According to an example, an air dielectric printed circuit board (PCB) may include a first PCB layer including a first substrate and a first conductive layer formed of a first conductive material, and a second PCB layer including a second substrate and a second conductive layer formed of a second conductive material. The second conductive layer may be disposed in a directly facing configuration relative to the first conductive layer, and at a predetermined distance away from the first conductive layer to provide an air dielectric gap between the first and second conductive layers. The air dielectric PCB may further include a standoff that includes a first end and a second end that is opposite to the first end. The standoff may be attached to the first and second PCB layers respectively at the first and second ends thereof, and may include a predetermined length to maintain the predetermined distance.

An electronic cable system operates as an extension cable to facilitate external viewing of internal infrastructure LED status. A wired cable is provided having a first end and a second end, the first end including a first I/O coupler, LED detectors and a power jack; and the second end including a second I/O coupler and a plurality of LEDs. The plurality of LEDs of the second end illuminate in response to activation of the LED detector of the first end. The first I/O coupler may plug into an internal module of electronic infrastructure, such as a server, to detect operational status of the internal module via the LED detectors. The second I/O coupler may couple to infrastructure housing, permitting the plurality of LEDs to be viewed externally of the housing. The plurality of external LEDs on the infrastructure housing mimic internal (non-viewable) status indicator LEDs of the internal module.

A mounting structure includes a bonding material (106) that bonds second electrodes (104) of a circuit board (105) and bumps (103) of a semiconductor package (101), the bonding material (106) being surrounded by a first reinforcing resin (107). Moreover, a portion between the outer periphery of the semiconductor package (101) and the circuit board (105) is covered with a second reinforcing resin (108). Even if the bonding material (106) is a solder material having a lower melting point than a conventional bonding material, high drop resistance is obtained.

A compact solid state relay (7) is provided. Solid state devices (74, 75), such as Triacs or Thyristors are used to implement the relay functionality. The device is at least partially enclosed in a housing that has pins for mounting on an electronics board. A number of “U” shaped jumpers (72) or other jumpers or wires are provided in the housing to act as heat sinks. A subminiature fan (70) is positioned to create an air flow over the heat sinks and dissipate heat from the device.

The present disclosure is related to a power module includes a first printed circuit board (PCB), a second PCB, a magnetic component and a connecting component. A secondary side switch set and a winding are disposed on the first PCB, respectively. A primary side switch set is disposed on the second PCB adjacent to the first PCB. A magnetic component includes an upper magnetic cover disposed on the first side of the first PCB; a lower magnetic cover disposed between the first PCB and the second PCB; and a lateral column located between the two magnetic covers. The lateral column passes through the first PCB, and is fastened with the two magnetic covers. The magnetic component and the winding collaboratively form a transformer. The connecting component is disposed between the two PCBs to connect the corresponding potential points of the two PCBs.

IC device assemblies including a power delivery bus board that is mounted to a primary PCB (i.e., motherboard) that further hosts a power-sink device and a power-source device. The bus board, as a secondary PCB, may be surface-mounted on a back side of the primary PCB opposite the power source and sink devices, which are mounted on the front side of the primary PCB. The bus board need only be dimensioned so as to bridge a length between first and second back-side regions of the primary PCB that are further coupled to a portion of the front-side pads employed by the power-sink device. The secondary PCB may be purpose-built for conveying power between the source and sink devices, and include, for example, short, wide traces, that may be formed from multiple heavyweight metallization layers.

A three-dimensional mounting structure includes a first mounting component, a second mounting component facing the first mounting component, a connecting layer disposed between the first mounting component and the second mounting component, a third mounting component, an adhesive layer, and a barrier sheet. The first mounting component includes a first end surface. The third mounting component is bonded on the first end surface through the adhesive layer. The connecting layer includes a second end surface close to the first end surface. The three-dimensional mounting structure can avoid the adhesive layer overflowing from the first end surface to the second end surface and improve the electronic product yield. A method for assembling the three-dimensional mounting structure is also disclosed.

Passive device assembly for accurate ground plane control is disclosed. A passive device assembly includes a device substrate conductively coupled to a ground plane separation control substrate. A passive device disposed on a lower surface of the device substrate is separated from an embedded ground plane mounted on a lower surface of the ground plane separation control substrate by a separation distance. The separation distance is accurately controlled to minimize undesirable interference that may occur to the passive device. The separation distance is provided inside the passive device assembly. Conductive mounting pads are disposed on the lower surface of the ground plane separation control substrate to support accurate alignment of the passive device assembly on a circuit board. By providing sufficient separation distance inside the passive device assembly, the passive device assembly can be precisely mounted onto any circuit board regardless of specific design and layout of the circuit board.

Disclosed is a method for manufacturing a substrate gap supporter. The method includes: a first step of forming metal foils on both sides of an insulating plate; a second step of etching the metal foils to expose the insulating plate so that a plurality of stripes are arranged on both sides of the insulating plate in parallel at constant intervals, wherein the stripes expose the insulating plate at constant widths; and a third step of cutting in direction in parallel with the stripes and in direction in vertical with the stripes along one edges of the stripes to complete the gap supporter.

The disclosure provides a display device including a first substrate, a display region disposed above the first substrate; a second substrate; a sealant disposed between the first substrate and the second substrate and outside the display region; and, a plurality of spacers disposed within the sealant. In particular, the first substrate and the second substrate are bonded together via the sealant. Further, the first substrate has a side wall including a first cutting crack surface and a first median crack surface, wherein a roughness of the first cutting crack surface is different from that of the first median crack surface.