A component built-in substrate includes a multilayer body and a substrate including a multilayer ceramic electronic component embedded therein. The multilayer ceramic electronic component includes a first connection portion that protrudes from the first external electrode, and a second connection portion that protrudes from the second external electrode. The substrate includes a core material. The multilayer ceramic electronic component including the first connection portion and the second connection portion includes a surface covered by the core material and embedded in the substrate. The first connection portion protrudes toward a surface of the substrate, and is not exposed at the surface of the substrate. The second connection portion protrudes toward the surface of the substrate, and is not exposed at the surface of the substrate.

A method of manufacturing electronic package module is provided. The method provides selective molding by attaching tapes on the circuit substrate on which electric components are mounted thereon, forming molding compound to cover the circuit substrate, and removing tapes along with the molding compound thereon.

A power semiconductor substrate comprising an insulating planar base, at least one conductor track and at least one contact area as part of the conductor track, wherein a layer of a metallic material is disposed on the contact area by means of pressure sintering. The associated method comprises the steps of: producing a power semiconductor substrate that includes a planar insulating base, conductor tracks and contact areas; arranging a pasty layer, composed of a metallic material and a solvent, on at least one contact area of the power semiconductor substrate; and applying pressure to the pasty layer.

A method for selective processing of a panel, the method may include receiving a panel that has a bottom side and a top side and comprises a first group of drilled holes and a second group of drilled holes; at least partially sealing a bottom of any through hole of the first group; filling, by a selective filing process, any drilled hole of the first group that has a top opening to provide at least partially filled drilled holes of the first group without filling the second group of drilled holes; and plugging, by a selective plugging process, a top of any drilled hole of the first group.

The present disclosure discloses a circuit board and a manufacturing method thereof. The manufacturing method of the circuit board comprises: forming an electroplated coating on a board body of the circuit board; performing image transfer on the board body; drilling the board body after image transfer to remove a copper layer, adjacent to the two sides of a gold finger, on the circuit board, thereby forming a strip; performing forward and reverse routing towards directions away from each other respectively at the two sides of each gold finger to form a first routing tape and a second routing tape, wherein the first routing tape and the second routing tape are connected to the two ends of the strip respectively; and removing burrs on a surface of the board body through an etching process.

The purpose of the present invention is to provide a garment-type electronic device capable of reducing discomfort during the wearing in the garment-type electronic device comprising an electrical wiring using stretchable conductor composition. In a part in contact with a body surface of a garment-type electronic device, a level difference at the boundary between the electrode portion where the conductor is exposed and the wiring portion covered with the insulating cover layer is substantially eliminated, whereby a garment type electronic device with a natural wearing feeling in which discomfort during wearing has been reduced is obtained. Furthermore, by providing the projections and the depressions in the fabric texture on its surface, a more natural wearing feeling is obtained. Such a garment-type electronic device can be produced by a printing transfer method.

A photosensitive dry film and uses of the same are provided. The photosensitive dry film comprises a support layer and a photosensitive resin layer disposed on the support layer, wherein the support layer has a first surface and a second surface opposite the first surface, and the first surface is in contact with the photosensitive resin layer and has a non-smooth structure.

A method for manufacturing an electronic component by a pressure-assisted low-temperature sintering process, by using a pressure sintering device having an upper die and a lower die is disclosed. The upper the die and/or the lower die is provided with a first pressure pad, wherein the method includes the following steps: placing a first sinterable component on a first sintering layer provided on a top layer of a first substrate; joining the sinterable component and the top layer of the first substrate to form a first electronic component by pressing the upper die and the lower die towards each other, wherein the sintering device is simultaneously heated.

Provided are a stretchable wire tape for a textile that can maintain high levels in all of stretchability, electrical conductivity, durability, an insulating property, and design and can also have a reduced production cost, wearable devices, and a method for producing textiles having wires. The stretchable wire tape for the textile includes a stretchable electrically conductive wire, and stretchable insulating films each including a first face and a second face opposite to the first face, the stretchable insulating films being bonded to opposite sides of the stretchable electrically conductive wire on their first faces. Since the stretchable insulating films are bonded to the opposite sides of the stretchable electrically conductive wire via bonding layers, durability and an insulating property can be secured while stretchability and electrical conductivity of the electrically conductive wire can be maintained, and design can also be improved.

When a specification setting unit sets a specification of a lot number “k+1” after setting a specification of a lot number “k”, a mounting program selector performs a mounting program corresponding to the lot number “k”, and then selects a mounting program corresponding to the lot number “k+1” according to matching between a mounting number from the mounting program and a planned number of products of the lot number “k”. A printing program selector selects a printing program corresponding to the lot number “k”, and then selects a printing program corresponding to the lot number “k+1” according to matching between a sum of a printing number from the printing program and a defective product number and the planned number of products of the lot number “k”. Consequently, on-demand production of an electronic device can easily be manufactured on a manufacturing line.