The present invention relates to a circuit board including: a base board having a circuit region and a terminal region; a circuit pattern formed on an upper portion of the base board; and a low-melting-metal layer formed on an upper portion of the circuit pattern. A circuit board capable of reducing manufacturing time and manufacturing costs may be manufactured by omitting a photoresist process.

The invention relates to a method for mechanical connecting especially of a potting frame to a printed circuit board of an electrical/electronic module. The potting frame includes a metal contact area. The printed circuit board includes a surface area structured metallically corresponding to the contact area. The method includes positioning the mechanical component with the contact area facing the corresponding surface area, and soldering the mechanical component to the printed circuit board via the contact area and the surface area. The method the advantage that a material saving encapsulation can be provided for electrical/electronic modules in explosion endangered regions. An additional process step for mechanical connecting of the encapsulation to the printed circuit board can be omitted, since the mechanical connecting of the potting frame can be performed in one process step together with the soldering of the additional electrical/electronic components to the printed circuit board.

Provided is a method for removing an electronic component from a printed wiring board. The method comprises applying an embrittlement agent to a lead of an electronic component that is soldered to the printed wiring board. The electronic component is removed from the printed wiring board by breaking the embrittled lead.

Provided is a method for removing an electronic socket from a printed wiring board. The method comprises placing an embrittlement sheet over an electronic socket on a printed wiring board. The electronic socket is mounted to the printed wiring board using a plurality of hidden solder joints. The method further comprises causing the embrittlement sheet to melt. The melted embrittlement sheet wets the plurality of hidden solder joints. The electronic socket is removed from the printed wiring board by breaking the embrittled solder joints.

In a printed circuit board (1), thermal vias (19) are formed between the lower surface (A) and an upper surface (B) of the substrate plate (10) of the printed circuit board through the steps of: applying a respective solder resist mask (21, 31) to the lower surface (A) and the upper surface (B); applying solder to the lower surface (A) and reflow soldering the solder, wherein the solder penetrates into the boreholes (20) and forms convex menisci (26) protruding beyond the edge (22) of the respective boreholes on the lower surface (A); and creating regions (35) on the upper surface (B), which are freed from solder resist material, and which are intended for contacting at least one electronic component (17) on the upper surface and each of which comprise at least one of the thermal vias. Subsequently, the upper surface (B) can be provided with electrical components (17) on these regions (35). The first solder resist mask (21) has a respective region (23) that is free of solder resist on the lower surface around the edge of every borehole (20).

A stackable via package includes a substrate having an upper surface and a trace on the upper surface, the trace including a terminal. A solder ball is on the terminal. The solder ball has a solder ball diameter A and a solder ball height D. A via aperture is formed in a package body enclosing the solder ball to expose the solder ball. The via aperture includes a via bottom having a via bottom diameter B and a via bottom height C from the upper surface of the substrate, where A<B and 0=<C<½×D. The shape of the via aperture prevents solder deformation of the solder column formed from the solder ball as well as prevents solder bridging between adjacent solder columns.

A design method and a packaging method for a PCB board to avoid patch element tombstone, and a PCB board are provided. The method includes: providing at least one patch element placement area on a PCB board, providing pads in each patch element placement area, where each pad group includes two pads, and the two pads are arranged side by side; establishing pad limit areas around the pads; and reflow soldering the patch element to the PCB board. With the above method, the tombstone phenomenon of the patch element can be effectively prevented, the design efficiency is improved, the workload of manual operation of the engineer is reduced, and an error rate is reduced.

Filing a plated through-hole of a circuit board with solder is facilitated by an apparatus which includes a wire solder assembly and a controller. The wire solder assembly includes a wire probe sized to extend into the plated through-hole from one side of the circuit board, and a solder block associated with the wire probe so that the probe passes through the solder block. The controller controls heating of the wire probe, when the wire probe is operatively inserted into the plated through-hole, by passing a current through the wire probe. The heating of the wire probe heats a conductive plating of the plated through-hole and melts the solder block. The heating of the conductive plating and the melting of the solder block causes the solder to migrate into the plated through-hole by capillary action to fill the plated through-hole with the solder.

A process of fabricating a circuit includes providing a first sheet of dielectric material including a first top surface having at least one first conductive trace and a second sheet of dielectric material including a second top surface having at least one second conductive trace, depositing a first solder bump on the at least one first conductive trace, applying the second sheet of dielectric material to the first sheet of dielectric material with bonding film sandwiched in between, bonding the first and second sheets of dielectric material to one another, and providing a conductive material to connect the first solder bump on the at least one first conductive trace to the at least one second conductive trace.

The present disclosure discloses a reflow oven, comprising a heating zone, a cooling zone, a barrier and exhaust zone, a gas exhaust passage, a gas exhaust power device, and a detection device. The heating zone comprises a heating zone inlet and a heating zone outlet. The cooling zone comprises a cooling zone inlet and a cooling zone outlet. The barrier and exhaust zone is located between the heating zone outlet and the cooling zone inlet. An inlet of the gas exhaust passage is communicated with the barrier and exhaust zone. The gas exhaust power device is disposed on the gas exhaust passage. The detection device is disposed on the gas exhaust passage and used for detecting parameters of gas in the gas exhaust passage, wherein the parameters of the gas reflect a blockage condition of the gas exhaust power device. The reflow oven according to the present disclosure can ensure that the gas containing soldering flux is sufficiently drawn out from the barrier and exhaust zone, thereby ensuring the production quality of a circuit board and improving the qualified rate of the circuit board.