An object stage and a hot pressing apparatus are disclosed. The object stage includes a base (1) and a support device (2) fixed on the base (1), wherein the support device (2) includes a plurality of detachable support sub-devices (21): the support device is configured to allow a printed circuit board (3) with at least one protruding structure (4) to be placed thereon, and no support sub-device (21) is disposed at a position on the support device (2) corresponding to the protruding structure (1). The object stage reduces manufacture cost, saves production time and improves production efficiency.

A screen-printing machine includes a mask holding device; a board holding device configured to grip a board; a positioning device to relatively position the board and the mask; and a control device. The board holding device includes a lifting and lowering table positioned in an up-down direction by a lifting and lowering mechanism, and a backup block including a mounting surface on which the board is placed, an installation surface disposed parallel to the mounting surface on an opposite side thereof, multiple suction holes to penetrate in a thickness direction between the mounting surface and the installation surface, and a chamber recessed section formed on an installation surface side so as to surround positions of the multiple suction holes, and in which an air chamber made by the chamber recessed section is configured when the backup block overlaps an upper face of the lifting and lowering table.

A solder member mounting method includes providing a substrate having bonding pads formed thereon, detecting a pattern interval of the bonding pads, selecting one of solder member attachers having different pattern intervals from each other, such that the one selected solder member attacher of the solder member attachers has a pattern interval corresponding to the detected pattern interval of the bonding pads, and attaching solder members on the bonding pads of the substrate, respectively, using the one selected solder member attacher.

The method for manufacturing a number of electrical nodes, wherein the method includes providing a number of electronic circuits onto a first substrate, such as on a printed circuit board or other electronics substrate, optionally, a low-temperature co-fired ceramic substrate, wherein each one of the electronic circuits includes a circuit pattern and at least one electronics component in connection with the circuit pattern, wherein the electronic circuits are spaced from each other on the first substrate, thereby defining a blank area surrounding each one of the number of electronic circuits, respectively, and providing potting or casting material to embed each one of the number of electronic circuits in the potting or casting material, and, subsequently, hardening, optionally including curing, the potting or casting material to form a filler material layer of the number of electrical nodes.

The present disclosure describes a storage device including a top panel, a bottom panel, a back panel, a front panel, and two side panels configured to form an enclosed volume. The storage device further includes multiple slots disposed at inner surfaces of the two side panels and configured to hold a substrate, a gas diffuser disposed at an inner surface of the back panel and configured to provide a purge gas to the enclosed volume, an isolation gas device disposed on an inner surface of the top panel and adjacent to a top portion of the front panel, and an isolation gas line configured to connect the isolation gas device to the gas diffuser. The isolation gas device is configured to inject the purge gas into a front portion of the storage device and in a direction from the top panel toward the bottom panel.

A device comprises a first circuit member, a second circuit member and a third circuit member. The first circuit member comprises a first body for performing the function of the first circuit member and a first flexible board formed with a first integrated-electrode portion including first electrodes. The second circuit member comprises a second body for performing the function of the second circuit member and a second flexible board formed with a second integrated-electrode portion including second electrodes. The third circuit member comprises a third body for performing the function of the third circuit member and a third flexible board formed with a third integrated-electrode portion including third electrodes. The first integrated-electrode portion, the second integrated-electrode portion and the third integrated-electrode portion lie over each other in an upper-lower direction. The first body, second body and the third body are apart from each other when seen along the upper-lower direction.

In an example, an article of manufacture includes a composite material. The composite material includes hollow glass filaments that are encapsulated within a polymeric matrix material. The hollow glass filaments are at least partially filled with the polymeric matrix material.

The present disclosure describes a storage device including a top panel, a bottom panel, a back panel, a front panel, and two side panels configured to form an enclosed volume. The storage device further includes multiple slots disposed at inner surfaces of the two side panels and configured to hold a substrate, a gas diffuser disposed at an inner surface of the back panel and configured to provide a purge gas to the enclosed volume, an isolation gas device disposed on an inner surface of the top panel and adjacent to a top portion of the front panel, and an isolation gas line configured to connect the isolation gas device to the gas diffuser. The isolation gas device is configured to inject the purge gas into a front portion of the storage device and in a direction from the top panel toward the bottom panel.

An example method of flattening a circuit board assembly includes attaching the circuit board assembly to a structure having dimensions that partly enclose a space, where attachment of the circuit board assembly to the structure creates an air-tight seal over the space, and where the structure has at least one port in fluid communication with the space. The method also includes applying vacuum pressure to the space via the at least one port, where the vacuum pressure forces at least part of the circuit board assembly toward the space, and dispensing thermal interface material selectively onto parts of the circuit board assembly while the vacuum pressure is applied.

A housing has a first positioning hole that penetrates the housing in the vertical direction. A suction cap includes a suction plate part to be sucked by a suction nozzle, and a plurality of positioning protrusion parts, each of which is to be inserted into a first positioning hole of the housing of an input/output board-side connector and a CPU board-side connector in the state where the suction cap holds the input/output board-side connector and the CPU board-side connector. Each positioning protrusion part is inserted into each corresponding first positioning hole in the state where the suction cap holds the input/output board-side connector and the CPU board-side connector, which achieves the positioning of the input/output board-side connector and the CPU board-side connector with respect to the suction cap.