An optoelectronic assembly is provided in different embodiments. The optoelectronic assembly has the following; a printed circuit board; at least one optoelectronic first component which is arranged on a first face of the printed circuit board; a heat sink which has a first surface that is arranged on a second printed circuit board face facing away from the first component, wherein a boundary surface extends between the second face and the first surface; and at least one first welding connection, by means of which the heat sink is directly connected to the printed circuit board in a bonded manner and which together with the boundary surface forms a first cut surface, the first component at least partly overlapping the cut surface.

A component mounting machine including a head including multiple nozzles configured to pick up the; a negative pressure supply device to supply negative pressure from a negative pressure source individually to the suction openings of the multiple nozzles; a raising and lowering device to individually raise and lower the multiple nozzles; and a control device to perform a first pickup operation of controlling the raising and lowering device to lower one of the nozzles and controlling the negative pressure supply device to supply negative pressure to pick up the component using the suction opening of that nozzle, and a second pickup operation of controlling the raising and lowering device to lower multiple of the nozzles simultaneously and controlling the negative pressure supply device to supply negative pressure to the suction openings of those multiple nozzles to pick up the components simultaneously using the suction openings of those multiple nozzles.

A display apparatus comprises a display panel comprising a plurality of driving elements to drive pixels and a first terminal group electrically connected to the driving elements; a supporting member comprising a surface on which the display panel is to be placed and comprising, on the surface, a plurality of wirings and a second terminal group connected to the plurality of wirings; and a holding member provided along an edge of the display panel using a rod-shaped material having a linear or curved shape to hold the display panel at a given position on the surface of the supporting member, wherein the first terminal group is provided on a surface of the display panel to be directed to the supporting member; and the display panel is placed on the surface of the supporting member, and each of terminals constituting the first terminal group is connected to each of terminals constituting the second terminal.

A blade includes an edge to be pressed against an end portion of a carrier film to fold the end portion upwards from a sheet. A clamp mechanism peels the carrier film off from the sheet by moving while clamping the upwardly folded end portion of the carrier film.

Provided is a method for manufacturing an electronic device. The method includes providing a panel to a stage, providing a circuit board, aligning the circuit board so that first pads of the circuit board face a first pad area of the panel and second pads of the circuit board face a second pad area of the panel, and compressing a first portion of the circuit board on which the first pads are arranged to the first pad area of the panel. The aligning of the circuit board occurs via by external contact on one surface of the first portion of the circuit board and one surface of the second portion of the circuit board.

A display apparatus comprises a display panel comprising a plurality of driving elements to drive pixels and a first terminal group electrically connected to the driving elements; a supporting member comprising a surface on which the display panel is to be placed and comprising, on the surface, a plurality of wirings and a second terminal group connected to the plurality of wirings; and a holding member provided along an edge of the display panel using a rod-shaped material having a linear or curved shape to hold the display panel on the surface of the supporting member, wherein the first terminal group is provided on a surface of the display panel to be directed to the supporting member; and the display panel is placed on the surface of the supporting member, and each of terminals constituting the first terminal group is connected to each of terminals constituting the second terminal.

A component fastening system includes a fastener for fastening a first electronic component to a second electronic component and a movable part configured to move the fastener. The fastener includes an arm, a head, and a lock. The arm is connected to the movable part. The head is connected to the arm and contacts the first electronic component. The lock contacts the arm when the first electronic component is moved to a reference space and is spaced apart from the arm when the first electronic component is fastened to the second electronic component.

In one example, a flexible circuit board includes a signal line disposed between a first ground and a second ground; a dielectric disposed between the first ground and the signal line and between the second ground and the signal line; and a flatness improvement portion disposed on an upper portion of the second ground.

A device for inserting a flexible printed circuit board into a connector of a display panel includes: a suction unit configured to adhere to the flexible printed circuit board; a position restriction unit configured to restrict a position of the flexible printed circuit board; and a flexible printed circuit board transfer unit coupled to the suction unit and the position restriction unit, and configured to insert the flexible printed circuit board into the connector. A method of inserting a flexible printed circuit board into a connector of a display panel is also disclosed.

Provided is a method of manufacturing a circuit board involves: preparing a composite laminate including a support, a release layer, and a multilayered circuit board; disposing the composite laminate on a stage such that one face of the composite laminate is put into tight contact with the stage; and releasing the support or the multilayered circuit board from the release layer such that the support or the multilayered circuit board forms a convex face with a curvature radius of 200 to 5000 mm while the face of the composite laminate is kept in tight contact with the stage. The method according to the present invention can prevent the occurrences of defects, for example, breaking in the support and cracking and wire disconnections in the multilayered circuit board in manufacturing of circuit boards, such as coreless circuit boards, and ensure stable release of the support or the multilayered circuit board.