A thermally expandable material includes microcapsules and a binder having a conducting property, each microcapsule including a shell having an insulating property, and a thermally expandable component contained in the shell and having a property of expanding by heating, the shell deforming due to expansion of the thermally expandable component to come in contact with another capsule and have an insulating state with the other capsule.

Provided is a technique that can achieve an insulating layer with small surface undulations and can suppress a haloing phenomenon in manufacturing a printed wiring board even when using a thin resin composition layer. Specifically, provided is a method for manufacturing a printed wiring board that includes the steps of: (A) preparing a resin sheet with an inorganic layer including (i) a support with an inorganic layer including an inorganic layer, a support in contact with the inorganic layer, and a release layer and (ii) a resin composition layer in contact with the release layer of the support with an inorganic layer; (B) laminating the resin sheet with an inorganic layer onto an internal layer substrate so that the resin composition layer of the resin sheet with an inorganic layer is in contact with the internal layer substrate; (C) curing the resin composition layer to form an insulating layer; and (D) perforating the insulating layer.

A microcapsule includes a shell including a conducting component, and a thermally expandable component contained in the shell and having a property of expanding by heating. The shell is deformable in accordance with expansion of the thermally expandable component when the thermally expandable component is heated.

A film-peeling apparatus is adapted to peel a protective film on a surface of a substrate. The surface of the substrate has a bare area which is not covered by the protective film. The film-peeling apparatus includes a punching member, a connector connected to the punching member, and a controller. The controller is configured for driving, through the connector, the punching member to punch at predetermined positions nearby or on a first edge of the protective film adjacent to the bare area.

[Summary]

The present invention relates to a multilayered printed circuit board having excellent durability while having a thin thickness, a method for manufacturing the same, and a semiconductor device using the same.

An electronic component module includes a substrate, an electronic component, an insulating resin, and a shield film. The insulating resin covers a first main surface side of the substrate. The insulating resin exposes an opposite surface of the electronic component. The shield film covers the insulating resin and the opposite surface of the electronic component. The opposite surface has an uneven portion. A concave portion of the uneven portion has a smoother shape than a convex portion of the uneven portion.

A method of manufacturing circuits of a substrate of a display device is provided. The method includes aligning and attaching a mask with multiple slots to a circuit area of the substrate; printing a printing material in the slots of the mask using an inkjet printing technology, so that the printing material is attached to the circuit area; removing the mask from the substrate; and curing the printing material on the circuit area to form a plurality of the circuits.

An adhesive substrate is disclosed, which includes a base substrate and a heat-resistant elastomer layer formed on the base substrate, wherein the base substrate is flexible and has a thickness of 0.2 mm or more and 2 mm or less, wherein the adhesive substrate is used as part of a method for physically separating an object that has been held immovable in such a manner that the object has been adhered to by the heat-resistant elastomer layer and the object is anchored from the upper side, and wherein by starting to physically separate the end portion of the adhesive substrate downward the object is able to be separated.

A feeder device including a tape feeding mechanism which feeds out a carrier tape which stores components in corresponding multiple component storage sections and a cover tape which is adhered to the bottom tape and covers the component storage sections, and a tape peeling mechanism which includes a tape peeling blade which proceeds between the bottom tape and the cover tape as the carrier tape is fed out to perform peeling, the feeder device supplying the components from the component storage sections at a component supply position, and the feeder device further including a feed speed determination section which determines the feed speed at a peeling start time at which a leading end of the carrier tape comes into contact with the tape peeling blade according to at least one of properties of multiple types of carrier tape and characteristics of the components which are stored.

A blade includes an edge to be pressed against an end portion of a carrier film to fold the end portion upwards from a sheet. A clamp mechanism peels the carrier film off from the sheet by moving while clamping the upwardly folded end portion of the carrier film.