A work machine including a flow device for flowing molten solder from under a circuit board, and a backup pin for supporting the circuit board from below while a lead of a leaded component is being inserted into a through-hole, which are moved separately under the circuit board. Thus, when the circuit board needs to be supported, the backup pin can be moved to any position, and when solder needs to be applied, the backup pin can be moved to a position that does not obstruct operation of the flow device. Accordingly, as well as guaranteeing operation of the flow device, it is possible to support the circuit board with the backup pin as required, thus improving practicality of the work machine.

A piezoelectric transformer includes a piezoelectric element. Two primary side electrodes exist on the primary side of the piezoelectric element. The primary side electrodes are coupled by a resistor formed from a conductive coating. A discharge current is discharged via the resistor to protect a semiconductor component from the discharge current. Since neither a short-circuit terminal nor conductive jig is required, electrostatic discharge damage to a semiconductor component can be prevented by a low-cost arrangement.

A circuit board with solder thieves is provided that has a plurality of plug-in connector pads, a plurality of conductive traces, and first and second solder thieves. The plurality of plug-in connector pads are arranged in two rows on the circuit board. Each conductive trace connects with a plug-in connector pad. Both of the first solder thief and the second solder thief are provided on one side of the two rows of plug-in connector pads, the one side is away from an advancing direction of the circuit board during wave soldering. Each of an area of the first solder thief and an area of the second solder thief is greater than or equal to a sum of areas of two plug-in connector pads adjacent to corresponding one of the first solder thief and the second solder thief. Sizes of the solder thieves on the circuit board with solder thieves according to the present disclosure each are large enough to form a sufficient amount of traction force during wave soldering, so it will not leave solder projections, therefore it will not cause short circuit.

Provided is a printed circuit board structure that needs minimum manufacturing costs and in which there is little possibility that a solder bridge is formed. The printed circuit board structure is formed with via holes for electrically conductively connecting electrically conductive layers of a printed circuit board, and the via holes include a coated via hole with a land coated with solder resist and a non-coated via hole with a land not coated with solder resist, wherein the coated via hole is arranged in a place of the printed circuit board where a solder bridge or a solder ball is highly likely to be generated, and is electrically connected to at least one of the non-coated via hole in parallel.

A semiconductor package and methods for producing the same are described. One example of the semiconductor package is described to include a substrate having a first face and an opposing second face. The package is further described to include a plurality of solderable surfaces formed on the first face of the substrate, a first solderable surface in the plurality of solderable surfaces having a pattern plating structure on an outward facing surface of the first solderable surface. There may also be an amount of solder bonded to the outward facing surface of the first solderable surface, where the pattern plating structure on the outward facing surface of the first solderable surface causes the amount of solder to have a first thickness at its ends, a second thickness at its center, and a discrete transition between the first thickness and the second thickness.

A method of making a printed circuit board pallet is provided. The method of making the pallet illustratively includes the steps of: providing a base in a form of a polymer sheet stock; applying a fluid onto the base at selective locations where the pallet will be built-up to a three-dimensional form; depositing a polymer powder onto the base at the selective locations applied with the fluid; removing any excess amounts of the polymer powder not adhered to the fluid; and heating the pallet to fuse the polymer powder together and to the base.

A method, apparatus, and computer program product for increasing solder hole-fill in a printed circuit board assembly (PCBA) are provided in the illustrative embodiments. In the PCBA comprising a Printed Circuit Board (PCB) and the device, a pin of a device is caused to move in a first direction, the pin occupying a hole in the PCB, the hole being filled to a first distance by a solder material. By causing the pin to move, the solder material is drawn into the hole up to a second distance that is greater than the first distance. The pin is allowed to move in a second direction, to return the pin to an initial position in the hole. Allowing the pin to move in the second direction keeps the solder material at a third distance, wherein the third distance is greater than the first distance in the hole.

An apparatus for increasing solder hole-fill in a printed circuit board assembly (PCBA) are provided in the illustrative embodiments. In the PCBA comprising a Printed Circuit Board (PCB) and the device, a pin of a device is caused to move in a first direction, the pin occupying a hole in the PCB, the hole being filled to a first distance by a solder material. By causing the pin to move, the solder material is drawn into the hole up to a second distance that is greater than the first distance. The pin is allowed to move in a second direction, to return the pin to an initial position in the hole. Allowing the pin to move in the second direction keeps the solder material at a third distance, wherein the third distance is greater than the first distance in the hole.

A tin-based solder melt or aqueous tin plating bath composition comprising a source of tin and a stabilizing additive of chemical structure: ##STR00001##
wherein R.sup.1, R.sup.2, R.sup.3, R.sup.4, R.sup.5, R.sup.6, R.sup.7, R.sup.8, R.sup.9, and R.sup.10 are independently selected from hydrogen atom, hydrocarbon groups R having at least one and up to twelve carbon atoms, groups OR wherein R is selected from hydrogen atom and hydrocarbon groups R, and halogen atoms, and wherein any two, three, or four of R.sup.1, R.sup.2, R.sup.3, R.sup.4, and R.sup.5 or any two, three, or four of R.sup.6, R.sup.7, R.sup.8, R.sup.9, and R.sup.10 are optionally interconnected to form a fused ring system; R.sup.11 and R.sup.12 are independently selected from hydrogen atom and hydrocarbon groups R; and r is either 0 or 1. Methods for coating and/or bonding metal substrates by use of the above-described solder compositions are also described.

A coating device includes a container, a driving device, and a control section. The container accommodates a liquid coating agent to be applied to multiple mounting portions of a board on which a component is to be mounted. The driving device horizontally moves and lifts and lowers a pin member between the container and the positioned board. The control section drives and controls the driving device to dip the pin member in the coating agent to apply the coating agent to each of the multiple mounting portions using the coating agent held by a distal end portion of the pin member.