Present embodiment relates to a method for manufacturing a circuit board, and more specifically, to a technique for solving problems that may arise due to etching by injecting epoxy or silicon or inserting a metal block into a gap formed between two or more ceramic substrates.

A laminated body of a component incorporating substrate includes insulating base members. First and second mounting terminals of a first electronic component abut on a conductor-less surface of a first insulating base member. A first interlayer connection conductor in the first insulating base member connects the first mounting terminal to a conductor pattern. Third and fourth mounting terminals of a second electronic component abut on a conductor-less surface of a second insulating base member. A second interlayer connection conductor in the second insulating base member connects the third mounting terminal to a conductor pattern that abuts a conductor pattern of the first insulating base member which faces toward the second insulating base member, and the conductor pattern of the second insulating base member faces toward the first insulating base member in a lamination direction.

The invention relates to a method for bonding stacked layers (19, 20) for making printed circuits, by electromagnetic induction. In particular, a magnetic flux is locally induced at a plurality of conducting spacers (25) provided along a peripheral area (22) of the multilayer stack (18). By this method, it is possible to induce magnetic fluxes with opposite sign in individual areas of the peripheral area, thus achieving the maximum energy efficiency during the bonding process. The invention further comprises an induction head and a bonding apparatus for performing the method.

An induction head for bonding stacked layers (19, 20) for making printed circuits, by electromagnetic induction. A magnetic flux is locally induced at a plurality of conducting spacers (25) provided along a peripheral area (22) of the multilayer stack (18). With this induction head, it is possible to induce magnetic fluxes with opposite sign in individual areas of the peripheral are, thus achieving the maximum energy efficiency during the bonding process.

A laminating system includes a laminating device including a laminating roll device that applies a dry film onto a seed layer formed on a surface of a resin insulating layer, and a pressure application device positioned such that the pressure application device applies heat and pressure to the dry film.

A method for manufacturing a printed wiring board includes forming a seed layer on a surface of a resin insulating layer, applying a dry film onto the seed layer using a laminating roll device, cutting the dry film applied onto the seed layer to a predetermined size, applying pressure and heat to the dry film, forming a plating resist on the seed layer from the dry film using photographic technology, forming an electrolytic plating film on part of the seed layer exposed from the resist, removing the resist from the seed layer, and removing the part of the seed layer exposed from the electrolytic plating film. The applying of the pressure and heat includes applying the pressure and heat to the dry film applied onto the seed layer such that the pressure and heat are applied to the entire surface of the dry film cut to the predetermined size simultaneously.