A method and a system for generating spray patterns, an electronic device, and a storage medium. The method includes: step 1: obtaining a first opening shape; step 2: obtaining a preset spray printing dot; step 3: obtaining a qualification ratio T according to a ratio of a total solder-paste weight Q corresponding to a total length of spray-printing line segments to a solder-paste weight Q.sub.1 required for the first opening shape or a ratio of the total length of all the spray-printing line segments to a line length LA, wherein the spray-printing line segments are line segments finally within the first opening shape, and the qualification ratio is a weight ratio or a length ratio; and step 4: determining a relationship among the qualification ratio T, a preset maximum qualification ratio T.sub.max, and a preset minimum qualification ratio T.sub.min to obtain the first spray pattern.

A composite electronic component includes a composite body in which a multilayer ceramic capacitor and a ceramic electronic component are coupled to each other. The multilayer ceramic capacitor includes a first ceramic body comprising dielectric layers and internal electrodes, the internal electrodes having at least one of the dielectric layers interposed therebetween; and first and second external electrodes disposed on first and second end portions of the first ceramic body. The ceramic electronic component includes a second ceramic body coupled to a lower portion of the multilayer ceramic capacitor and made of ceramic; and first and second terminal electrodes disposed on first and second end portions of the second ceramic body and connected to the first and second external electrodes, and the multilayer ceramic capacitor and the ceramic electronic component have different lengths.

A multilayer electronic component includes a capacitor body including a plurality of dielectric layers and a plurality of first and second internal electrodes and having first to sixth surfaces, the first and second internal electrodes being exposed through the third and fourth surfaces, respectively; first and second external electrodes including first and second connected portions respectively disposed on the third and fourth surfaces of the capacitor body and first and second band portions respectively extending from the first and second connected portions to portions of the first surface of the capacitor body, respectively; a first connection terminal disposed on the first band portion; and a second connection terminal disposed on the second band portion, wherein 0.05A1/A10.504, where A1 is an area of the first or second connection terminal in a thickness-width direction, and A2 is an area of the first or second band portion in a width-length direction.

An on-vehicle electronic circuit mounting board includes: a surface mount type package component including a plurality of electrode pads disposed along an outer periphery of a component bottom surface; and a printed wiring board having a plurality of lands disposed along the plurality of electrode pads on a top surface of the printed wiring board opposed to the component bottom surface, and in which each land is disposed to be opposed to the corresponding electrode pad and electrically connected to the electrode pad by soldered connection. An outer soldering slope and an inner soldering slope are formed between a land of the plurality of lands and an electrode pad corresponding to the land, and the land is shifted with respect to the corresponding electrode pad such that one of the outer soldering slope and the inner soldering slope faces the wiring board side and the other faces the component side.

Structures, materials, and methods to control the spread of a solder material or other flowable conductive material in electronic and/or electromagnetic devices are provided.

A semiconductor package and methods for producing the same are described. One example of the semiconductor package is described to include a substrate having a first face and an opposing second face. The package is further described to include a plurality of solderable surfaces formed on the first face of the substrate, a first solderable surface in the plurality of solderable surfaces having a pattern plating structure on an outward facing surface of the first solderable surface. There may also be an amount of solder bonded to the outward facing surface of the first solderable surface, where the pattern plating structure on the outward facing surface of the first solderable surface causes the amount of solder to have a first thickness at its ends, a second thickness at its center, and a discrete transition between the first thickness and the second thickness.

The present disclosure provides a conductor connecting structure that connects a cable to a substrate, where the substrate includes at least one connection pad, the cable includes at least one core wire, the core wire is connected to an upper surface of the connection pad through soldering, and the connection pad includes a solder storing part that is present further frontward than a front end of the core wire.

A semiconductor component includes a semiconductor package having a mountable face, a bump, and a coating part. The bump is made of first solder and is formed on the mountable face. The coating part formed of a first composition containing solder powder made of second solder, a flux component, and a first thermosetting resin binder coats the top end of the bump.

A component-embedded substrate includes a substrate portion, an embedded electronic component, and a resin portion. The substrate portion has inner electrodes on an inner principal surface. The embedded electronic component has terminal electrodes and is mounted to the substrate portion via solder fillets adhering to the respective terminal electrodes and the respective inner electrodes. The resin portion is stacked on the substrate portion, with the embedded electronic component embedded therein. The resin portion includes a no-filler-added layer and a filler-added layer. The no-filler-added layer extends from the inner principal surface to a height which allows at least the solder fillets to be covered. The filler-added layer contains an inorganic filler and extends from an interface with the no-filler-added layer to a height which allows at least the embedded electronic component to be covered.

A wiring substrate includes a wiring layer, an insulating layer covering the wiring layer, and a protruding electrode including a protruding metal layer and a surface metal layer. The protruding metal layer is connected to the wiring layer in an opening of the insulating layer, extends from within the opening to be stepped at the edge of the opening to extend outward onto the insulating layer, and includes a first surface contacting a surface of the insulating layer around the opening, a second surface, and a peripheral surface extending between the first and second surfaces, and bent inward to form a space between the peripheral surface and the surface of the insulating layer. The surface metal layer covers the protruding metal layer without contacting the surface of the insulating layer, and is formed of a metal having a lower melting point than the protruding metal layer.