Disclosed is a battery pack, which includes a plurality of stacked cells; a board assembly including interconnect circuit boards (ICBs) arranged corresponding to cell leads; an ICB cover detachably coupled to the board assembly; and a magnet installed at the ICB cover and coupled to the ICB by a magnetic force thereof with the cell lead being interposed therebetween, wherein the lead is closely fixed to the ICB by means of the magnetic force acting between the ICB and the magnet.

A self-heating solder flux material includes a solder flux material and a multi-compartment microcapsule. The solder flux material includes a solvent carrier, and the multi-compartment microcapsule includes a first compartment, a second compartment, and an isolating structure. The first compartment contains a first reactant, and the second compartment contains a second reactant. The isolating structure separates the first compartment from the second compartment. The isolating structure is adapted to rupture in response to a stimulus. Rupture of the isolating structure results in an exothermic reaction between the first reactant and the second reactant. The exothermic reaction generates heat to volatilize the solvent carrier

A conveyor system for a stencil printer includes a pair of rail members, with the pair of rail members extending through a frame and configured to transport the substrate through the stencil printer. The conveyor system further includes, for each rail member, a lift tool assembly coupled to the rail member. The lift tool assembly includes a lifter portion, a main plate secured to the lifter portion, and a clamping member coupled to the main plate. The clamping member is configured to move horizontally between a substrate engaged position and a substrate disengaged position. The lift tool assembly further includes a thin foil coupled to the main plate. The thin foil is configured to move vertically and horizontally, independent from the clamping member.

A conveyor system for a stencil printer includes a pair of rail members extending through a frame and configured to transport the substrate through the stencil printer. A lift tool assembly is configured to support the substrate at a transport height and a print height. The lift tool assembly includes a lifter portion configured to be engaged by a support of the lift table assembly. A foot of the lifter portion has at least two permanent magnets configured to secure the foot of the lifter portion to the support when engaging the support to the lifter portion, and at least one vacuum pocket formed in a bottom surface of the foot of the lifter portion. The vacuum pocket is configured to selectively secure the lifter portion in place on the support.

A processor receives solder paste information, where the solder paste information describes a solder paste used in assembly of a printed circuit board. A processor determines a minimum magnetic force required for removing the solder paste from the printed circuit board based on the solder paste information. A processor receives electromagnet information, where the electromagnet information describes an electromagnet used in cleaning of a misprint of the solder paste on the printed circuit board. A processor determines a minimum amount of power to provide the electromagnet to induce the minimum magnetic force in the electromagnet, where the determination of the amount of power is based on the electromagnet information and the minimum magnetic force. A processor adjusts an amount of power applied to the electromagnet to at least the determined minimum amount of power to clean the misprint of the solder paste from the printed circuit board.

Components may have substrates with metal traces that form mating contacts. The components may be bonded together using anisotropic conductive adhesive bonding techniques. During bonding, conductive particles may be concentrated over the contacts by application of magnetic or electric fields or by using a template transfer process. Gaps between the contacts may be at least partially free of conductive particles to help isolate adjacent contacts. Polymer between the substrates may attach the substrates together. The conductive particles may be embedded in the polymer and crushed or melted to short opposing contacts together.

Components may have substrates with metal traces that form mating contacts. The components may be bonded together using anisotropic conductive adhesive bonding techniques. During bonding, conductive particles may be concentrated over the contacts by application of magnetic or electric fields or by using a template transfer process. Gaps between the contacts may be at least partially free of conductive particles to help isolate adjacent contacts. Polymer between the substrates may attach the substrates together. The conductive particles may be embedded in the polymer and crushed or melted to short opposing contacts together.

Examples are disclosed that relate to magnetically aligned switching circuits. One disclosed example provides an electronic component comprising a first terminal, a second terminal, and a deformable host material arranged between the first terminal and the second terminal. Aligned magnetically within the host material is an ensemble of particles each comprising a ferromagnetic material, each particle having greater electrical conductivity than the host material. The ensemble of particles is configured to form at least one complete conduction path from the first terminal to the second terminal.

Various embodiments of the teachings herein include a method of establishing a solder bond between a first solder partner and a second solder partner with a solder medium including a metallic solder material and a multitude of magnetic nanoparticles. An example method includes: a) generating a magnetic alternating field with a magnet coil acting on the solder medium; b) heating the magnetic nanoparticles via the interaction with the magnetic alternating field; and c) melting the metallic solder material owing to heat transfer from the magnetic nanoparticles to the metallic solder material and thereby forming the solder bond between the first solder partner and the second solder partner with molten metallic solder material.

There is provided a method for manufacturing a substrate with a sensor in which a sensor is disposed on a plate-shaped substrate. The method comprises: holding the sensor by a magnetic force from a position on an opposite surface of a surface of the plate-shaped substrate on which the sensor is disposed that corresponds to a position where the sensor is fixed; and fixing the sensor to the plate-shaped substrate by curing an adhesive attached to the sensor in a state where the sensor is held by the magnetic force.