Each electrical component may have an electrical device such as a semiconductor die that is mounted on an interposer substrate. The interposer may have contacts that are soldered to the conductive strands. A protective cover may encapsulate portions of the electrical component. To create a robust connection between the electrical component and the fabric, the conductive strands may be threaded through recesses in the electrical component. The recesses may be formed in the interposer or may be formed in a protective cover on the interposer. Conductive material in the recess may be used to electrically and/or mechanically connect the conductive strand to a bond pad in the recess. Thermoplastic material may be used to seal the solder joint.

Embodiments describe an electronic device fastener including a base link bar, and a pair of corner retaining features coupled to the base link bar. Each corner retaining feature includes a base being formed of a planar structure and having a base top surface, a support rail extending from a portion of the base top surface and having a support rail top surface, a fastening feature defined by surfaces of the base and support rail and comprising vacant space extending through the base and at least a portion of the support rail, a guide wall extending from a portion of the support rail top surface, a retaining protrusion extending from the guide wall toward a center line of the electronic device fastener, and a stopper positioned beside the base link bar and at back ends of the base, the support rail, the guide wall, and the base link bar.

In some embodiments, an interconnectable circuit board may include one or more of the following features: (a) a first electrically conductive pad located on a top of the circuit board, (b) a plated through hole on the conductive pad which passes through the circuit board, (c) a second electrically conductive pad coupled to the plated through hole; the second conductive pad capable of being electrically connected to a third electrically conductive pad attached to a top of a second interconnectable circuit board, (d) cut marks indicating safe locations for separating the circuit board, and (e) a second cut mark adjacent to the first cut mark where the area between the first and second cut mark can be utilized to make a safe cut through the circuit board.

A multi-chip package may include a plurality of semiconductor chips and a printed circuit board (PCB). Each of the semiconductor chips may have an upper surface, a bottom surface, and a plurality of side surfaces. Circuit terminals may be arranged on the upper surface. A plurality of side bonding pads may be arranged on one or more selected side surface among the side surfaces. The semiconductor chips may be mounted on the PCB. The PCB may be configured to surround the selected side surface on which the side bonding pads may be arranged.

An item may include fabric having insulating and conductive yarns or other strands of material. The conductive strands may form signal paths. Electrical components can be mounted to the fabric. Each electrical component may have an electrical device such as a semiconductor die that is mounted on an interposer substrate. The interposer may have contacts that are soldered to the conductive strands. A protective cover may encapsulate portions of the electrical component. To create a robust connection between the electrical component and the fabric, the conductive strands may be threaded through recesses in the electrical component. The recesses may be formed in the interposer or may be formed in a protective cover on the interposer. Conductive material in the recess may be used to electrically and/or mechanically connect the conductive strand to a bond pad in the recess. Thermoplastic material may be used to seal the solder joint.