A shock resistant fuselage system includes first and second fuselage side walls, each of the first and second fuselage side walls having a plurality of guide posts, and a printed circuit board (PCB) rigidly attached to at least one of the first and second fuselage side walls, the PCB having a plurality of guide slots, each of the plurality of guide posts slideably seated in a respective one of the plurality of guide slots so that elastic deformation of the PCB is guided by the guide slots between the first and second fuselage side walls.

The area projections or a spacer occupies on the upper surface of a resin casing increases as the size of a power semiconductor module decreases, and therefore another means for defining a clearance between a control board and the resin casing is desired. A power semiconductor module is provided, including: a housing which houses a power semiconductor chip; and at least one control pin or guide pin which protrudes outward from an upper surface of the housing, wherein the at least one control pin or guide pin has at least one step in a height direction from the upper surface of the housing toward a tip farthest from the housing.

An apparatus for a dust guard structure includes a particle guard coupled to a top surface of a circuit board, wherein the particle guard is located along a first side of the circuit board between an edge of the circuit board and a first electronic component. The dust guard structure further includes the first electronic component electrically coupled to the circuit board via one or more electronic connections, wherein a height of the particle guard is greater than a height of each of the one or more electrical connections of the first electronic component. The dust guard structure further includes the first side of the circuit board being introduced to an external airflow.

A motor base assembly for a storage drive assembly includes a basewall and a plurality of sidewalls extending from the basewall to define an interior of the motor base assembly. The motor base assembly also includes a stiffener support portion disposed within the interior of the motor base assembly. The stiffener support portion includes a stiffener guide slot and a hole adjacent to the stiffener guide slot. The stiffener guide slot is configured to hold a first plate section of a second stiffener region of a flexible printed circuit and the hole is configured to guide a first stiffener region of the flexible printed circuit.

An apparatus for a dust guard structure includes a particle guard coupled to a top surface of a circuit board, wherein the particle guard is located along a first side of the circuit board between an edge of the circuit board and a first electronic component. The dust guard structure further includes the first electronic component electrically coupled to the circuit board via one or more electronic connections, wherein a height of the particle guard is greater than a height of each of the one or more electrical connections of the first electronic component. The dust guard structure further includes the first side of the circuit board being introduced to an external airflow.

An apparatus for a dust guard structure includes a particle guard coupled to a top surface of a circuit board, wherein the particle guard is located along a first side of the circuit board between an edge of the circuit board and a first electronic component. The dust guard structure further includes the first electronic component electrically coupled to the circuit board via one or more electronic connections, wherein a height of the particle guard is greater than a height of each of the one or more electrical connections of the first electronic component. The dust guard structure further includes the first side of the circuit board being introduced to an external airflow.

A flexible printed circuit for a storage drive assembly is provided. The flexible printed circuit includes a stiffener layer having a first stiffener region, and a second stiffener region separated from the first stiffener region by a hinge region, a first insulation layer disposed on the stiffener layer, a conductive electrode layer disposed on the first insulation layer; and a second insulation layer disposed on the conductive electrode layer, wherein the hinge region is formed from the first insulation layer, the conductive electrode layer and the second insulation layer.

A flexible printed circuit for a storage drive assembly is provided. The flexible printed circuit includes a stiffener layer having a first stiffener region, and a second stiffener region separated from the first stiffener region by a hinge region, a first insulation layer disposed on the stiffener layer, a conductive electrode layer disposed on the first insulation layer; and a second insulation layer disposed on the conductive electrode layer, wherein the hinge region is formed from the first insulation layer, the conductive electrode layer and the second insulation layer.

A process apparatus capable of pushing a panel-shaped object includes a process apparatus and at least one panel-shaped object. The process apparatus includes a carrying fixture and a separating fixture. The carrying fixture has a top surface and a bottom surface opposite to each other and has at least one positioning pillar. The separating fixture has a pushing portion. The panel-shaped object has at least one positioning hole and is carried on the top surface. The positioning pillar is inserted into the positioning hole to position the panel-shaped object. The pushing portion is adapted to move from the bottom surface toward the top surface and protrude out of the top surface, such that the panel-shaped object is pushed up by the pushing portion to be separated from the carrying fixture. In addition, a process method adapted to the process apparatus capable of pushing a panel-shaped object is also provided.

Microclip appliance formed from a single conductive planar metal sheet includes portions defined along an elongated length including a pin receiver, a solder paddle and a bridge. The pin receiver includes first and second planar rings, and a spring bar extending from a periphery of the first ring to a periphery of the second ring. The solder paddle is comprised of a portion of the conductive metal sheet distal from the pin receiver and the bridge extends from a peripheral portion of the solder paddle to the second ring. Lateral bends are disposed along a length of the conductive planar metal sheet to facilitate the various portions of the microclip.