A method and system are disclosed that allow easier coupling between high-density connectors. In one example implementation, the connectors on a computer board are mounted on flexible tabs extending from the computer board, the tabs having been formed by cutting slots on both sides of each of the tabs. A milled section within each tab makes the tab thinner, allowing it additional flexibility. In another example implementation, a pass-through connector is used as an intermediary between two mating connectors. The pass-through connector has internal pins with greater tolerance than the tolerance between the two mating connectors, allowing it easier alignment of pins for coupling. In yet another example implementation, mating connectors are coupled using a bundle of cables between the mating connectors that allows the coupling of multiple connectors, one at a time, reducing or eliminating the need to simultaneously couple multiple connectors.

A lighting device is described. The lighting device includes a support structure, which includes a central mounting face and at least one first lateral mounting face adjacent the central mounting face and forming an included angle with the central mounting face of 60° to 90°. The device also includes at least one central light emitting element on the central mounting face and in contact with the support structure and at least one first lateral light emitting element on the first lateral mounting face and in contact with the support structure.

A flexible circuit board includes a flexible substrate, a chip and a patterned circuit layer. A surface of the flexible substrate is separated into a working area and a nonworking area according to a cutting line. The chip is disposed on the working area. The patterned circuit layer is disposed on the surface and includes signal transmission wires and bypass wires, the bypass wires are not electrically connected to the chip. Each of the bypass wires includes a bypass transmission portion located on the working area and an anti-peeling portion located on the nonworking area. A blank area exists between the anti-peeling area and the bypass transmission portion, and the cutting line passes through the blank area. A distance between 100 um and 400 um exists from the anti-peeling portion to the cutting line.

Embodiments of the invention include flexible circuit board interconnections and methods regarding the same. In an embodiment, the invention includes a method of connecting a plurality of flexible circuit boards together comprising the steps applying a solder composition between an upper surface of a first flexible circuit board and a lower surface of a second flexible circuit board; holding the upper surface of the first flexible circuit board and the lower surface of the second flexible circuit board together; and reflowing the solder composition with a heat source to bond the first flexible circuit board and the second flexible circuit board together to form a flexible circuit board strip having a length longer than either of the first flexible circuit board or second flexible circuit board separately. In an embodiment the invention includes a circuit board clamp for holding flexible circuit boards together, the clamp including a u-shaped fastener; a spring tension arm connected to the u-shaped fastener; and an attachment mechanism connected to the spring tension arm. Other embodiments are also included herein.

Disclosure provides an adapter board and a method for making the adapter board, which includes providing a mold in which a plurality of first fixing plates and second fixing plates are provided, providing a plurality of wires sequentially passed through the plurality of first fixing plates and the second fixing plate, injecting a non-conductive material into the cavity to form a body, and cutting the body along both sides of the first fixing plates and the second fixing plates to obtain a plurality of board bodies. The first fixing plates are provided with a plurality of first fixing holes, and the second fixing plates are provided with a plurality of second fixing holes. The board body includes a first surface and a second surface. A plurality of first connection pads are formed on the first surface, and a plurality of second connection pads are formed on the second surface.

A circuit board tape includes substrate units each including a sprocket-hole region, a layout region and a joining mark. There are odd and more than three sprocket holes on the sprocket-hole region. An imaginary line extended from the joining mark is extended to between a first layout and a second layout located on the layout region. The amount of the sprocket holes between the imaginary lines of the adjacent substrate units is odd. The circuit board tape is cut along the imaginary lines of the different substrate units so as to remove the defective substrate unit from the circuit board tape and divide the circuit board tape into a front tape and a rear tape. After joining the front and rear tapes, the region where a first layout on the front tape and a second layout on the rear tape are located is defined as a combined layout region.

Methods include receiving at least one electronic device including a sensor or an emitter, placing a cover over the sensor or emitter, placing the electronic device, including the cover, into a transfer mold system, encapsulating the electronic device with charge material, and removing a portion of the encapsulating charge material and the cover to expose the sensor or emitter to the environment.

A method of manufacturing a flexible circuit comprises providing a laminated substrate that includes a conductive layer, an adhesive layer, and a support layer. The method comprises forming conductive traces by removing selected portions of the conductive layer and the adhesive layer by dry milling the laminated substrate. The method comprises applying a protective coating to the conductive traces. The method comprises dispensing a solder material on the protective coating at a first connection point and arranging a first component at the first connection point. The method comprises heating the solder material to remove the protective coating from the first connection point and to connect the first component to one of the conductive traces at the first connection point. The method comprises attaching a second component to the conductive layer at a second connection point that is free of the protective coating by a process other than soldering.

Systems and methods for bonding an electronic component to substrate with a rough surface. The method comprising: disposing an insulating adhesive on the substrate; applying heat and pressure to the insulating adhesive to cause the adhesive to flow into at least one opening formed in the substrate; curing the insulating adhesive to form a pad that is at least partially embedded in the substrate and comprises a planar smooth surface that is exposed; disposing at least one trace on the planar smooth surface of the pad; depositing an anisotropic conductive material on the pad so as to at least cover the at least one trace; placing the electronic component on the pad so that an electrical coupling is formed between the electronic component and the at least one trace; and bonding the electronic component to the substrate by curing the anisotropic conductive material.

A surface mounted Light Emitting Diode (LED) device includes a printed circuit board (PCB), at least one color LED chip mounted on the PCB, and a driving chip. The driving chip is mounted on the PCB and electrically connected to the at least one color LED chip to drive the at least one color LED chip. The driving chip has a signal input port and a signal output port. The signal input port is electrically connected to a signal input conductive pad, and the signal output port is electrically connected to a signal output conductive pad. The surface mounted LED device further includes a gap located between the signal input conductive pad and the signal output conductive pad for creating a space for a cutting apparatus to sever any conductive line through the gap, and making a manufacturing procedure of the surface mounted LED device easier.