Surface-treated copper foils exhibiting a void volume (Vv) in a range of 0.4 to 2.2 m.sup.3/m.sup.2 and an arithmetic mean waviness (Wa) lower than or equal to 0.4 m are reported. Where the surface-treated copper foil is treated on the drum side and includes a treatment layer comprising a nodule layer. Such surface-treated copper foils can be used as a conductive material having low transmission loss, for example in circuit boards.

Surface-treated copper foils that exhibit a material volume (Vm) less than 1.90 m.sup.3/m.sup.2. Where the surface-treated copper foil is treated on the drum side and includes a treatment layer comprising a nodule layer. Such surface-treated copper foils can be used as a conductive material having low transmission loss, for example in circuit boards.

Surface-treated copper foils that exhibit a material volume (Vm) in a range of 0.05 to 0.6 m.sup.3/m.sup.2 and a yellowness index (YI) in a range of 17 to 52 are reported. Where the surface-treated copper foil is treated on the deposited side and includes a treatment layer comprising a nodule layer. Such surface-treated copper foils can be used as a conductive material having low transmission loss, for example in circuit boards.

Curable printing ink compositions include a visible light transparent, UV-curable binder composition and a visible light transparent, and infrared light absorbing inorganic composition. The infrared light absorbing inorganic composition can include infrared absorbing nanoparticles. The ink compositions are capable of flexographic printing at room temperature to a thickness of at least 1.0 micrometer. The cured ink composition has an infrared absorbance of at least 50%. The ink compositions can be printed in patterns of geometric features and cured to form articles.

A backlight unit includes a plurality of light emitting diode (LED) packages on a top surface of a circuit board, an encapsulation member located on the circuit board and covering the plurality of LED packages, and an integrated pattern sheet on the encapsulation member. The integrated pattern sheet includes a base layer, a plurality of reflective patterns at a bottom surface of the base layer and respectively corresponding to the plurality of LED packages, and a plurality of diffusion patterns at a top surface of the base layer, wherein the reflective patterns are configured with a relational expression of c+(t2t1)*tan {(sin.sup.1(1/n)}>d<1.8p, where c, t1 and p are a width, a height and a pitch of the LED package, respectively, t2 and n are a height and a refractive index of the encapsulation member, respectively, and d is a width of the reflective pattern.

An LED lighting apparatus is disclosed. The LED lighting apparatus includes a substrate having a first surface; at least one connection body formed by LED chips arranged side by side in a first direction over the first surface of the substrate; and a circular protruding portion, arranged over the first surface of the substrate, surrounding the plurality of LED chips. The LED lighting apparatus further includes a first wiring pattern, arranged over the first surface of the substrate; and a second wiring pattern, arranged over the first surface of the substrate and spaced apart from the first wiring pattern.

A substrate structure with high reflectance includes a base material, a patterned circuit layer, an insulating layer and a metal reflecting layer. The base material includes a first surface and a second surface opposite to the first surface. The patterned circuit layer is disposed on the first surface. The insulating layer covers the patterned circuit layer and a part of the first surface exposed by the patterned circuit layer. The metal reflecting layer covers the insulating layer, and a reflectance of the metal reflecting layer is substantially greater than or equal to 85%. A manufacturing method of a substrate structure with high reflectance is also provided.

A component assembly includes a body having an electronics component mounted on a first face of the body. A light emitting diode is mounted on a first portion of the first face. A top plate is attached to the body and covers the light emitting diode and the electronics component. The top plate includes: a first cavity having the electronics component positioned within the first cavity; and a first support area homogeneously connected to the top plate and extending from the top plate to directly contact the body outside of the cavity to provide support for the top plate and to mitigate against collapse of the cavity.

A circuit board according to the present disclosure includes a substrate, a conductor layer arranged on the substrate, a reflective layer arranged on the conductor layer, and a silicone-resin layer arranged on the substrate. The silicone-resin layer is in contact with the conductor layer and the reflective layer. The silicone-resin layer contains equal to or more than 45% by mass of a plurality of fillers. A first filler whose aspect ratio is larger than 5 occupies equal to or more than 5% of 100% of a total number of the fillers.

A substrate structure with high reflectance includes a base material, a patterned circuit layer, an insulating layer and a metal reflecting layer. The base material includes a first surface and a second surface opposite to the first surface. The patterned circuit layer is disposed on the first surface. The insulating layer covers the patterned circuit layer and a part of the first surface exposed by the patterned circuit layer. The metal reflecting layer covers the insulating layer, and a reflectance of the metal reflecting layer is substantially greater than or equal to 85%. A manufacturing method of a substrate structure with high reflectance is also provided.