H05K2201/2054

PACKAGE STRUCTURE

In an embodiment, a package structure including an electro-optical circuit board, a fanout package disposed over the electro-optical circuit board is provided. The electro-optical circuit board includes an optical waveguide. The fanout package includes a first optical input/output portion, a second optical input/output portion and a plurality of electrical input/output terminals electrically connected to the electro-optical circuit board. The first optical input/output portion is optically coupled to the second optical input/output portion through the optical waveguide of the electro-optical circuit board.

REFLECTIVE COMPOSITE MATERIAL, IN PARTICULAR FOR SURFACE-MOUNTED DEVICES (SMD), AND LIGHT-EMITTING DEVICE WITH A COMPOSITE MATERIAL OF THIS TYPE
20210167262 · 2021-06-03 ·

A reflective composite material with a carrier consisting of aluminum with, on one side (A) of the carrier, an interlayer made of aluminum oxide, and with, above the interlayer, an optically active reflection-boosting multilayer system. In order to provide a high-reflectivity composite material of this kind which exhibits improved electrical connectivity when surface-mounting procedures are used, it is proposed that the thickness of the interlayer is in the range 5 nm to 200 nm, and that a layer of a metal or a metal alloy has been applied superficially on side (B) of the carrier that is opposite to the optically active reflection-boosting multilayer system, where the electrical resistivity at 25° C. of the metal or metal alloy is at most 1.2×10.sup.−1 Ω mm.sup.2/m, where the thickness of the layer applied superficially is in the range 10 nm to 5.0 μm.

SUBSTRATE FOR MOUNTING A LIGHT-EMITTING ELEMENT AND CIRCUIT BOARD FOR MOUNTING A LIGHT-EMITTING ELEMENT THAT INCLUDES IT, AND LIGHT-EMITTING ELEMENT MODULE
20210159375 · 2021-05-27 · ·

A substrate for mounting a light-emitting element according to the present disclosure contains a crystal particle of aluminum oxide and is composed of an alumina-based ceramic that contains 97% by mass or more of Al as a value of an Al.sub.2O.sub.3 equivalent among 100% by mass of all components thereof. An average value of an equivalent circle diameter of the crystal particle is 1.1 μm or greater and 1.8 μm or less and a standard deviation of an equivalent circle diameter thereof is 0.6 μm or greater and 1.4 μm or less.

LED light engine features

A lighting engine, system and method of fabrication are described. The engine contains a chassis having a side wall and bottom surface that define a cavity. A recess is formed in the bottom surface. A flexible printed circuit (FPC) is on the side wall and LEDs are mounted on the FPC to emit light toward a center of the cavity. A light guide positioned within the cavity receives light emitted by the LEDs through an edge of the light guide. A gasket disposed within the recess is in contact with a first surface of the light guide. A reflector within the cavity is adjacent to a second surface of the light guide opposite the first surface of the light guide. A backplate is attached to the chassis and configured to seal the cavity. Other apparatuses, systems, and methods are also disclosed.

LED lighting apparatus
10976011 · 2021-04-13 · ·

An LED lighting apparatus is disclosed. The LED lighting apparatus includes a substrate having a first surface; at least one connection body formed by LED chips arranged side by side in a first direction over the first surface of the substrate; and a circular protruding portion, arranged over the first surface of the substrate, surrounding the plurality of LED chips. The LED lighting apparatus further includes a first wiring pattern, arranged over the first surface of the substrate; and a second wiring pattern, arranged over the first surface of the substrate and spaced apart from the first wiring pattern.

Package structure

In an embodiment, a package structure including an electro-optical circuit board, a fanout package disposed over the electro-optical circuit board is provided. The electro-optical circuit board includes an optical waveguide. The fanout package includes a first optical input/output portion, a second optical input/output portion and a plurality of electrical input/output terminals electrically connected to the electro-optical circuit board. The first optical input/output portion is optically coupled to the second optical input/output portion through the optical waveguide of the electro-optical circuit board.

Integrated Electro-Optical Flexible Circuit Board
20210120680 · 2021-04-22 ·

An integrated electro-optical circuit board comprises a first flexible substrate having a top side and a bottom side, at least one first optical circuit on the bottom side of the first flexible substrate connected to the top surface through a filled via, at least one first metal trace on the top side of the first flexible substrate, an optical adhesive layer connecting the bottom side of the first flexible substrate to a top side of a second flexible substrate, and at least one second metal trace on a bottom side of the second flexible substrate connected by a filled via through the second flexible substrate, the optical adhesive layer, and the first flexible substrate to the at least one first metal trace.

LIGHT-EMITTING DEVICE AND THE METHOD OF MANUFACTURING THE SAME
20210043610 · 2021-02-11 ·

The present application discloses a light-emitting device including a first support structure having a first surface, a plurality of light-emitting elements arranged on the first surface, and a first adhesive layer arranged on the first support structure. Each light-emitting element has a side wall, a bottom surface, a first electrode pad, and a second electrode pad arranged on the bottom surface. The first adhesive layer surrounds the side wall and does not directly contact the bottom surface. The first support structure includes a plurality of through holes located on positions corresponding to the first electrode pad and the second electrode pad.

FLUOROPOLYMER COMPOSITION FOR COMPONENTS OF LIGHT EMITTING APPARATUS

The invention pertains to a white pigmented fluoropolymer composition comprising certain thermoprocessable tetrafluoroethylene copolymers, certain amounts of specific PTFE micropowders, which possesses advantageous properties for being used for manufacturing shaped articles, and to shaped articles therefrom, including components of light emitting apparatuses, e.g. LED assemblies, including those having junctions emitting in the UV region.

Sealed and sealable scalable lighting systems incorporating flexible light sheets and related methods

In accordance with certain embodiments, systems of lighting components feature multiple illumination panels each having a backing support and, secured thereto, multiple illumination elements. The illumination elements have shapes defined by arrangements of illumination unit cells may be assembled to illuminate an arbitrary two-dimensional area.