The invention describes a method of manufacturing an LED carrier assembly, which method comprises the steps of providing a carrier comprising a mounting surface with mounting pads arranged to receive a number of LED dies; embedding an alignment magnet in the carrier; providing a number of LED dies, wherein an LED die comprises a number of magnetic die pads; and aligning the magnetic die pads to the mounting pads by arranging the LED dies over the mounting surface of the carrier within magnetic range of the alignment magnet. The invention also describes an LED carrier assembly.

A method and apparatus for implementing customized printed circuit board (PCB) via creation through use of magnetic capture pads. At least one magnetic capture pad is rendered before aqueous seed and plate processing in the PCB manufacture. The magnetic capture pad selectively provides seed material rendering copper in at least one selected region of the via.

A method and apparatus for implementing customized printed circuit board (PCB) via creation through use of magnetic capture pads. At least one magnetic capture pad is rendered before aqueous seed and plate processing in the PCB manufacture. The magnetic capture pad selectively provides seed material rendering copper in at least one selected region of the via.

A self-heating solder flux material includes a solder flux material and a multi-compartment microcapsule. The solder flux material includes a solvent carrier, and the multi-compartment microcapsule includes a first compartment, a second compartment, and an isolating structure. The first compartment contains a first reactant, and the second compartment contains a second reactant. The isolating structure separates the first compartment from the second compartment. The isolating structure is adapted to rupture in response to a stimulus.

A method and apparatus are provided for implementing customized printed circuit board (PCB) via creation through use of magnetic capture pads. At least one magnetic capture pad is rendered before aqueous seed and plate processing in the PCB manufacture. The magnetic capture pad selectively provides seed material rendering copper in at least one selected region of the via.

A self-heating solder flux material includes a solder flux material and a multi-compartment microcapsule. The solder flux material includes a solvent carrier, and the multi-compartment microcapsule includes a first compartment, a second compartment, and an isolating structure. The first compartment contains a first reactant, and the second compartment contains a second reactant. The isolating structure separates the first compartment from the second compartment. The isolating structure is adapted to rupture in response to a stimulus. Rupture of the isolating structure results in an exothermic reaction between the first reactant and the second reactant. The exothermic reaction generates heat to volatilize the solvent carrier.

A processor receives solder paste information, where the solder paste information describes a solder paste used in assembly of a printed circuit board. A processor determines a minimum magnetic force required for removing the solder paste from the printed circuit board based on the solder paste information. A processor receives electromagnet information, where the electromagnet information describes an electromagnet used in cleaning of a misprint of the solder paste on the printed circuit board. A processor determines a minimum amount of power to provide the electromagnet to induce the minimum magnetic force in the electromagnet, where the determination of the amount of power is based on the electromagnet information and the minimum magnetic force. A processor adjusts an amount of power applied to the electromagnet to at least the determined minimum amount of power to clean the misprint of the solder paste from the printed circuit board.

A processor receives solder paste information, where the solder paste information describes a solder paste used in assembly of a printed circuit board. A processor determines a minimum magnetic force required for removing the solder paste from the printed circuit board based on the solder paste information. A processor receives electromagnet information, where the electromagnet information describes an electromagnet used in cleaning of a misprint of the solder paste on the printed circuit board. A processor determines a minimum amount of power to provide the electromagnet to induce the minimum magnetic force in the electromagnet, where the determination of the amount of power is based on the electromagnet information and the minimum magnetic force. A processor adjusts an amount of power applied to the electromagnet to at least the determined minimum amount of power to clean the misprint of the solder paste from the printed circuit board.

An electronic device with a magnetically attached electronic component is described herein. An electronic device includes a housing and an electronic component. The electronic component is positioned within the housing and magnetically attached to an internal surface of the housing via a magnetic force between the electronic component and the internal surface of the housing. During manufacturing, the electronic component can be magnetically attached to the internal surface of the housing by aligning one or more magnetic attachment points of the electronic component within magnetic proximity to one or more corresponding magnetic attachment points of the internal surface of the housing of the electronic device to magnetically attach the electronic component to the internal surface of the housing.

A variable stiffness film, a variable stiffness flexible display, and a manufacturing method thereof may include a lower electrode, a variable fluid, and an upper electrode. A polymer layer may be formed on the lower electrode, and a variable fluid receiving portion is patterned on the polymer layer. A variable stiffness layer is formed by putting a variable fluid in the variable fluid receiving portion. The upper electrode is formed on the variable fluid layer.