A method of making a printed circuit board and a printed circuit board including a plurality of plastic substrate parts having one or more first substrate parts each having at least one coupling means, and one or more second substrate parts each having at least one receiving means to receive the coupling mean. At least one of the plurality of plastic substrate parts is formed with a further structural element, and at least two of the plurality of plastic substrate parts are connected to each other through the at least one coupling means and the at least one receiving means. The connected substrate parts include a circuit.

The present invention relates to a selectively conductive toy building element, comprising: a body adapted for releasable engagement to at least one other toy building element body or to a corresponding baseplate, the body including at least one conductive portion having at least one contact area adapted to generate pressure on a conductive portion or contact area of an adjacent toy building element body, in such a way that ensures electrical conduction between said toy building elements in a desired location and direction.

A light source module includes a circuit board having a plurality of chip mounting regions, the plurality of chip mounting regions respectively having at least one connection pad; at least one alignment component respectively disposed on the plurality of chip mounting regions, and having a convex or concave shape; and a plurality of LED chips respectively mounted on the plurality of chip mounting regions, respectively having at least one electrode electrically connected to the at least one connection pad, and respectively coupled to the at least one alignment component.

Printed circuit board pad layouts and mechanical retainers are disclosed herein. For example, a printed circuit board is disclosed having a row of electrically conductive pads, the row of pads including pairs of signal pads with exactly one reference pad interposed between each pair of the signal pads. As another example, a mechanical retainer is disclosed that may assist in interconnecting two printed circuit boards and that has a longitudinal body with a threaded end, a head at an end opposite the threaded end, and a shank connecting the head to the threaded end.

A light source module includes a circuit board having a plurality of chip mounting regions, the plurality of chip mounting regions respectively having at least one connection pad; at least one alignment component respectively disposed on the plurality of chip mounting regions, and having a convex or concave shape; and a plurality of LED chips respectively mounted on the plurality of chip mounting regions, respectively having at least one electrode electrically connected to the at least one connection pad, and respectively coupled to the at least one alignment component.

A combined wiring board has multiple piece components each including a wiring board, and a frame component having an accommodation opening portion and holding the multiple piece components in the accommodation opening portion such that each of the piece components is fixed to the frame component at an outer rim of each of the piece components. The frame component has a thermal expansion coefficient in a planar direction which is set higher than a thermal expansion coefficient of the multiple piece components in the planar direction.

Printed circuit board pad layouts and mechanical retainers are disclosed herein. For example, a printed circuit board is disclosed having a row of electrically conductive pads, the row of pads including pairs of signal pads with exactly one reference pad interposed between each pair of the signal pads. As another example, a mechanical retainer is disclosed that may assist in interconnecting two printed circuit boards and that has a longitudinal body with a threaded end, a head at an end opposite the threaded end, and a shank connecting the head to the threaded end.

A connector device for connection with a counter piece for establishing a mechanical and electric connection, wherein the connector device comprises at least two printed circuit board elements each comprising an electrically insulating core and at least one comprising an electrically conductive structure at least partially on the respective electrically insulating core, and at least one embedded component embedded within the respective electrically insulating core and electrically coupled to the respective electrically conductive structure, wherein the at least one electrically conductive structure is arranged at least partially on an exposed surface of the connector device and is configured for establishing the electric connection with the counter piece upon establishing the mechanical connection with the counter piece.

Devices including multiple flexible substrates bearing organic light-emitting diodes (OLEDs) are provided. The flexible substrates are interconnected, and the properties of the substrates and the interconnections provide the shape of the device.

Provided is a photosensitive resin composition containing: a photopolymerizable compound (A) having an ethylenically unsaturated group; a photopolymerization initiator (B); and an inorganic filler (F), in which the photopolymerizable compound (A) having an ethylenically unsaturated group includes a photopolymerizable compound (A1) having an acidic substituent and an alicyclic structure together with an ethylenically unsaturated group, and the inorganic filler (F) includes an inorganic filler surface-treated with a coupling agent without at least one functional group selected from the group consisting of an amino group and a (meth)acryloyl group. The present disclosure also provides a photosensitive resin composition for photo via formation, and a photosensitive resin composition for interlayer insulating layer. The present disclosure further provides: a photosensitive resin film and a photosensitive resin film for interlayer insulating layer, each of which contains the photosensitive resin composition; a multilayered printed wiring board and a semiconductor package; and a method for producing a multilayered printed wiring board.