H05K2201/2036

Easy release board to board connector

A connector assembly for connecting an upper circuit board to a lower circuit board is disclosed. The upper circuit board includes a series of fastener holes for a fastening device allowing attachment to the lower circuit board. The connector assembly has a support bracket with access holes aligned with the holes of the upper circuit board. The support bracket is configurable to be positioned over the upper circuit board. The connector assembly has a moveable cover bracket having a series of access holes. The cover bracket is suspended between the support bracket and the cover bracket. The cover bracket is moveable between an open position aligning the access holes with the access holes of the support bracket, and a closed position. In the closed position, the cover bracket blocks access between the access holes of the support bracket and the holes of the upper circuit board.

ADAPTER FOR AIRCRAFT WIRELESS MODULE

A circuit card assembly is described. The circuit card assembly adapts a host circuit card assembly of a host device with an expansion card. By such adaption, the host device may communicate with an access point of an avionics network. The circuit card assembly includes an interface for receiving power from the host circuit card assembly. The circuit card assembly then continuously and selectively provides power to a second interface based on the availability of aircraft power. The second interface receives the expansion card. The circuit card assembly also includes one or more coaxial RF connectors for receiving modulated signals from the expansion card. The circuit card assembly also includes an antenna which transmits radio waves based on the modulated signals.

Power electronics assembly

A power electronics assembly for an electric motor controller. The power electronics assembly comprises an insulated metal substrate, a composite material substrate, and a bolt having a bolt head and a bolt shaft for mechanically coupling the composite material substrate to the insulated metal substrate. The power electronics assembly also includes an electrically conductive sleeve configured to be held between a first electrical contact carried by the insulated metal substrate and a second electrical contact carried by the composite material substrate and the bolt is configured to clamp the composite material substrate to the insulated metal substrate to force the electrically conductive sleeve against the first electrical contact and the second electrical contact.

Method of fitting the soldering component to board

A soldering component and a method of fitting it to boards are introduced. The soldering component includes a body and a fitting portion. The fitting portion is fitted to an object. The body has an engaging portion with an elastic retraction space conducive to elastic retraction of two or more engagement portions, allowing the engagement portions to engage with another object. The soldering component has a weldable surface to be soldered to a weldable surface of the object. The weldable surface of the object has a built-in solder layer adapted to be heated for soldering the soldering component and the weldable surface of the object together. The soldering component is disposed in a carrier, taken out with a tool, compared with the object by a comparison device to determine a fitting position on the object, positioned at the fitting position with the tool, thereby being fitted to the object.

Method of fitting soldering component to board

A soldering component and a method of fitting it to boards are introduced. The soldering component includes a body and a fitting portion. The fitting portion is fitted to an object. The body has an engaging portion with an elastic retraction space conducive to elastic retraction of two or more engagement portions, allowing the engagement portions to engage with another object. The soldering component has a weldable surface to be soldered to a weldable surface of the object. The weldable surface of the object has a built-in solder layer adapted to be heated for soldering the soldering component and the weldable surface of the object together. The soldering component is disposed in a carrier, taken out with a tool, compared with the object by a comparison device to determine a fitting position on the object, positioned at the fitting position with the tool, thereby being fitted to the object.

Electromagnetic compatibility gasket and vent

A chassis-mounted electronic device includes a conductive chassis, an upper EMI gasket, and a lower EMI gasket. An upper chassis and a lower chassis of the conductive chassis are coupled to form an interior of the chassis housing an electronic device. The upper EMI gasket is attached to the upper chassis, and resiliently contacts a portion of the electronic device. The lower EMI gasket is attached to the lower chassis, and resiliently contacts a different portion of the electronic device. The upper and lower EMI gaskets include perforations to allow cooling air through the EMI gaskets and into the interior of the chassis. The conductive chassis, the upper EMI gasket, and the lower EMI gasket provide EMI shielding for the electronic device.

CAMERA MODULE WITH IMAGING SENSOR AND LIGHT EMITTER
20220294938 · 2022-09-15 ·

A camera module includes an imaging sensor, a light emitter, and a circuit board. The circuit board includes first and second rigid printed wiring boards. A surface of the first rigid printed wiring board on which the imaging sensor is mounted has a holder which is configured to hold the second rigid printed wiring board in a state in which a surface of the second rigid printed wiring board on which the light emitter is mounted and the surface on which the imaging sensor is mounted face the same direction. The holder is arranged at a position which is different from the imaging sensor, and holds the second rigid printed wiring board at a height higher than the surface of the first rigid printed wiring board.

Implantable connector including at least one electrical component
11450977 · 2022-09-20 · ·

An implantable connector for connecting an electronics package and a neural interface is made by way of a compressible contacts (e.g., a spring) that physical contacts a corresponding exposed bond pad. The compressible contact is held in compression with the exposed bond pad using a mechanical coupler. The compressible contact is physically separated and electrically isolated from other contacts by way of a compressible gasket. The compressible gasket is also held in compression using the mechanical coupler.

Method of assembling fastener structure on plate body
11441595 · 2022-09-13 · ·

A method of assembling a fastener structure on a plate body is introduced. The fastener structure includes a body portion and a fastening body. The body portion has a solderable layer, and the solderable layer is soldered to a plate body. The fastening body combines movably with the body portion. The fastening body has a head and a fastening portion. The body portion or the fastening body is provided on the plate body for soldering after it is picked up by a tool so that the body portion can combine with the plate body. Also, the body portion or the fastening body combines with an assisting pickup unit, and the fastener structure is provided on the plate body for soldering after it is picked up by a tool through the assisting pickup unit so that the body portion can combine with the plate body.

Camera module with imaging sensor and light emitter

A camera module includes an imaging sensor, a light emitter, and a circuit board. The circuit board includes first and second rigid printed wiring boards, and a foldable flexible printed wiring board connecting the two. A surface of the first rigid printed wiring board on which the imaging sensor is mounted has a holder which is configured to hold the second rigid printed wiring board in a state in which a surface of the second rigid printed wiring board on which the light emitter is mounted and the surface on which the imaging sensor is mounted face the same direction. The holder is arranged at a position which is different from the imaging sensor, and holds the second rigid printed wiring board at a height higher than the surface of the first rigid printed wiring board.