A circuit board having a high reflectivity includes a wiring board, a first solder resist layer, and a second solder resist layer. The wiring board includes a wiring layer on an outer side, the wiring layer including wiring and a bond pad spaced from the wiring. The first solder resist layer, with opening and groove, covers the wiring layer, the bond pad is exposed from the opening but spaced from the first solder resist layer. The second solder resist layer infills the groove and covers the first solder resist layer but does not make contact with the mounting surface of the bond pad. A method for manufacturing such circuit board is also disclosed.

A first and second patterned circuit layer are formed on a first surface and a second surface of a base material. A first adhesive layer is formed on the first patterned circuit layer. A portion of the first surface is exposed by the first patterned circuit layer. The metal reflection layer covers the first insulation layer and a reflectance thereof is greater than or equal to 85%, there is no conductive material between the first patterned circuit layer and the metal reflection layer, and the first adhesive layer is disposed between the first patterned circuit layer and the first insulation layer. A transparent adhesive layer and a protection layer are formed on the metal reflection layer. The transparent adhesive layer is disposed between the metal reflection layer and the protection layer. The protection layer comprises a transparent polymer. The light transmittance is greater than or equal to 80%.

Provided are an electrodeposited copper foil, an electrode comprising the same, and a lithium-ion secondary battery comprising the same. The electrodeposited copper foil has a drum side and a deposited side opposing the drum side, wherein at least one of the drum side and the deposited side exhibits a void volume value (Vv) in the range of 0.17 μm.sup.3/μm.sup.2 to 1.17 μm.sup.3/μm.sup.2; and an absolute value of a difference between a maximum height (Sz) of the drum side and a Sz of the deposited side is in the range of less than 0.60 μm.

An optical circuit substrate according to the present disclosure includes a wiring board and an optical waveguide. The optical waveguide includes a core layer, cladding layers formed on both main surfaces of the core layer, and a reflective mirror portion that passes through the cladding layers and the core layer, and is provided on the wiring board via a conductor layer located on a surface of the wiring board. When the optical waveguide is viewed in a cross section in a thickness direction, the reflective mirror portion has a recessed portion in at least a part of the cladding layer on the conductor layer side.

Provided is a display apparatus including a liquid crystal panel, a substrate disposed under the liquid crystal panel, and a reflective sheet provided with a hole and disposed on a first side of the substrate. The substrate may include at least one feed portion and at least one antistatic portion. A light source module may be disposed within an area defined by the hole of the reflective sheet on the first side of the substrate. The light source module may be provided with a light emitting diode and an insulating dome covering the light emitting diode such that the at least one feed portion is disposed on the first side of the substrate and is in contact with the light emitting diode of the light source module, and the at least one antistatic portion may be disposed within the area defined by the hole of the reflective sheet.

A circuit board with high light reflectivity includes an inner wiring base board, a base board with a high light reflectivity, a first insulation layer, a first conductor layer, and a second insulation layer. A first opening in the inner wiring base board receives the base board. The first insulation layer is stacked on a surface of the inner wiring base board and defines a second opening corresponding in position to the first opening and exposing a portion of the base board. The first conductor layer is on a surface of the first insulation layer away from the inner wiring base board and includes connecting pads on the base board. The second insulation layer and the second conductor are stacked in that order on another surface of the inner wiring base board. A method for manufacturing the circuit board is also disclosed.

A backlight assembly and a display device are provided. The backlight assembly includes a light guide plate, a light source, and a first reflector sheet. The light guide plate includes a bottom surface and a light emitting surface opposite to each other, and a light incident surface intersecting the bottom surface and the light emitting surface. The light source is on the light incident surface of the light guide plate. The first reflector sheet is on the bottom surface of the light guide plate and at an end of the light guide plate distal to the light source. The backlight assembly further includes a second reflector sheet proximal to the light source. The second reflector sheet is on the bottom surface and/or the light emitting surface of the light guide plate, and a reflectivity of the second reflector sheet is greater than 90%.

A substrate for mounting a light-emitting element according to the present disclosure contains a crystal particle of aluminum oxide and is composed of an alumina-based ceramic that contains 97% by mass or more of Al as a value of an Al.sub.2O.sub.3 equivalent among 100% by mass of all components thereof. An average value of an equivalent circle diameter of the crystal particle is 1.1 μm or greater and 1.8 μm or less and a standard deviation of an equivalent circle diameter thereof is 0.6 μm or greater and 1.4 μm or less.

An optoelectronic device (LV) with a reflective composite material (V) having a carrier (1) consisting of aluminium, having an interlayer (2) composed of aluminium oxide present on one side (A) of the carrier (1) and having a reflection-boosting optically active multilayer system (3) that has been applied via the interlayer (2). The interlayer (2) consisting of aluminium oxide has a thickness (D.sub.2) in the range from 5 nm to 200 nm and that, on the opposite side (B) of the carrier (1) from the reflection-boosting optically active multilayer system (3), a superficial layer (9) of a metal or metal alloy having, at 25° C., a specific electrical resistivity of not more than 1.2*10.sup.−1 Ωmm.sup.2/m has been applied. The thickness (D.sub.9) of the superficially applied layer (9) is in the range from 10 nm to 5.0 μm. For an optoelectronic device (LV), the leadframe (LF) has a metallic material with an aluminium carrier (1), on the surface (A) of which a metallic joining layer (FA) not consisting of aluminium has been applied locally at the bonding site (SP) of an electronic surface-mounted device (SMD) to a wire (D).

Lighting module disclosed in an embodiment of the invention, a substrate; a plurality of light emitting devices disposed on the substrate; a first reflective layer disposed on the substrate; a resin layer disposed on the first reflective layer and the light emitting device; and a second reflective layer disposed on the resin layer, wherein the resin layer is a front side surface on which light generated from the plurality of light emitting devices is emitted, a rear side surface facing the front side surface, and first and second side surfaces connecting the front side surface and the rear side surface with each other. A distance between the first reflective layer and the second reflective layer is smaller than a distance between the front side surface and the rear side surface of the resin layer, and the front side surface of the resin layer has a plurality of convex portions convex toward the front side surface from the light emitting device and a plurality of concave portions recessed in a direction of the rear side surface.