A circuit board layer build-up process with enhanced positioning precision is provided. The circuit board layer build-up process is advantageous in that regardless of the number of times for which the circuit board layer build-up process has been performed in a row, all the newly added layers are formed with target windows (including copper foil target windows and insulating adhesive target windows) each having a larger contour than the corresponding positioning target through hole. During the via forming process and the subsequent patterning process, therefore, machine vision-based positioning can always be carried out using the positioning target through holes in the substrate layer as positioning reference points, thereby preventing layer errors and increasing the precision and yield of circuit boards.

An apparatus and method for soldering an electrical component to a circuit board includes a stage positioning the circuit board and electrical component in alignment with a solder tip along an axis. A first spring-loaded compression mechanism maintains contact between the circuit board and the electrical component, and a second spring-loaded compression mechanism brings the soldering tip into thermal contact with the circuit board and the electrical component such that solder disposed adjacent to the circuit board and the electrical component melts. When the second spring-loaded compression mechanism removes its applied force such that the soldering tip comes out of contact with the circuit board, the first spring-loaded compression mechanism maintains the contact between the circuit board and the electrical component while the solder cools and solidifies.

A tool for cutting the isthmuses in slots of a plate comprising PCBs includes: a base plate, a spindle having a shank and a cutting tip, a spindle support fixed to the base plate and revolvingly supporting the spindle, a head fixed to the base plate and provided with a through hole wherein the shank of the spindle is disposed, a guide mounted on the head and provided with a through hole wherein the cutting tip of the spindle is disposed, in such manner that a portion of the cutting tip of the spindle protrudes from the guide, the guide having a guide rib disposed in alignment with the cutting tip of the spindle and suitable for being inserted into the holes of the plate comprising the PCBs to guide a relative movement of the plate comprising the PCBs with respect to the tool.

This invention provides a method and apparatus for manufacturing electronic devices. The method includes: providing a substrate having a first surface; providing an electronic device having bumps; mounting the bumps to the first surface to form an integrated unit; applying a capillary underfill to multiple sides of the electronic device, enabling the underfill to creep along and fill the gap between the electronic device and the substrate; placing the integrated unit into a processing chamber; raising the temperature in the chamber to a first predetermined temperature; reducing the pressure in the chamber to a first predetermined pressure of a vacuum pressure, and maintaining the vacuum pressure for a predetermined time period; raising the pressure in the chamber to a second predetermined pressure higher than 1 atm, and maintaining the second predetermined pressure for a predetermined time period; and adjusting the temperature in the chamber to a second predetermined temperature.

The present disclosure discloses a vacuum adsorption unit and a vacuum adsorption carrier, wherein the vacuum adsorption unit comprises: a housing defining an air path through-hole therein, the air path through-hole provided with an upper abutting surface and a lower abutting surface; a piston movable provided in the air path through-hole and is located between the upper abutting surface and the lower abutting surface; an outer peripheral wall of the piston is slidably matched with an inner peripheral wall of the air path through-hole; an elastic member having both ends that respectively abut against the housing and the piston, to constantly drive the piston to abut on the upper abutting surface; and a pressure relief passage communicated with the air path through-hole, and is configured to be closed only when the piston moves to abut against the lower abutting surface.

Methods of connecting wires (126) to feedthrough pins (104) and apparatus including wires connected to feedthrough pins.

A printed circuit board provides lateral notches for receiving wire conductors in a lateral direction to be joined with printed circuit board traces by solder or an insulation displacement connector eliminating the need for laborious sequential insertion of conductors through printed circuit board holes.

A bendable printed circuit board is provided. The bendable circuit board may include a circuit board having first and second sections and at least one plated wire that electrically connects and mechanically joins the first and second sections together. The first section may be pivotable with respect to the second section through the at least one plated wire.

A camera module, a molded circuit board assembly, a molded photosensitive assembly and manufacturing method thereof are disclosed. The camera module includes a molded base which is integrally formed with a circuit board through a molding process, wherein a photosensitive element may be electrically connected on the circuit board and at least a portion of a non-photosensitive area portion of the photosensitive element is also connected by the molded base through the molding process. A light window is formed in a central portion of the molded base to provide a light path for the photosensitive element, wherein a cross section of the light window is configured to have a trapezoidal or multi-step trapezoidal shape which has a size increasing from bottom to top to facilitate demolding and avoiding stray lights.

An apparatus for positioning and attaching one or more sensor devices to a surface of an electrical component is described. The apparatus comprises one or more sensor devices and a stencil fixture that holds at least one of the one or more sensor devices, where the stencil fixture positions the sensor at a location proximate to a surface of the electrical component prior to attaching the sensor to the surface of the electrical component