A reel-to-reel machine to fabricate a printed flexible circuit on the fly, the machine has a plurality of reels, a laser scanner to ablate a metal foil, a source of UV light or heat to curing an adhesive in a coverlay, another source of UV light or heat to debond a sacrificial liner on the fly. There is a depositor to deposit a sintering paste on the fly onto a predetermined spot for a pad on the metal foil. Removal of slugs are also possible on the fly.

A reel-to-reel method of creating pads on a layer of metal sheet or circuitry pattern on the fly. The method includes placing a sintering paste in the intended spots for pads followed by irradiation of the sintering paste by a laser.

A reel-to-reel lamination method to laminate a metal foil or circuitry pattern on the fly. The method includes applying a UV laminate or thermoset laminate to the metal foil or the circuitry pattern reel to reel, and then apply a UV radiation or heat to the laminate. There can be an optional enclosure connected to a suction source. The enclosure can have a flexible bladder that physically compresses the laminate.

A method of layering a layer of circuitry pattern to another layer of circuitry pattern during the manufacturing of a multilayer flexible printed circuit in a reel-to-reel machine. The method includes feeding both layers of circuitry pattern reel-to-reel into the machine, placing a layer of dielectric sheet material on the fly between the two layers of circuitry patterns reel-to-reel, followed by simultaneously passing the two layers of circuitry pattern and the dielectric sheet material under a laser scanner in the reel-to-reel machine to irradiate a laser beam on a layer of circuitry pattern to weld the two layers of circuitry patterns together.

A method of liquid assisted binding is provided. The method includes: forming a conductive pad on the substrate; placing a micro device on the conductive pad, such that the micro device is in contact with the conductive pad in which the micro device comprises an electrode facing the conductive pad; forming a liquid layer on the micro device and the substrate after said placing, such that a part of the liquid layer penetrates between the micro device and the conductive pad, and the micro device is gripped by a capillary force produced by said part of the liquid layer; and evaporating the liquid layer such that the electrode is bound to the conductive pad and is in electrical connection with the conductive pad.

A process chamber for carrying out thermal processes in the manufacture of an electronic assembly with at least one opening for moving in and/or removing the electronic assembly; a supply of a protective gas; a controllable protection device arranged at the opening to reduce escape of the protective gas from the process chamber; and a control that can control the protection device such that, when the electronic assembly passes through the opening, an opening cross section of the opening is provided, which corresponds to the cross section of the electronic assembly.

A flexible circuit film bonding apparatus includes: a stage configured to support a TFT substrate; a pressing head configured to press and heat a flexible circuit film attached on the TFT substrate with an anisotropic conductive film interposed therebetween; a backup plate configured to support and heat the TFT substrate positioned below the flexible circuit film; and a heating control unit configured to control a temperature of a lower surface of the pressing head and an upper surface of the backup plate, wherein the temperature of the upper surface of the backup plate is less than 170 degrees Celsius.

A method to remove slugs from a circuitry pattern on the fly during the fabrication of a flexible printed circuit, the method includes applying a coverlay reel-to-reel onto one side of the metal foil on the fly and applying a sacrificial liner reel-to-reel onto another side of the metal foil on the fly. Then, after the slugs and circuitry patterns are created from laser ablation, the slug can be removed by applying compressed air to the slugs and/or peeling off the sacrificial liner from the circuitry pattern reel-to-reel.

A soldering apparatus has a soldering iron unit having a soldering tip for carrying out a soldering process to a printed circuit board, a heater unit for heating the soldering iron unit, and a gas supply device for operatively supplying a burning-assist gas to the soldering iron unit, when a cleaning process is carried out for the soldering iron unit. The cleaning process for the soldering iron unit is carried out when the soldering process to the printed circuit board is stopped. In the cleaning process, the soldering iron unit is heated by the heater unit and the burning-assist gas is supplied to the soldering iron unit, so that material attached to the soldering iron unit can be easily burnt out.

A component carrier which includes a stack having at least one electrically conductive layer structure and at least one electrically insulating layer structure, and electrically conductive wiring structures being part of the at least one electrically conductive layer structure, wherein a value of the passive intermodulation for signals propagating along the electrically conductive wiring structures is less than 153 dBc.