A method of making an electrical connection includes soldering using channels in a receptacle to direct hot air (or another hot gas) to effect soldering where the electrical connection is to be made. The connection may be made between device electrical contacts of an electrical device, and other contacts, such as receptacle contacts of the receptacle. The connection may be a blind connection, one in which the connected ends of the contacts are hidden or unable to be directly physically accessed, when the connection is made. The electrical connection may be made between device contacts of an electrical device that is inserted into the receptacle, and receptacle electrical contacts that are part of the receptacle. The channels for directing the hot gas to where the soldering occurs may be parts of the receptacle, for example being produced during additive manufacture of the receptacle.

Embodiments relate to an apparatus for rework of a BGA package. Memory shape material is placed adjacent to a plurality of solder joints of the package. Stimulation is applied to the material, with the stimulation causing the material to change from a non-stimulated shape to a stimulated shape. This stimulation causes an expansion of the material. As the material expands, it exerts a tensile force on the BGA package and an adjacently positioned carrier, causing a separation of the two components, while mitigating collateral heat of adjacently positioned components.

A holding stand for a heating tool such as a soldering or de-soldering device. The holding stand has a rotary member for securing the heating tool and an assembly for moving and positioning the rotary member with the heating tool in any of three axis.

Embodiments relate to a method and apparatus for rework of a BGA package. Memory shape material is placed adjacent to a plurality of solder joints of the package. Stimulation is applied to the material, with the stimulation causing the material to change from a non-stimulated shape to a stimulated shape. This stimulation causes an expansion of the material. As the material expands, it exerts a tensile force on the BGA package and an adjacently positioned carrier, causing a separation of the two components, while mitigating collateral heat of adjacently positioned components.

Solder housed in flow tank 20 is ejected from nozzle 22 by a pump provided inside flow tank 20. Jet motor 26 that drives the pump is provided outside flow tank 20, and cooling device 30 is provided between flow tank 20 and jet motor 26. Cooling device 30 includes cooling pipe 52 that is formed folded back on itself. Nitrogen gas is supplied from an upper end of cooling pipe 52, flows along cooling pipe 52, and flows out of a lower end of cooling pipe 52 so as to be supplied to flow tank 20. The temperature of the nitrogen gas increases due to heat dissipated from jet motor 26, thus lowering the temperature of jet motor 26. Heat is transferred from jet motor 26 to the nitrogen gas, and jet motor 26 is cooled satisfactorily.

A soldering apparatus has a soldering iron unit having a soldering tip for carrying out a soldering process to a printed circuit board, a heater unit for heating the soldering iron unit, and a gas supply device for operatively supplying a burning-assist gas to the soldering iron unit, when a cleaning process is carried out for the soldering iron unit. The cleaning process for the soldering iron unit is carried out when the soldering process to the printed circuit board is stopped. In the cleaning process, the soldering iron unit is heated by the heater unit and the burning-assist gas is supplied to the soldering iron unit, so that material attached to the soldering iron unit can be easily burnt out.

The present invention involves systems and methods for forming board multi-layers of multilayer printed circuit boards. The board multi-layers include an upper cover plate, an upper copper foil sheet, multiple intermediate layers, a lower copper foil sheet and a lower cover plate. The method comprises steps of providing first, second and third operation areas set at first, second and third air pressures, respectively, wherein the third operation area is arranged between the first and second operation areas, and the first, second and third operation areas include independent air conditioners; providing an operating platform configured for a stack-up operation to form the board multi-layers thereon; providing a linear moving device configured to move the platform among the areas; stacking the upper and lower cover plates and the upper and lower copper foil sheets in the first operation area; and stacking the multiple intermediate layers in the second operation area.

A method for soldering an electronic component to a circuit board involves jetting liquefied solder. A laser beam melts a solid solder ball to produce a liquefied solder ball before the ball is jetted. The liquefied solder ball is jetted towards a through hole in the circuit board such that a portion of the liquefied solder ball flows into an annular gap between a pin and sides of the through hole. The pin is attached to the electronic component and passes through the through hole. As the liquefied solder ball is jetted towards the through hole, the laser beam is directed at the ball so as to keep it liquefied. How much of the solder ball remains outside the through hole after liquefied solder has flowed into the annular gap is determined. The filling degree of the annular gap is determined based on how much solder remains outside the hole.

In a method for manufacturing a multilayer substrate for having a BGA-type component thereon, a conductive through hole for restricting a signal interference and a resist film are formed on the multilayer substrate, an occurrence of a fault caused by a residual of a resist in the conductive through hole is reduced. In the method for manufacturing the multilayer substrate for having the BGA-type component thereon, a step of forming the resist film includes an applying step of applying a photosensitive resist to an entirety of a front surface portion of a base. The applying step is performed while restricting the resist from entering the conductive through hole by supplying a high pressure air to a rear surface of the base to pass through the conductive through hole using an air supply mechanism.

A method of making an electrical connection includes soldering using channels in a receptacle to direct hot air (or another hot gas) to effect soldering where the electrical connection is to be made. The connection may be made between device electrical contacts of an electrical device, and other contacts, such as receptacle contacts of the receptacle. The connection may be a blind connection, one in which the connected ends of the contacts are hidden or unable to be directly physically accessed, when the connection is made. The electrical connection may be made between device contacts of an electrical device that is inserted into the receptacle, and receptacle electrical contacts that are part of the receptacle. The channels for directing the hot gas to where the soldering occurs may be parts of the receptacle, for example being produced during additive manufacture of the receptacle.