Patent classifications
H05K2201/2027
Printed wiring board
According to one embodiment, a printed wiring board includes a wiring board, a connector part, a connection pad provided between the wiring board and the connector part and connected with the connector part with a solder material and a guide groove provided in the wiring board to be continuous to the connection pad, to guide a portion of the solder material from the connection pad.
Module mount interposer
A module mount interposer may include one or more fastener receivers configured to mechanically couple with one or more fasteners so as to mechanically and electrically couple a module to the interposer. The module mount interposer may also include a core configured to electrically couple with the module, wherein each of the fastener receivers are mechanically coupled to the core. The module mount interposer may additionally include a solder layer electrically coupled to the core and configured to electrically couple with a printed circuit board (PCB) so as to provide an electrical signal from the module to the PCB and to provide an electrical signal from the PCB to the module.
Protector and bus bar module
A protector is configured to protect a belt-like flexible board where a wiring pattern is provided. The protector includes a first accommodation portion configured to accommodate the flexible board so as to be slidable in a length direction of the flexible board, a second accommodation portion configured to accommodate the flexible board in a position different from the first accommodation portion in the length direction, and a bendable coupling portion that connects between the first accommodation portion and the second accommodation portion. The coupling portion is structured so that under a condition where the coupling portion is curved, deformation of the flexible board in a direction away from the coupling portion is allowed when the flexible board is slid in the length direction with respect to the first accommodation portion.
Apparatuses, systems, and methods for integrating hardware accelerators into computing systems
A disclosed expansion socket may include a primary slot and a secondary slot, each mounted to a receiver printed circuit board and electrically coupled to a central processing unit via a computing bus. The primary slot may be dimensioned to receive a primary pinout disposed within a primary portion of an edge connector disposed on a connecting edge of a presenter printed circuit board. Likewise, the secondary slot may be positioned and dimensioned to receive a secondary pinout, disposed within a secondary portion of the edge connector, when the primary slot receives the primary portion of the edge connector. Furthermore, the primary pinout and the secondary pinout may each conform to a compact pinout specification that is more compact than a pinout specification defined for the computing bus. Various other systems and methods are also disclosed.
Electrical components attached to fabric
An item may include fabric having insulating and conductive yarns or other strands of material. The conductive strands may form signal paths. Electrical components can be mounted to the fabric. Each electrical component may have an electrical device such as a semiconductor die that is mounted on an interposer substrate. The interposer may have contacts that are soldered to the conductive strands. A protective cover may encapsulate portions of the electrical component. To create a robust connection between the electrical component and the fabric, the conductive strands may be threaded through recesses in the electrical component. The recesses may be formed in the interposer or may be formed in a protective cover on the interposer. Conductive material in the recess may be used to electrically and/or mechanically connect the conductive strand to a bond pad in the recess. Thermoplastic material may be used to seal the solder joint.
Mounting System for Mechanical-Shock Resistant Printed Circuit Board (PCB)
A shock resistant fuselage system includes first and second fuselage side walls, each of the first and second fuselage side walls having a plurality of guide posts, and a printed circuit board (PCB) rigidly attached to at least one of the first and second fuselage side walls, the PCB having a plurality of guide slots, each of the plurality of guide posts slideably seated in a respective one of the plurality of guide slots so that elastic deformation of the PCB is guided by the guide slots between the first and second fuselage side walls.
Mounting system for mechanical-shock resistant printed circuit board (PCB)
A shock resistant fuselage system includes first and second fuselage side walls, each of the first and second fuselage side walls having a plurality of guide posts, and a printed circuit board (PCB) rigidly attached to at least one of the first and second fuselage side walls, the PCB having a plurality of guide slots, each of the plurality of guide posts slideably seated in a respective one of the plurality of guide slots so that elastic deformation of the PCB is guided by the guide slots between the first and second fuselage side walls.
Electrical Components Attached to Fabric
An item may include fabric having insulating and conductive yarns or other strands of material. The conductive strands may form signal paths. Electrical components can be mounted to the fabric. Each electrical component may have an electrical device such as a semiconductor die that is mounted on an interposer substrate. The interposer may have contacts that are soldered to the conductive strands. A protective cover may encapsulate portions of the electrical component. To create a robust connection between the electrical component and the fabric, the conductive strands may be threaded through recesses in the electrical component. The recesses may be formed in the interposer or may be formed in a protective cover on the interposer. Conductive material in the recess may be used to electrically and/or mechanically connect the conductive strand to a bond pad in the recess. Thermoplastic material may be used to seal the solder joint.
Luminous fan
A luminous fan includes a supporting mechanism, a main circuit board, a light-guiding impeller and an illumination module. The light-guiding impeller is pivotally coupled to a bracket of the supporting mechanism. The illumination module is disposed within a hub of the light-guiding impeller. After a light beam from a light-emitting element of the illumination module is emitted to a lens assembly, the light beam is refracted by a secondary lens of the lens assembly and transmitted to the light-guiding impeller. Consequently, the light-guiding impeller is illuminated.
Module Mount Interposer
A module mount interposer may include one or more fastener receivers configured to mechanically couple with one or more fasteners so as to mechanically and electrically couple a module to the interposer. The module mount interposer may also include a core configured to electrically couple with the module, wherein each of the fastener receivers are mechanically coupled to the core. The module mount interposer may additionally include a solder layer electrically coupled to the core and configured to electrically couple with a printed circuit board (PCB) so as to provide an electrical signal from the module to the PCB and to provide an electrical signal from the PCB to the module.