The invention relates to an element in the shape of a sensor, an active electronic component, a switch, a circuit, or an electric conducting path for integration into a surrounding medium. The element is penetrable by the surrounding medium and has a porous, non-conductive substrate and at least one circuit trace made of conductive material present on the substrate. The openings of the substrate are open in an area of the circuit trace. The use and manufacture of the element are also provided.

A component carrier includes an electrically insulating layer structure having a first main surface and a second main surface with a through hole extending through the electrically insulating layer structure between the first main surface and the second main surface. An electrically conductive bridge structure connects opposing sidewalls of the electrically insulating layer structure delimiting the through hole. A vertical thickness of the electrically insulating layer structure is not more than 200 μm and a narrowest vertical thickness of the bridge structure is at least 20 μm.

Prepregs having a UV curable resin layer located adjacent to a first thermally curable resin layer or sandwiched between first and second thermally curable resin layers wherein the UV curable resin layer is uncured or partially cured as well as methods for preparing laminates using the prepregs wherein the laminate includes at least one UV curable resin encapsulated electrical component.

A system for providing selective adhesion printed circuit board (PCB) production comprises a conveyor mechanism, a curing system, and a computer. The conveyor mechanism is configured to convey a series of selective adhesion blanks, wherein each selective adhesion blank is utilized to produce a PCB and includes a flexible film, a substrate, a conductive layer, and a curable adhesive. The conductive layer is formed from electrically conductive material and adhered to the substrate. The curable adhesive is positioned between the flexible film and the conductive layer and is configured to selectively bond with the conductive layer when the curable adhesive is cured. The curing system is configured to cure the curable adhesive. The computer includes a processing element configured or programmed to: receive a plurality of PCB designs, and direct the curing system to cure the curable adhesive of a plurality of selective adhesion blanks for each PCB design.

A laser processing method according to a viewpoint of the present disclosure includes radiating ultraviolet pulse laser light onto a workpiece having a stacked structure in which a conductor layer, an insulating layer, and a sacrificial layer are stacked on each other in the presented order, the pulse laser light radiated from the side facing the sacrificial layer, to change a laser ablation processing mode in the sacrificial layer and form a through hole in the sacrificial layer, radiating the pulse laser light onto the insulating layer through the through hole to form an opening in the insulating layer, and removing the sacrificial layer after the formation of the opening.

A printed circuit board structure is disclosed for providing reliable solderability for higher density component placement. The printed circuit board structure includes conductive points disposed on the surface of a printed circuit board which are separated by a channel disposed in the surface of the printed circuit board between the conductive points. The conductive points may be surface mount component terminal pads. The printed circuit board structure is particularly useful for overcoming component density limitations related to extremely miniaturized surface mount components known in the art.

Pattern transfer sheets and methods are provided for printing paste patterns (e.g., thin fingers) with a high aspect ratio and for increasing throughput in pattern transfer printing. Trenches in the pattern transfer sheets, that are configured to be filled with printing paste and to enable releasing the printing paste from the trenches onto a receiving substrate upon illumination by a laser beam—are coated internally by a coating configured to disintegrate upon the illumination. The coating is configured to enhance the releasing of the paste—increasing throughput and printing accuracy. The receiving substrate may be cleaned after paste deposition by removing disintegration products of the coating therefrom. Alternatively or complementarily, laser absorbing dye may be mixed into the printing paste to facilitate its release from the trenches.

A method for manufacturing a wiring substrate includes forming a resin insulating layer on a first conductor layer such that the resin insulating layer covers the first conductor layer, applying a roughening treatment on a surface of the resin insulating layer on the opposite side with respect to the first conductor layer, forming an opening in the resin insulating layer after the roughening treatment on the surface of the resin insulating layer such that the opening penetrates through the resin insulating layer and exposes a portion of the first conductor layer, and forming a second conductor layer on the surface of the resin insulating layer such that the second conductor layer is formed in contact with the surface of the resin insulating layer and that a via conductor is formed in the opening of the resin insulating layer.

A circuit board is formed from a catalytic laminate having a resin rich surface with catalytic particles dispersed below a surface exclusion depth. Trace channels and apertures are formed into the catalytic laminate, electroless plated with a metal such as copper, filled with a conductive paste containing metallic particles, which are then melted to form traces. In a variation, multiple circuit board layers have channels formed into the surface below the exclusion depth, apertures formed, are electroless plated, and the channels and apertures filled with metal particles. Several such catalytic laminate layers are placed together and pressed together under elevated temperature until the catalytic laminate layers laminate together and metal particles form into traces for a multi-layer circuit board.

A method for forming a circuit board having a dielectric core, a foil top surface, and a thin foil bottom surface with a removable foil backing of sufficient thickness to absorb heat from a laser drilling operation to prevent the penetration of the thin foil bottom surface during laser drilling utilizes a sequence of steps including a laser drilling step, removing the foil backing step, electroless plating step, patterned resist step, electroplating step, resist strip step, tin plate step, and copper etch step, which provide dot vias of fine linewidth and resolution.