A touch screen panel includes a film substrate defined by a touch active area and a non-touch active area and the touch area is arranged outside the touch active area. The touch screen panel includes a plurality of sensing electrodes arranged in the touch active area on an upper surface and a lower surface of the film substrate, and outer lines arranged in the non-touch active area on the upper and the lower surfaces of the film substrate. The outer lines are connected to the sensing electrodes along one of a first direction and a second direction, and the outer lines include a transparent electrode layer and a plating layer on the transparent electrode layer.

The embodiments of the invention disclose a touch screen, a method for producing a touch screen, and a touch display device, which relate to a field of display. The touch screen does not need bridging, have high transmittance, and are simple in process, which can not only reduce the production cost but also achieve a high yield of mass production. The touch screen as provided in the embodiments of the invention comprises: a transparent substrate; a first patterned transparent eclectically conductive layer; a patterned insulating layer and a second patterned transparent eclectically conductive layer, which are formed above said transparent substrate successively, wherein among said first patterned transparent electrically conductive layer and said second patterned transparent electrically conductive layer, one is formed with a plurality of drive lines, and the other is formed with a plurality of induction lines; the pattern of said insulating layer is identical with that of said first patterned transparent electrically conductive layer, or identical with that of said second patterned transparent electrically conductive layer.

The disclosed technology features methods for the manufacture of electrical components such as ultrasound transducers. In particular, the disclosed technology provides methods of creating an ultrasonic transducer by connecting one or more multi-layer printed circuits to an array of ultrasound transducer elements. In one embodiment, the printed circuits have traces in a single layer that are spaced by a distance that is greater than a pitch of the transducer elements to which the multi-layer printed circuit is to be connected. However the traces from all the layers in the multi-layer printed circuit are interleaved to have a pitch that is equal to the pitch of the transducer elements. The disclosed technology also features ultrasound transducers produced by the methods described herein.

A substrate for mounting a semiconductor device includes an insulating layer having first and second opposed surfaces defining a thickness. First and second electrically conductive lands are included in the insulating layer. The first electrically conductive lands extend through the whole thickness of the insulating layer and are exposed on both the first and second opposed surfaces. The second electrically conductive lands have a thickness less than the thickness of the insulating layer and are exposed only at the first surface. Electrically conductive lines at the first surface of the insulating layer couple certain ones of the first electrically conductive lands with certain ones of the second electrically conductive lands. The semiconductor device is mounted to the first surface of the insulating layer. Wire bonding may be used to electrically coupling the semiconductor device to certain ones of the first and second lands.

In a mark forming step in a manufacturing method for a component incorporated substrate in which an electronic component is positioned with reference to a mark formed in a copper layer, when an imaginary line extending from a search center of a search range of a sensor, to an edge side of the search range is represented as a search reference line and an imaginary line extending, in a state in which a mark center, is matched with the search center, from the mark center in the same direction as the search reference line to an outer ridgeline of the mark is represented as a mark reference line, the mark formed in a shape in which the outer ridgeline of the mark is present in a position where a length of the mark reference line is in a range of 30% or more of the search reference line.

A manufacturing method for a component incorporated substrate according to the present invention includes positioning an electronic component with reference to a mark formed on a copper layer, the mark consisting of a material less easily etched than copper by a copper etching agent used for etching of copper, after mounting the electronic component on the copper layer with an adhesive layer interposed therebetween, embedding the electronic component and the mark in an insulating substrate, thereafter, etching and removing a part of the copper layer to form a window for exposing the mark, forming an LVH reaching a terminal of the electronic component with reference to the exposed mark, electrically connecting the terminal and the copper layer via a conduction via formed by applying copper plating to the LVH, and, thereafter, forming the copper layer into a wiring pattern.

A printed wiring board includes an uppermost insulating layer, first pads positioned to mount an IC chip on the insulating layer, second pads positioned to mount a second printed wiring board on the insulating layer, metal posts formed on the second pads, respectively, such that the metal posts mount the second board over the chip, and a solder resist layer formed on the uppermost insulating layer and having first and second openings such that the first openings exposes the first pads and that the second openings exposes the second pads, respectively. The metal posts are formed such that each of the metal posts has a diameter which is smaller than a diameter of each of the second opening portions, and the second opening portions are formed such that the diameter of each of the second opening portions is smaller than a diameter of each of the second pads.

The disclosed technology features methods for the manufacture of electrical components such as ultrasound transducers. In particular, the disclosed technology provides methods of creating an ultrasonic transducer by connecting one or more multi-layer printed circuits to an array of ultrasound transducer elements. In one embodiment, the printed circuits have traces in a single layer that are spaced by a distance that is greater than a pitch of the transducer elements to which the multi-layer printed circuit is to be connected. However the traces from all the layers in the multi-layer printed circuit are interleaved to have a pitch that is equal to the pitch of the transducer elements. The disclosed technology also features ultrasound transducers produced by the methods described herein.

A method of manufacturing a printed circuit board with embedded electronic components fixed by a solder paste includes: providing a carrier board with a copper foil layer on the carrier board, an insulating layer on the copper foil layer, and an opening on the insulating layer by laser; putting a solder paste into the opening to form a solder paste layer; performing a high-temperature reflow process of the electronic components on the solder paste layer until the solder paste layer is molten; curing the solder paste layer after cooling to fix the components to the center position of the opening; placing the copper foil layer below the electronic components and removing the solder paste layer; and performing copper plating and electroplating processes in an electroplating space to form a plating copper. The cohesion of the molten solder paste pulls the electronic components towards the center to eliminate position offset produced when the electronic components are installed.

A layered body is manufactured by etching a first foil constituting a three-layer metal foil to form a first metal layer shaped like a pattern, stacking a first insulating layer so as to bury the first metal layer, forming a first via as a plated via, forming a second metal layer shaped like a pattern on the first insulating layer, stacking a second insulating layer so as to bury the second metal layer, removing a second foil and a third foil constituting the three-layer metal foil, stacking a third insulating layer and a resin film on the second insulating layer, and providing a second via as a paste via to the second insulating layer, and a multilayer substrate is obtained by stacking a plurality of layered bodies.