Embodiments of the present invention are directed to an in-situ warpage monitoring system and method for preventing head-in-pillow (HIP) or other potential defect escapes during a solder reflow process. In a non-limiting embodiment of the invention, a product is passed through a reflow oven. The product can include a printed circuit board (PCB). An amount of warpage of the product is measured at one or more monitoring devices positioned along the reflow oven. Each measured amount of warpage is compared to a predetermined warpage limit. The product is sorted into one of a plurality of designated lots based on the comparison. The lots can include a pass lot, a fail lot, and a marginal pass lot.

A bonding apparatus includes a support member configured to support a first substrate of a display panel and a connecting member, a bonding unit located above the support member and configured to compress the first substrate and the connecting member against each other using a bonding head to which a heating member is attached, and a magnetic-field generating part configured to generate a magnetic field to heat the heating member in an electromagnetic induction method.

A structure with an electronic component array positioned between two stacked printed circuit boards (600,606) is disclosed. The electronic components (502) of the array can be connected to the printed circuit board (600,606) by way of solder connections. Example electronic components (502) include capacitors. Related methods of manufacture are disclosed that involve applying heat to a solder paste array on a printed circuit board (600,606) to form solid conductors electrically connected to the electronic components (502).

The present invention relates to an improved system and method for manufacturing flexible circuit boards (FSBs) using optical alignment and various bonding systems. The invention provides an improved process to connect together the layers of rigid-flex, flexible, and printed circuit boards while maintaining alignment of the layers prior to and possibly after a lamination step. An optical alignment system is provided, a preferred arrangement is enabled as an automated pinless bonding system (PBS), for securely gripping, aligning, transferring, and clamping, bonding and moving a bonded FSB employing a multi-axis orientation. An alternative manual optical alignment and bonding system is provided.

The present invention relates to an improved system and method for manufacturing flexible circuit boards (FSBs) using optical alignment and various bonding systems. The invention provides an improved process to connect together the layers of rigid-flex, flexible, and printed circuit boards while maintaining alignment of the layers prior to and possibly after a lamination step. An optical alignment system is provided, a preferred arrangement is enabled as an automated pinless bonding system (PBS), for securely gripping, aligning, transferring, and clamping, bonding and moving a bonded FSB employing a multi-axis orientation. An alternative manual optical alignment and bonding system is provided.

An electronic device includes an injection mold including a mounting part and a wiring groove, a plated wiring plated on the wiring groove, and an electronic element mounted on the mounting part and electrically connected to the plated wiring, wherein the plated wiring is plated on an outer region of the injection mold, and the electronic element mounted on the injection mold dispensed on the plated wiring.

Methods and apparatus for joining a chip with a substrate. The chip is moved by with a pick-and-place machine from a first location to a second location proximate to the substrate over a first time. In response to moving the chip in a motion path from the first location to the second location, a plurality of solder bumps carried on the chip are liquefied over a second time that is less than the first time. While the solder bumps are liquefied, the chip is placed by the pick-and-place machine onto the substrate.

The invention regards a press for soldering multilayer stacks for printed circuits, with an outer muffle that encloses soldering chambers where multilayer stacks are arranged to be heated, inducing a magnetic flux. For such purpose, the press is provided with an inductor having winding form which is arranged on a mobile piston adapted to apply a force on the multilayer stack, such to generate a magnetic flux at its interior that is spatially uniform and regular over time.

Provided is a manufacturing method of an electronic device, including a step of preparing an electronic substrate including a wiring board, an electronic component, and a ground electrode, a first step of forming an insulating layer on the electronic component, and a second step of forming, on the insulating layer and on the ground electrode, an electromagnetic wave shielding layer that covers the insulating layer and is electrically connected to the ground electrode, to obtain an electronic device, in which, in the first step, the insulating layer is formed by applying an ink for an insulating layer and performing an irradiation with active energy ray on the applied ink for an insulating layer, in the second step, the electromagnetic wave shielding layer is formed by applying an ink for an electromagnetic wave shielding layer, containing a metal compound, and a jetting temperature of the ink for an insulating layer is higher than a jetting temperature of the ink for an electromagnetic wave shielding layer by 10? C. to 40? C.

A bonding apparatus includes a support member configured to support a first substrate of a display panel and a connecting member, a bonding unit located above the support member and configured to compress the first substrate and the connecting member against each other using a bonding head to which a heating member is attached, and a magnetic-field generating part configured to generate a magnetic field to heat the heating member in an electromagnetic induction method.