An embodiment includes generating a sense signal that represents a first vibration of a platform, and reducing a level of the first vibration by generating, in response to the sense signal, a second vibration in the platform. For example, a sensor generates a sense signal representing a first vibration induced (e.g., a shock-induced vibration) in the platform. And a vibration-cancel circuit reduces or eliminates a level of the first vibration in response to the sense signal. For example, the vibration-cancel circuit reduces a magnitude of a first vibration induced in a platform, or eliminates the first vibration altogether, by generating, in the platform, a second vibration having a magnitude approximately equal to the magnitude of the first vibration and having a phase approximately opposite to the phase of the first vibration. That is, the second vibration cancels the first vibration to reduce the net vibration that the platform experiences.

An anti-vibration and heat dissipation structure for a memory socket includes a circuit board, a heat dissipation pad, and a heat dissipation shell. The circuit board includes memory sockets for insertions of memory modules. The heat dissipation pads are disposed on upper and lower surfaces of memory modules, respectively, to upwardly conduct heat, generated by the memory modules to the topmost heat dissipation pad via a stack structure of the memory modules and the heat dissipation pads. The heat dissipation shell comprises a maintenance window, and a cover board disposed on the maintenance window and having a bottom surface abutted with the topmost heat dissipation pad, to form a vertical position-limiting and anti-vibration structure to conduct heat to the heat dissipation shell via the cover board for dissipation, and easy maintenance of the memory modules via the maintenance window is also achieved.

A multilayer electronic component includes a capacitor body having first to six surfaces, the capacitor body including a dielectric layer and first and second internal electrodes having one ends exposed through the third and fourth sides, respectively, first and second external electrodes including first and second connection portions disposed on the third and fourth surfaces of the capacitor body, respectively, and first and second band portions spaced apart from each other on the first surface of the capacitor body, respectively, a first connection terminal disposed on the first band portion and having a first cutout disposed in a lower surface thereof, open toward the third surface of the capacitor body, and a second connection terminal disposed on the second band portion and having a second cutout formed in a lower surface thereof, open toward the fourth surface of the capacitor body.

A printed circuit board includes: a first insulating substrate having a mounting hole that penetrates through the first insulating substrate from a first surface to a second surface; a second insulating substrate including a connection portion; a first electrode provided on the second surface and disposed at an edge of the mounting hole; a second electrode provided on the connection portion and joined to the first electrode; and an electronic component provided on the second surface. A center of mass of the second insulating substrate is disposed on the first surface of the first insulating substrate. A center of mass of the electronic component is disposed on the second surface of the first insulating substrate. The electronic component has a weight equivalent to a weight of the second insulating substrate.

An active noise reduction system includes a substrate, a number of capacitors mounted on the substrate, a noise sensor mounted on the substrate and used to collect a noise signal around the noise sensor, an actuator mounted on the substrate and used to generate vibrations, and a controller mounted on the substrate and electrically coupled to the noise sensor and the actuator. The controller is used to obtain the noise signal collected by the noise sensor and generate a control signal according to the noise signal to the actuator to control the actuator to generate vibrations having a same frequency and opposite phase as the noise signal to cancel out the vibrations generated by the plurality of capacitors and the vibrations of the substrate caused by the vibrations generated by the plurality of capacitors. An electronic device and an active noise reduction method are also provided.

An electronic component includes a multilayer capacitor, including a capacitor body and first and second external electrodes disposed on both ends of the capacitor body, respectively, in a first direction, and a interposer including an interposer body and first and second external terminals in a second direction. The capacitor body includes a plurality of dielectric layers and a plurality of first and second internal electrodes exposed through the both ends of the capacitor body, respectively. The first and second external terminals each include a first layer including CuNi, a second layer covering the first layer and including copper (Cu), a third layer covering the second layer and including nickel (Ni), and a fourth layer covering the third layer and including tin (Sn), which are sequentially disposed from a respective inner side of the first and second external terminals.

An electronic component includes a multilayer capacitor and an interposer. First and second internal electrodes of the multilayer capacitor are such that 0.95≤{(Wm1+Wm2)/Wa}/{(Lm1+Lm2)/La}≤4.93, in which Lm2 is a distance between a first internal electrode and a fourth surface of a capacitor body, Lm1 is a distance between a second internal electrode and a third surface of the capacitor body opposite the fourth surface in a first direction, Wm1 is a distance between the first or second internal electrode and a second surface of the capacitor body, Wm2 is a distance between the first or second internal electrode and a first surface of the capacitor body opposite the second surface in a third direction, La is a length in the first direction of a region of overlap of the first and second internal electrodes, and Wa is a length in the third direction of the region of overlap.

Relatively low noise capacitors are provided for surface mounted applications. Electro-mechanical vibrations generate audible noise, which are otherwise relatively reduced through modifications to MLCC device structures, and/or their mounting interfaces on substrates such as printed circuit boards (PCBs). Different embodiments variously make use of flexible termination compliance so that surface mounting has reduced amplitude vibrations transmitted to the PCB. In other instances, side terminal and transposer embodiments effectively reduce the size of the mounting pads relative to the case of the capacitor, or a molded enclosure provides standoff, termination compliance and clamping of vibrations.

The invention relates to a circuit arrangement, comprising at least one wiring carrier plate (1), characterized by at least one separating element (2) formed in the wiring carrier plate (1), which separating element divides the wiring carrier plate (1) into sections separated by the separating element (2), wherein the transfer of vibrations from one section to another section is at least partially decoupled and/or damped by the separating element (2). The invention further relates to a converter having such a circuit arrangement, and to an aircraft having a converter. The converter can comprise capacitor stacks (3) arranged on the wiring carrier plate (1), and power semiconductors (6).

A composite electronic component includes a composite body including a multilayer ceramic capacitor including a first ceramic body in which dielectric layers and internal electrodes disposed to oppose each other with a respective one of the dielectric layers interposed therebetween are layered, and first and second external electrodes disposed on both ends of the first ceramic body; and a ceramic chip disposed below the multilayer ceramic capacitor and including a second ceramic body including ceramic, and first and second terminal electrodes disposed on both ends of the second ceramic body and respectively connected to the first and second external electrodes. A ratio (G1/M1) of a spacing distance (G1) between the first ceramic body and the second ceramic body in a thickness direction to a length (M1) of a margin portion between the internal electrode and a lower surface of the first ceramic body satisfies 1.0 to 2.5.