Linear lighting with a mirrored coating is disclosed, as is a luminaire including the linear lighting.

An LED light apparatus includes a back cover, a surrounding wall, a light source and a surface ring. The back cover has a top side and a back cover inner side. The surrounding wall is connected to the back cover. The light source is fixed to an inner wall side of the surrounding wall. The surface ring has a surface ring inner side connected to the surrounding wall. The surface ring inner side, the inner wall side and the back cover inner side form a light movement space. The back cover inner side has a three-dimension curve surface for reflecting light to the light opening of the surface ring.

A light emitting device and a keyboard structure are provided. The light emitting device includes a circuit board and multiple light emitting units. The circuit board includes a substrate, a first conductive pad, multiple second conductive pads, and multiple third conductive pads. The first conductive pad and the second conductive pads are disposed on a first board surface of the substrate. The first conductive pad has a symmetrical shape and a symmetrical axis. The symmetrical axis passes through the second conductive pads. The third conductive pads are disposed on a second board surface of the substrate. Each of the third conductive pads is electrically coupled to the first conductive pad and the second conductive pads by multiple conductive columns. Each of the light emitting units is connected to the first conductive pad and one of the second conductive pads.

The invention provides a lighting device (1000) comprising (i) a light source (100) configured to generate light source light (101), wherein the light source (100) comprises a solid state light source, and (ii) a support (200) configured to support the light source (100), wherein the support (200) comprises a metal based thermally conductive material (201), wherein the lighting device (1000) further comprises (iii) a layered element (300), configured in physical contact with the support (200), wherein the layered element (300) comprises one or more layers (310), wherein the layered element (300) at least comprises an electrically insulating first layer (311), wherein at least part of the layered element (300) is configured between the light source (100) and the support (200) such that during operation part of the light source light (101) irradiates the layered element (300), wherein the layered element (300) comprises light reflective particles (410), wherein at least 50 wt. % of the particles have a flake-like shape.

An LED module, including a carrier having high reflectivity, wherein a metal layer, preferably a silver layer or a layer of high-purity aluminum, is applied to the carrier. Also disclosed is an LED module, including a carrier having high reflectivity, wherein a metal layer is applied to the carrier, at least one LED chip, and a dam, wherein the metal layer partially covers the surface of the carrier lying under the dam.

Electrodeposited copper foils having properties suitable for use as negative electrode current collectors in lithium-ion secondary batteries are disclosed. The copper foil has a yield strength in the range of 11 to 45 kg/mm.sup.2, and a difference in residual stress between the drum side and the deposited side of at most 95 MPa. Negative electrode current collectors for lithium-ion secondary battery, a lithium-ion secondary battery incorporating the negative electrode, and batteries containing the negative electrode current collector are also disclosed.

An LED light apparatus includes a back cover, a surrounding wall, a light source and a surface ring. The back cover has a top side and a back cover inner side. The surrounding wall is connected to the back cover. The light source is fixed to an inner wall side of the surrounding wall. The surface ring has a surface ring inner side connected to the surrounding wall. The surface ring inner side, the inner wall side and the back cover inner side form a light movement space. The back cover inner side has a three-dimension curve surface for reflecting light to the light opening of the surface ring.

A product and a method of manufacturing a product are provided, in which a 3D structure (26) is printed over a printed circuit board (20). An adhesion layer (24) is provided between them. One of the interfaces to the adhesion layer (24) comprises a cavity structure (22). This improves adhesion and releases stress build up in the printed circuit board (20).

A cultivation system includes a light-emitting apparatus and an installation stand configured to accommodate a plurality of irradiation targets which are to be irradiated with light emitted from the light-emitting apparatus. The light-emitting apparatus includes a drive circuit, an electrically conductive member connected to the drive circuit and extending in a predetermined direction, a plurality of first members configured to be disposed at desired positions of the electrically conductive member, each of the plurality of first members including a light source, and a holder configured to hold the plurality of first members in a state where the plurality of first members are disposed at the desired positions of the electrically conductive member. The installation stand defines a plurality of installation place in which the plurality of irradiation targets are accommodated, respectively.

An optical device (1) includes two prism bodies (41, 42) and four side panels (71-74) attached to both prism bodies (41, 42). A cavity (9) is thereby enclosed. A first reflector (81) can be present at a first side face (81) of the first prism body (41), and a second reflector (82) can be present at a second side face (82) of the second prism body (42). At least one of the prism bodies (41, 42) and/or at least one of the side panels (71-74) can be at least in part made of a non-transparent dielectric material such as a printed circuit board. In some implementations, an optoelectronic component (90) can be attached to the respective constituent of the optical device (1).